Abstract: The present invention relates to a production process of polyphenylene ether composition comprising (A-1) a polyphenylene ether, (A-2) a polystyrene, (A-3) an ester phosphate, (B) a hindered amine light stabilizer, and (C) an ultraviolet absorber. The feature of the present invention is melt compounding a part of raw materials to obtain a pre-mixture at Step 1, and melt compounding the pre-mixture and the rest of the raw materials at Step 2. A polyphenylene ether composition which has a good light-discoloration resistance and causes little unmelted portion, and to a molded article formed from the polyphenylene ether composition can be obtained according to the production process of the present invention.

Abstract: A multilayer printed wiring board having a wiring lead-out port has a signal circuit conductor perfectly covered by an earth circuit in its inside and a wiring lead-out port. A signal circuit conductor having a branch pattern is preferable. A large number of products can be easily manufactured with good size reproducibility. The multilayer printed wiring board is manufactured by selectively etching the copper of a cladding sheet manufactured by bonding a copper foil to a nickel foil with 0.1-3% reduction and forming a signal circuit conductor covered by an earth circuit and the wiring lead-out port.

Abstract: A variable compression ratio device includes a piston having a piston inner part and a piston outer part. The piston outer part integrally includes ear parts facing opposite ends of a piston pin and having long holes with longer diameters directed in an axial direction of a piston. A shaft portion connected to the opposite ends of the piston pin is slidably fitted in the long holes to allow an axial relative movement between the piston inner part and the piston outer part, while preventing relative rotation between the piston inner part and the piston outer part. Thus, the variable compression ratio device reliably prevents the relative rotation between the piston inner part and the piston outer part with a simple structure, and reduces weight of the piston.

Abstract: A variable compression ratio device of an internal combustion engine includes a piston inner part connected to a connecting rod and a piston outer part fitted on an outer periphery of the piston inner part. The piston outer part is only slidably in an axial direction, and is movable between a low compression ratio position near the piston inner part and a high compression ratio position near the combustion chamber. A skirt part is slidable and is guided by an inner peripheral surface of a cylinder bore of an engine. The skirt part is integrally formed on the piston inner part. A peripheral wall of the piston outer part is terminated directly above the skirt part. Thus, switching of the position between the low compression ratio position and the high compression ratio position by an inertia force of the piston outer part is performed smoothly with a reduction in weight of the piston.

Abstract: The invention relates to: a process for producing a poly(phenylene ether) resin composition which comprises (A) a poly(phenylene ether) and (B) a styrene resin and in which the styrene resin (B) is a styrene resin comprising a rubber-modified polystyrene containing a polybutadiene having 90% or higher cis-1,4 bonds, the process comprising a first step in which the poly(phenylene ether) (A) is melt-kneaded together with (B1) part or all of the styrene resin which does not include any rubber-modified polystyrene containing an unhydrogenated polybutadiene and a subsequent second step in which the remaining styrene resin including (B2) a rubber-modified polystyrene containing a polybutadiene having 90% or higher cis-1,4 bonds is melt-kneaded; and a poly(phenylene ether) resin composition obtained by the process.

Abstract: A method of efficiently and inexpensively fabricating a chip-size package having an electrode pitch expanded by forming a conductor wiring on the electrode forming surface side of a semiconductor chip, especially, a method for facilitating wiring and bump forming. A semiconductor device comprising a semi-conductor elements and conductor wirings formed on the semiconductor elements by etching wiring-forming metal foil; and a fabrication method for a semiconductor device comprising the steps of laminating wiring forming metal foil on the electrode forming surface side on the semiconductor, forming a resist wiring pattern on the metal foil, etching the metal foil, and slicing the device into individual elements.

Abstract: An adhesive-free multilayered metal laminate having a given thickness which is obtained by bonding a metal sheet having a thin metal film on a surface thereof to a metal foil without using an adhesive; and a process for continuously producing the laminate. The process comprises the steps of; setting a metal sheet on a reel for metal sheet unwinding; setting a metal foil on a reel for metal foil unwinding; unwinding the metal sheet from the metal sheet-unwinding reel and activating a surface of the metal sheet to thereby form a first thin metal film on the metal sheet surface; unwinding the metal foil from the metal foil-unwinding reel and activating a surface of the metal foil to thereby form a second thin metal film on the metal foil surface; and press-bonding the activated surface of the first thin metal film to that of the second thin metal film so that the first thin metal film formed on the metal sheet is in contact with the second thin metal film formed on the metal foil.

Abstract: An adhesive-free multilayered metal laminate having a given thickness which is obtained by bonding a metal sheet having a thin metal film on a surface thereof to a metal foil without using an adhesive; and a process for continuously producing the laminate. The process comprises the steps of; setting a metal sheet on a reel for metal sheet unwinding; setting a metal foil on a reel for metal foil unwinding; unwinding the metal sheet from the metal sheet-unwinding reel and activating a surface of the metal sheet to thereby form a first thin metal film on the metal sheet surface; unwinding the metal foil from the metal foil-unwinding reel and activating a surface of the metal foil to thereby form a second thin metal film on the metal foil surface; and press-bonding the activated surface of the first thin metal film to that of the second thin metal film so that the first thin metal film formed on the metal sheet is in contact with the second thin metal film formed on the metal foil.

Abstract: A method for manufacturing a gas separating unit which comprises laminating a metal plate on a material capable of separating a hydrogen gas (palladium alloy foil) by cladding, etching selectively a central portion of a cut clad plate (K) using an etching solution, to thereby expose an underlying palladium alloy foil layer, and providing a metal supporting plate on the other side of the palladium alloy foil layer. The method allows the manufacture of a gas separating unit having an enhanced effective area of a material capable of separating a hydrogen gas and is excellent in the handlability of a material capable of separating a hydrogen gas during manufacturing.

Abstract: A clad plate for forming an interposer for a semiconductor device which can be manufactured at low cost and has good characteristics, an interposer for a semiconductor device, and a method of manufacturing them. Copper foil materials (19, 24, 33) forming conductive layers (10, 17, 18) and nickel plating (20, 21) forming etching stopper layers (11, 12) are formed and pressed to form a clad plate (34) for forming an interposer for a semiconductor device. Thus, a clad plate (34) for forming an interposer for a semiconductor device is manufactured. The clad plate (34) is selectively etched to form a columnar conductor (17), and an insulating layer (13) is formed on the copper foil material forming a wiring layer (10). A bump (18) for connection of a semiconductor chip and the wiring layer (10) are formed on the opposite side to the side on which the columnar conductor (17) is formed. Thus, an interposer for a semiconductor device is manufactured.

Abstract: A multilayer printed wiring board having a wiring lead-out port has a signal circuit conductor perfectly covered by an earth circuit in its inside and a wiring lead-out port. A signal circuit conductor having a branch pattern is preferable. A large number of products can be easily manufactured with good size reproducibility. The multilayer printed wiring board is manufactured by selectively etching the copper of a cladding sheet manufactured by bonding a copper foil to a nickel foil with 0.1-3 % reduction and forming a signal circuit conductor covered by an earth circuit and the wiring lead-out port.

Abstract: A laminated plate formed of a base material and a high molecular plate laminated with each other without using adhesive agent and a part using the laminated plate, wherein the laminated plate is formed by laminatedly sticking the base plate to the high molecular plate after applying an activating treatment onto the opposed surfaces of the base plate and the high molecular plate, and the part is formed by using the laminated plate.

Abstract: A Rankine cycle system includes a first Rankine cycle (2A) operated by a first working medium and a second Rankine cycle (2B) operated by a second working medium. The first Rankine cycle (2A) is constituted from an evaporator (3A), an expander (4), a condenser (5A) and a supply pump (6A), and the second Rankine cycle (2B) is constituted from an evaporator (3B), the expander (4), a condenser (5B) and a supply pump (6c). The evaporator (3A) in the first Rankine cycle (2A) and the evaporator (3B) in the second Rankine cycle (2B) are disposed at locations upstream and downstream of an exhaust emission control device (8) mounted in an exhaust passage (7) for the internal combustion engine (1). The first working medium has a boiling point higher than that of the second working medium, and the capacity of the pump (6A) in at least the first Rankine cycle (2A) is variable.

Abstract: An electronic circuit device capable of providing a stable electrical connection between an electronic component chip and a connecting multi-layer substrate, and being downsized at high density; and a production method therefor. An electronic component chip (1) and a connecting multi-layer substrate (2) or electronic component chips are heated in an inactive atmosphere such as argon or a reducing atmosphere such as hydrogen and pressure-welded to each other with or without an intermediary of an interposer (6), or their joint surfaces are activated and then pressure-welded at room temperature or by heating, thereby producing an electronic circuit device (40) by directly and metallurgically joining them by using any one of the above methods.

Abstract: A method for manufacturing a gas separating unit which comprises laminating a metal plate on a material capable separating a hydrogen gas (palladium alloy foil) by cladding, etching selectively a central portion of a cut clad plate (K) using an etching solution, to thereby expose an underlying palladium alloy foil layer, and providing a metal supporting plate on the other side of the palladium alloy foil layer. The method allows the manufacture of a gas separating unit having an enhanced effective area of a material capable of separating a hydrogen gas and is excellent in the handlability of a material capable of separating a hydrogen gas during manufacturing.

Abstract: A means for highly precisely and economically fabricating wiring on a semiconductor and highly precisely and economically forming a bump on an electrodes. (1) A semiconductor device comprising a semiconductor, a metal foil for fabricating wiring and conductor wiring on the semiconductor, and a method of fabricating a conductor wiring circuit on a semiconductor, comprising the steps of laying a metal foil for fabricating wiring on the electrode-forming side of the semiconductor, forming a resist wiring pattern by photo-etching the metal foil, etching the metal foil, and removing the resist to form the wiring.

Abstract: A clad plate for forming an interposer for a semiconductor device which can be manufactured at low cost and has good characteristics, an interposer for a semiconductor device, and a method of manufacturing them. Copper foil materials (19, 24, 33) forming conductive layers (10, 17, 18) and nickel plating (20, 21) forming etching stopper layers (11, 12) are formed and pressed to form a clad plate (34) for forming an interposer for a semiconductor device. Thus, a clad plate (34) for forming an interposer for a semiconductor device is manufactured. The clad plate (34) is selectively etched to form a columnar conductor (17), and an insulating layer (13) is formed on the copper foil material forming a wiring layer (10). A bump (18) for connection of a semiconductor chip and the wiring layer (10) are formed on the opposite side to the side on which the columnar conductor (17) is formed. Thus, an interposer for a semiconductor device is manufactured.

Abstract: The resin composition of the present invention comprises (A) a resin composition comprising a polyphenylene ether resin or a polyphenylene ether resin and a polystyrene resin and (B) a phosphazene compound having an acid value of less than 0.5. This resin composition contains no halogen compounds and hence is environmentally preferred, and furthermore is excellent in electrical characteristics, heat resistance and mechanical properties, causes substantially no problems such as smoking during injection molding and desposition of flame-retardants on the mold, and has high flame retardancy.

Abstract: A polyphenylene ether composition comprising: 100 parts by weight of (A) a polyphenylene ether resin or a combination of a polyphenylene ether resin and a styrene resin; 1 to 40 parts by weight of (B) a flame retardant which is comprised mainly of at least one member selected from the group consisting of two specific condensed phosphoric esters; 0.3 to 10 parts by weight of (C) a hydrogenated block copolymer which is defined as a hydrogenation product of a block copolymer comprising a polymerized styrene block and a polymerized conjugated diene block, wherein at least one polymerized styrene block has a number average molecular weight of 15,000 or more; and 0.3 to 10 parts by weight of (D) a polyolefin resin, wherein the weight ratio of the component (C) to the component (D) is from 70/30 to 15/85.

Abstract: A high polymer plate and conductive plate connecting body formed by connecting a high polymer plate to a conductive plate without using an adhesive agent and a part using the high polymer plate and conductive plate connecting body; the connecting body, wherein the faces of the high polymer plate and the conductive plate opposed to each other are connected to each other after the plates receive an activation under an extremely low pressure; a part.