Patents by Inventor Kazushi Ichikawa
Kazushi Ichikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11986134Abstract: To dispense a predetermined length of a sheet hygienically. In a sheet dispensing device, a sheet feeding mechanism feeds out a predetermined length for use of a sheet from a sheet dispensing port, and at this time, a part, of the sheet, located upstream of the sheet dispensing port in terms of a feeding direction of the sheet is held by a driving roller and a driven roller. The driven roller is biased by leaf springs to be pressed toward the driving roller. Consequently, the sheet is dispensed while hanging down from the sheet dispensing port. When a user pulls down the hanging sheet while holding it, the sheet is cut from the vicinity of a held part, so that the user can take the predetermined length for use of the sheet hygienically.Type: GrantFiled: August 19, 2019Date of Patent: May 21, 2024Assignee: MATSUO INDUSTRIES, INC.Inventors: Motoi Matsuo, Yuji Sekitomi, Mikiya Ichikawa, Kazushi Akutsu, Noriyuki Heike
-
Publication number: 20230280554Abstract: An opto-electric hybrid board for an optical communication module in which an electric circuit part E including a pad for mounting an optical element, a pad for an optical element driving device, and an electrical interconnect line Y including an interconnect line portion A connecting the pads is provided on a first surface side of an insulative layer, and in which an optical waveguide W is on a second surface side of the insulative layer. A portion of a coverlay covering the electric circuit part E which overlaps the interconnect line portion A is removed to form an opening. The interconnect line portion A exposed through the opening is used as a terminal for a burn-in test of an optical element.Type: ApplicationFiled: July 2, 2021Publication date: September 7, 2023Applicant: NITTO DENKO CORPORATIONInventors: Tadao Okawa, Takashi Oda, Masataka Yamaji, Kazushi Ichikawa
-
Publication number: 20230258893Abstract: In an opto-electric hybrid board, an electric circuit part E is provided on a first surface side of an insulative layer, and includes pads for mounting an optical element, pads for a driving device for the optical element, and electrical interconnect lines Y including interconnect line portions A connecting the pads. A metal reinforcement layer and an optical waveguide W partially overlapping the metal reinforcement layer are provided on a second surface side of the insulative layer. A portion of the metal reinforcement layer which faces the interconnect line portions A on the opposite side of the insulative layer therefrom is removed to form an opening. This opto-electric hybrid board is capable of transmitting higher-frequency electric signals because the influence of the metal reinforcement layer on electrical properties is suppressed.Type: ApplicationFiled: July 14, 2021Publication date: August 17, 2023Applicant: NITTO DENKO CORPORATIONInventors: Tadao Okawa, Takashi Oda, Masataka Yamaji, Kazushi Ichikawa
-
Publication number: 20230254973Abstract: An optical communication module substrate includes a wiring board and an opto-electronic hybrid substrate, the wiring board and the opto-electronic hybrid substrate being connected to each other, in which a connection terminal of the wiring board and a connection terminal of the opto-electronic hybrid substrate are electrical connection points, and a frame-shaped removal portion is formed by removing a portion of the metal reinforcing layer of the opto-electronic hybrid substrate that faces the connection terminal with the insulating layer interposed between the metal reinforcing layer and the connection terminal, so as to surround each terminal. According to this configuration, the connection strength at the connection point between the wiring board and the opto-electronic hybrid substrate is sufficiently ensured, and the optical communication module substrate has excellent electrical properties that are compatible with high-speed signal transmission.Type: ApplicationFiled: June 21, 2021Publication date: August 10, 2023Applicant: NITTO DENKO CORPORATIONInventors: Tadao Okawa, Takashi Oda, Masataka Yamaji, Kazushi Ichikawa
-
Publication number: 20220295626Abstract: A wireless power supply wiring circuit board includes a first insulating layer, a conductive layer that is on one surface in the thickness direction of the first insulating layer and includes a wiring portion, a transceiver circuit portion that is electrically connected to the wiring portion, a component mounting portion which is on the other surface in the thickness direction of the first insulating layer and on which an electronic component electrically connected to the wiring portion is mounted, and a metal dam portion provided around at least part of the component mounting portion.Type: ApplicationFiled: February 23, 2022Publication date: September 15, 2022Applicant: NITTO DENKO CORPORATIONInventors: Hisashi TSUDA, Kazushi ICHIKAWA, Takashi SASAKI, Masafumi SUZUKI
-
Publication number: 20220294266Abstract: A wireless power supply wiring circuit board includes an insulating layer, a first wiring portion which is provided on one surface side in the thickness direction of the insulating layer, a first region including a second wiring portion which is provided on the other side in the thickness direction of the insulating layer, a second region in which the first wiring portion and the second wiring portion are provided on the same flat plane, a transceiver circuit portion, and a component mounting circuit portion which is electrically connected to the transceiver circuit portion.Type: ApplicationFiled: February 28, 2022Publication date: September 15, 2022Applicant: NITTO DENKO CORPORATIONInventors: Hisashi TSUDA, Kazushi ICHIKAWA, Takashi SASAKI, Masafumi SUZUKI
-
Patent number: 11369024Abstract: In a method for producing a wiring circuit board, a conductive pattern is formed using a plating resist formed by photolithography for sequentially moving one photomask in a first direction with respect to a dry film resist to be exposed a plurality of times. The conductive pattern has a conductive intermediate portion which is inclined. The one photomask has a third photo pattern. The third photo pattern includes a first photoline pattern and a second photo line pattern. A first portion of the first photoline pattern coincides with a second portion of the second photoline pattern when projected in the first direction.Type: GrantFiled: November 5, 2020Date of Patent: June 21, 2022Assignee: NITTO DENKO CORPORATIONInventors: Takahiro Takano, Kazushi Ichikawa
-
Publication number: 20210144859Abstract: In a method for producing a wiring circuit board, a conductive pattern is formed using a plating resist formed by photolithography for sequentially moving one photomask in a first direction with respect to a dry film resist to be exposed a plurality of times. The conductive pattern has a conductive intermediate portion which is inclined. The one photomask has a third photo pattern. The third photo pattern includes a first photoline pattern and a second photo line pattern. A first portion of the first photoline pattern coincides with a second portion of the second photoline pattern when projected in the first direction.Type: ApplicationFiled: November 5, 2020Publication date: May 13, 2021Applicant: NITTO DENKO CORPORATIONInventors: Takahiro TAKANO, Kazushi ICHIKAWA
-
Patent number: 7971353Abstract: A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component 21 and criterion marks 8 to determine presence or absence of an inhibitory portion 23 that may be formed due to formation of an insulating cover layer 4 to inhibit connection between the terminal portions 6 and the external terminals 22 are formed on the insulating base layer 2 simultaneously, the insulating cover layer 4 to cover the conductive pattern 3 and an opening 7 from which the terminal portions 6 and the criterion marks 8 are exposed is formed. Thereafter, the presence or absence of the inhibitory portion 23 is determined with reference to the criterion marks 8 exposed from the opening 7 of the insulating cover layer 4.Type: GrantFiled: February 7, 2008Date of Patent: July 5, 2011Assignee: Nitto Denko CorporationInventors: Yuichi Takayoshi, Kazushi Ichikawa, Toshiki Naito
-
Patent number: 7629540Abstract: A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component 21 and criterion marks 8 to determine presence or absence of an inhibitory portion 23 that may be formed due to formation of an insulating cover layer 4 to inhibit connection between the terminal portions 6 and the external terminals 22 are formed on the insulating base layer 2 simultaneously, the insulating cover layer 4 to cover the conductive pattern 3 and an opening 7 from which the terminal portions 6 and the criterion marks 8 are exposed is formed. Thereafter, the presence or absence of the inhibitory portion 23 is determined with reference to the criterion marks 8 exposed from the opening 7 of the insulating cover layer 4.Type: GrantFiled: February 7, 2008Date of Patent: December 8, 2009Assignee: Nitto Denko CorporationInventors: Yuichi Takayoshi, Kazushi Ichikawa, Toshiki Naito
-
Publication number: 20090025963Abstract: A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component 21 and criterion marks 8 to determine presence or absence of an inhibitory portion 23 that may be formed due to formation of an insulating cover layer 4 to inhibit connection between the terminal portions 6 and the external terminals 22 are formed on the insulating base layer 2 simultaneously, the insulating cover layer 4 to cover the conductive pattern 3 and an opening 7 from which the terminal portions 6 and the criterion marks 8 are exposed is formed. Thereafter, the presence or absence of the inhibitory portion 23 is determined with reference to the criterion marks 8 exposed from the opening 7 of the insulating cover layer 4.Type: ApplicationFiled: February 7, 2008Publication date: January 29, 2009Applicant: Nitto Denko CorporationInventors: Yuichi Takayoshi, Kazushi Ichikawa, Toshiki Naito
-
Publication number: 20090025212Abstract: A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component 21 and criterion marks 8 to determine presence or absence of an inhibitory portion 23 that may be formed due to formation of an insulating cover layer 4 to inhibit connection between the terminal portions 6 and the external terminals 22 are formed on the insulating base layer 2 simultaneously, the insulating cover layer 4 to cover the conductive pattern 3 and an opening 7 from which the terminal portions 6 and the criterion marks 8 are exposed is formed. Thereafter, the presence or absence of the inhibitory portion 23 is determined with reference to the criterion marks 8 exposed from the opening 7 of the insulating cover layer 4.Type: ApplicationFiled: February 7, 2008Publication date: January 29, 2009Applicant: Nitto Denko CorporationInventors: Yuichi Takayoshi, Kazushi Ichikawa, Toshiki Naito
-
Patent number: 7407386Abstract: A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer, and an insulating cover layer formed on the insulating base layer for covering the conductive pattern. The conductive pattern includes terminal portions for connecting with external terminals. The insulating cover layer has an opening formed correspondingly for the respective terminal portions. A position determining zone for determining whether or not a margin of the insulating cover layer facing the opening is located in a proper position is provided in proximity of the terminal portions.Type: GrantFiled: February 13, 2007Date of Patent: August 5, 2008Assignee: Nitto Denko CorporationInventors: Kazushi Ichikawa, Yuichi Takayoshi
-
Patent number: 7371971Abstract: A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component 21 and criterion marks 8 to determine presence or absence of an inhibitory portion 23 that may be formed due to formation of an insulating cover layer 4 to inhibit connection between the terminal portions 6 and the external terminals 22 are formed on the insulating base layer 2 simultaneously, the insulating cover layer 4 to cover the conductive pattern 3 and an opening 7 from which the terminal portions 6 and the criterion marks 8 are exposed is formed. Thereafter, the presence or absence of the inhibitory portion 23 is determined with reference to the criterion marks 8 exposed from the opening 7 of the insulating cover layer 4.Type: GrantFiled: February 8, 2006Date of Patent: May 13, 2008Assignee: Nitto Denko CorporationInventors: Yuichi Takayoshi, Kazushi Ichikawa, Toshiki Naito
-
Publication number: 20070190852Abstract: A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer, and an insulating cover layer formed on the insulating base layer for covering the conductive pattern. The conductive pattern includes terminal portions for connecting with external terminals. The insulating cover layer has an opening formed correspondingly for the respective terminal portions. A position determining zone for determining whether or not a margin of the insulating cover layer facing the opening is located in a proper position is provided in proximity of the terminal portions.Type: ApplicationFiled: February 13, 2007Publication date: August 16, 2007Applicant: Nitto Denko CorporationInventors: Kazushi Ichikawa, Yuichi Takayoshi
-
Publication number: 20060176069Abstract: A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component 21 and criterion marks 8 to determine presence or absence of an inhibitory portion 23 that may be formed due to formation of an insulating cover layer 4 to inhibit connection between the terminal portions 6 and the external terminals 22 are formed on the insulating base layer 2 simultaneously, the insulating cover layer 4 to cover the conductive pattern 3 and an opening 7 from which the terminal portions 6 and the criterion marks 8 are exposed is formed. Thereafter, the presence or absence of the inhibitory portion 23 is determined with reference to the criterion marks 8 exposed from the opening 7 of the insulating cover layer 4.Type: ApplicationFiled: February 8, 2006Publication date: August 10, 2006Applicant: Nitto Denko CorporationInventors: Yuichi Takayoshi, Kazushi Ichikawa, Toshiki Naito