Abstract: A maintenance apparatus is used for maintaining an ink jet head which ejects ink supplied via an ink supply path, as ink droplets from a plurality of orifices arranged in an orifice plate. The apparatus comprises a pressure control section which controls the pressure in the ink supply path against the atmospheric pressure applied to a surface of the ink to push ink out of each orifice and then align the surface of the ink to a surface of the orifice plate, and an ink suction section which sucks ink near each orifice in a state where the ink surface is approximately aligned to the surface of the orifice plate by the pressure control section.

Abstract: A maintenance apparatus is used for maintaining an ink jet head which ejects ink supplied via an ink supply path, as ink droplets from a plurality of orifices arranged in an orifice plate. The apparatus comprises a pressure control section which controls the pressure in the ink supply path against the atmospheric pressure applied to a surface of the ink to push ink out of each orifice and then align the surface of the ink to a surface of the orifice plate, and an ink suction section which sucks ink near each orifice in a state where the ink surface is approximately aligned to the surface of the orifice plate by the pressure control section.

Abstract: A manufacturing method for an ink jet printer head, includes the steps of: cutting a plurality of channels for forming a plurality of ink chambers, on the upper surface of a substrate composed of a plurality of layers including at least one piezoelectric member polarized across its thickness; forming a pattern resist film covering a portion of the upper surface of the substrate except electrode forming portions on the inner surfaces of the channels and wiring pattern forming portions on the substrate; performing a process for adsorption of Pd on the electrode forming portions and the wiring pattern forming portions after forming the pattern resist film, for example, by performing a sensitizing process of adsorbing Sn on the substrate and next substituting Pd for the Sn, or by performing a catalyzing process of adsorbing a complex compound of Pd on the substrate and next performing an accelerating process of metallizing the complex compound of Pd; separating the pattern resist film; immersing the substrate fro

Abstract: A manufacturing method for an ink jet printer head, includes the steps of cutting a plurality of channels for forming a plurality of ink chambers, on the upper surface of a substrate including at least one piezoelectric member polarized across its thickness; adsorbing Sn on the upper surface of the substrate including the inner surfaces of the channels; forming a pattern resist film on the upper surface of the substrate on which the Sn has been absorbed adsorbing Pd as a catalyst core for electroless plating on the electrode forming portions and the wiring pattern forming portions; separating the pattern resist film; immersing the substrate from which the pattern resist film has been separated into a plating liquid to deposit plating on the electrode forming portions and the wiring pattern forming portions; and mounting on the substrate a top plate for covering upper openings of the channels and a nozzle plate for covering front openings of the channels to form the above ink chambers.

Abstract: The present invention, in a photoelectric conversion device including a sensor portion and a thin film transistor portion for the purpose of switching disposed on the same substrate, is manufactured by, first, forming gate electrodes for a thin film transistor portion on the surface of the substrate by a thin film technique, and then, depositing an insulating film, an a-Si film, and electrodes on the insulating substrate so as to be laminated to one after another and commonly covering the sensor portion and the thin film transistor portion, whereby the sensor portion and the thin film transistor portion are enabled to be provided in one series of processing while the device is put in a vacuum chamber.

Abstract: An image sensor including a sensor portion and a thin film transistor portion for the purpose of switching disposed on the same substrate, manufactured by, first, forming gate electrodes for a thin film transistor portion on the surface of the substrate by a thin film technique, and then, depositing an insulating film, an a-Si film, and electrodes on the insulating substrate so as to be laminated to one after another and commonly covering the sensor portion and the thin film transistor portion, whereby the sensor portion and the thin film transistor portion are enabled to be provided in one series of processing while the device is put in a vacuum chamber.

Abstract: A photoelectric conversion device is disclosed which comprises a large number of photoelectric conversion elements arranged in an array on a substrate and thin film transistors individually corresponding to the photoelectric conversion elements and arranged in an array in parallel with the direction of the array of the photoelectric conversion elements, in which two electrodes of each of the thin film transistors are arranged to oppose each other in the direction of the array of the photoelectric conversion elements so that the width of the channel formed between both the electrodes may be prolonged, and thereby, switching operation by the thin film transistor is made reliable and the manufacture of the thin film transistor portion is facilitated.