Abstract: An interconnecting wire of aluminum alloy for semiconductor devices which as improved ball-forming performance in the ball-bonding process, without any loss of conductivity and corrosion resistance. There is also provided an interconnecting wire for semiconductor devices which is lowered in resistance, with a minimum loss of conductivity and without any adverse effect on the bonding performance. The interconnecting wire contains about 0.1 to 45 wt % of an element having a melting point lower than about 450.degree. C., with the balance being substantially aluminum, or contains about 0.1 to 45 wt % of one more elements having a melting point lower than about 450.degree. C. and about 0.2 to 2 wt % of one or more elements selected from the group consisting of silicon, magnesium, manganese, and copper, with the balance being substantially aluminum.

Abstract: Operation information is stored in a memory for numerically controlling a numerical control machine such as a machining tool. This information is displayed on a desired display, and an item of operation information is selected from the operation information displayed, so that the numerical control machine can be controlled in accordance with a predetermined program. Thus, a desired arbitrary item of operation information can be selected using a single machine operator's panel.

Abstract: A method of making Ag, Au or Cu thin alloy wire comprises a first step of melting alloy containing Be with 0.001 through 1% by weight, a second step of jetting the melted alloy into a thin wire configuration through a small opening and a third step of curing the jetted alloy of a wire configuration in a fluid so that a thin alloy wire having about 0.01 through 0.2 mm diameter with simple processes and high yield.

Abstract: A wire electrode for use in electro-discharge machining is formed essentially of Cu, including Zn of 5 through 38% by weight and Si of 0.1 through 0.5% by weight so as to suppress sputtering of the electrode material to the workpiece and to improve workability. The wire electrode may include Zn of 30 through 40% by weight, Si of 0.1 through 1.2% by weight and Al of 0.01 through 0.2% by weight in addition to Cu.

Abstract: A method of manufacturing a nickel-titanium-beryllium alloy wire, comprising the steps of preparing a nickel-titanium alloy consisting essentially of nickel (Ni) 50 to 40% by weight and titanium (Ti) 40 to 50% by weight, with a portion of either the Ni or Ti being replaced by from 0.005 to 0.5% beryllium (Be), brining the nickel-titanium-beryllium alloy to a molten state, and jetting a melt of the alloy into a liquid flow, formed as a laminar flow, on the internal surface of a rotating drum so as to cool and solidify the nickel-titanium-beryllium alloy from its molten state into a fine wire at an average cooling rate in the range of 10.sup.2 to 10.sup.4 C/sec.

Abstract: A numerical control apparatus having a numerical control unit (11), a data input/output circuit for sending and receiving data between a machine (19) and the numerical control unit, a data input unit (13) for entering NC data, a manual data input unit (16) for entering NC data manually, and an operator's pendant (17), wherein there is provided a local control circuit (101), separate from the numerical control unit, for centrally controlling the data input unit, the manual data input unit and the operator's pendant. The local control circuit is connected to the numerical control unit directly through a data transfer line, or through the data input/output circuit.

Abstract: The present invention is to increase the reliability of a numerical controller by permitting the detection of an abnormality in a position sensing pulse which is output each time a moving part moves by a fixed amount.A position sensor (6) outputs a reference position sensing pulse each time a moving part reaches a predetermined position, and a direction discriminating circuit (7) outputs a position sensing pulse each time the moving part moves by a fixed amount. A reversible counter (8) counts the position sensing pulse from the direction discriminating circuit (7), and abnormality detecting circuits (9) and (10) detect an abnormality in the position sensing pulse on the basis of the count value of the reversible counter (8) and the generating timing of generation of the reference position sensing pulse.

Abstract: Improved insulation piercing wire connectors are proposed which are provided with a plurality of prongs on the edges of a wire barrel, said prongs having their top tapering up toward the front for better mechanical and electrical connection.

Abstract: Soft copper alloy conductors having a 0.2% proof stress of 12 kg/mm.sup.2 or less which contains 5-200 p.p.m. of calcium, the balance substantially consisting of copper, and hot-dip coated copper alloy conductors made by coating the surface of copper alloy conductors of said composition with tin or lead or their alloy by hot-dipping, and a method of manufacturing said copper alloy conductors.

Abstract: A process and apparatus for electrolytic etching of aluminum or its alloy is disclosed wherein an electric current is passed between an anode and a cathode which are spaced opposed in an electrolytic bath with a workpiece removably supported on an insulating frame so that the side of the workpiece to be etched faces the cathode, the insulating frame being disposed between the anode and the cathode and having at least one opening formed therein.

Abstract: Soft copper alloy conductors having a 0.2% proof stress of 12 kg/mm.sup.2 or less which contains 5-200 p.p.m. of calcium, the balance substantially consisting of copper, and hot-dip coated copper alloy conductors made by coating the surface of copper alloy conductors of said composition with tin or lead or their alloy by hot-dipping, and a method of manufacturing said copper alloy conductors.

Abstract: A process and apparatus for electrolytic etching of aluminum or its alloy is disclosed wherein an electric current is passed between an anode and a cathode which are spaced opposed in an electrolytic bath with a workpiece removably supported on an insulating frame so that the side of the workpiece to be etched faces the cathode, the insulating frame being disposed between the anode and the cathode and having at least one opening formed therein.