Abstract: A device analysis apparatus is a device analysis apparatus for determining a quality of a power semiconductor device, including an application unit that applies a voltage signal to the power semiconductor device, a light detection unit that detects light from the power semiconductor device at a plurality of detection positions and outputs detection signals based on detection results, and a determination unit that determines the quality of the power semiconductor device based on temporal changes of the detection signals.

Abstract: Provided is a method for inspecting a semiconductor device which performs an inspection of a semiconductor device as an object to be inspected, including attaching an adhesive tape to a surface to be inspected of the semiconductor device, acquiring a first pattern image based on a light detected from a region including a surface of the surface to be inspected to which the adhesive tape is attached, inputting an electrical signal to the semiconductor device to which the adhesive tape is attached, acquiring a first heat generation image by detecting light according to heat radiation from the region including the surface to which the adhesive tape is attached in a state in which the electrical signal is input, and superimposing the first pattern image and the first heat generation image.

Abstract: Provided is a method for inspecting a semiconductor device which performs an inspection of a semiconductor device as an object to be inspected, including attaching an adhesive tape to a surface to be inspected of the semiconductor device, acquiring a first pattern image based on a light detected from a region including a surface of the surface to be inspected to which the adhesive tape is attached, inputting an electrical signal to the semiconductor device to which the adhesive tape is attached, acquiring a first heat generation image by detecting light according to heat radiation from the region including the surface to which the adhesive tape is attached in a state in which the electrical signal is input, and superimposing the first pattern image and the first heat generation image.

Abstract: Provided is a method for inspecting a semiconductor device which performs an inspection of a semiconductor device as an object to be inspected, including attaching an adhesive tape to a surface to be inspected of the semiconductor device, acquiring a first pattern image based on a light detected from a region including a surface of the surface to be inspected to which the adhesive tape is attached, inputting an electrical signal to the semiconductor device to which the adhesive tape is attached, acquiring a first heat generation image by detecting light according to heat radiation from the region including the surface to which the adhesive tape is attached in a state in which the electrical signal is input, and superimposing the first pattern image and the first heat generation image.

Abstract: A device analysis apparatus is a device analysis apparatus for determining a quality of a power semiconductor device, including an application unit that applies a voltage signal to the power semiconductor device, a light detection unit that detects light from the power semiconductor device at a plurality of detection positions and outputs detection signals based on detection results, and a determination unit that determines the quality of the power semiconductor device based on temporal changes of the detection signals.

Abstract: A surveying system comprises a surveying machine (11) which is disposed at a reference point (A) and a reflecting mirror (5) which is disposed on the side of a target point (B). In this surveying system, a signal-light projecting device (16) for projecting a beam of signal light (P3) onto the surveying machine (11) is disposed on the side of the target point (B), and a rough-direction detecting device (20) for detecting roughly a direction in which the signal-light projecting device (16) is located by receiving the beam of signal light (P8), and a precise-direction detecting device (21) for detecting precisely the direction in which the signal-light projecting device (16) is located by receiving the beam of signal light (P3) are disposed on the side of the surveying machine (11).

Abstract: In a light-wave distance meter, a light source device emits reference modulated light beams from multiple spatially-separated light emitting areas, an optical means radiates a light beam derived from the multiple modulated light beams to the target of measurement, a light beam reception means receives the reflected return light beam from the target and converts it into an electrical pulse signal, and a distance measuring means calculates the distance to the target based on the time difference between the light beam emission and the return light beam reception. The low coherence and high intensity light beam produced by the light source device enables the extension of the maximum measurable distance.