Abstract: Objects of the present invention are to provide a piezoelectric ceramic composition which contains substantially no lead, which exhibits excellent piezoelectric characteristics, and which has high heat durability; and to provide a piezoelectric element including the composition. The piezoelectric ceramic composition contains M1 (a divalent metallic element, or a metallic element combination formally equivalent to a divalent metallic element); M2 (a tetravalent metallic element, or a metallic element combination formally equivalent to a tetravalent metallic element); and M3 (a metallic element of a sintering aid component), wherein, when these metallic elements constitute the formula [(½)aK2O-(½)bNa2O-cM1O-(½)dNb2O5-eM2O2], a, b, c, d, and e in the formula satisfy the following relations: 0<a<0.5, 0<b<0.5, 0<c<0.11, 0.4<d<0.56, 0<e<0.12, 0.4<a+b+c?0.

Abstract: The present invention provides a wiring board in which electronic components are embedded by means of an embedding resin which attains a high mounting density of the electronic components in the wiring board, which exhibits excellent electrical properties such as insulating property, which prevents random reflection of light, and which reduces non-uniformity in color of the resin during curing thereof. The present invention includes a wiring board in which electronic components are embedded by use of an embedding resin having a dielectric constant of less than or equal to about 5 and tan ? of less than or equal to about 0.08. The embedding resin preferably contains carbon black in an amount of less than or equal to about 1.4 mass %. Moreover, the embedding resin preferably contains at least a thermosetting resin and at least one inorganic filler.

Abstract: An embedding resin for embedding an electronic part in a wiring substrate, includes at least one of a soluble resin and a soluble organic filler as a soluble component to be dissolved with an oxidizing agent.

Abstract: An embedding resin embeds an electronic part in an object and has a dielectric constant of about 5 or less and tan &dgr; of about 0.08 or less.

Abstract: A wiring board includes a substrate having an opening, and an electronic part placed in the opening, wherein a space left in the opening is filled with an embedding resin having a base color tone selected from black, blue, green, red, orange, yellow, and violet.

Abstract: The present invention is directed to a dielectric ceramic composition exhibiting a high unloaded quality factor and a small variation thereof. The dielectric ceramic composition of the invention containing Ba, Zn, and Ta, contains 100 parts by weight of a predominant component represented by xBaO—yZnO—(½)zTa2O5 (x, y, and z represent compositional proportions by mol and satisfy x+y+z=1), wherein x, y, and z fall within a quadrilateral region formed by connecting points A (x=0.503, y=0.152, z=0.345), B (x=0.497, y=0.158, z=0.345), C (x=0.503, y=0.162, z=0.335), and D (x=0.497, y=0.168, z=0.335) (sides AB, BD, DC, and CA being included) as shown in FIG. 1; 0.2-1.6 parts by weight K as reduced to K2O; and 0.7-8 parts by weight Ta as reduced to Ta2O5, wherein the ratio by weight of K to Ta falls within the range of 0.185-0.4.

Abstract: The present invention is directed to a dielectric ceramic composition exhibiting a high unloaded quality factor and a small variation thereof. The dielectric ceramic composition of the invention containing Ba, Zn, and Ta, contains 100 parts by weight of a predominant component represented by xBaO-yZnO-(½)zTa2O5 (x, y, and z represent compositional proportions by mol and satisfy x+y+z=1), wherein x, y, and z fall within a quadrilateral region formed by connecting points A (x=0.503, y=0.152, z=0.345), B (x=0.497, y=0.158, z=0.345), C (x=0.503, y=0.162, z=0.335), and D (x=0.497, y=0.168, z=0.335) (sides AB, BD, DC, and CA being included) as shown in FIG. 1; 0.2-1.6 parts by weight K as reduced to K2O; and 0.7-8 parts by weight Ta as reduced to Ta2O5, wherein the ratio by weight of K to Ta falls within the range of 0.185-0.4.

Abstract: The invention relates to a wiring circuit board including an electronic device disposed in a hole of the wiring circuit board; a resin filling the hole such that the electronic device is embedded in the resin; a wiring layer formed on the resin; and an interface between the resin and the wiring layer. This interface has a roughness in a range of 2-6 &mgr;m in terms of ten-point mean roughness.

Abstract: The invention relates to a wiring circuit board including an electronic device disposed in a hole of the wiring circuit board; a resin filling the hole such that the electronic device is embedded in the resin; a wiring layer formed on the resin; and an interface between the resin and the wiring layer. This interface has a roughness in a range of 2-6 &mgr;m in terms of ten-point mean roughness.

Abstract: An embedding resin for embedding an electronic part in a wiring substrate, includes at least one of a soluble resin and a soluble organic filler as a soluble component to be dissolved with an oxidizing agent.

Abstract: An embedding resin that is caused to assume any base color selected from among black, blue, green, red, orange, yellow, and violet is used for embedding an electronic part in an insulating substrate. The embedding resin preferably contains at least one coloring agent selected from among carbon black, a phthalocyanine-based pigment, an azo pigment, a quinoline-based pigment, an anthraquinone-based pigment, a triphenylmethane-based pigment, and an inorganic oxide.

Abstract: An embedding resin embeds an electronic part in an object and has a dielectric constant of about 5 or less and tan&dgr; of about 0.08 or less.

Abstract: The present invention provides a wiring board in which electronic components are embedded by means of an embedding resin which attains a high mounting density of the electronic components in the wiring board, which exhibits excellent electrical properties such as insulating property, which prevents random reflection of light, and which reduces non-uniformity in color of the resin during curing thereof. The present invention includes a wiring board in which electronic components are embedded by use of an embedding resin having a dielectric constant of less than or equal to about 5 and tan &dgr; of less than or equal to about 0.08. The embedding resin preferably contains carbon black in an amount of less than or equal to about 1.4 mass %. Moreover, the embedding resin preferably contains at least a thermosetting resin and at least one inorganic filler.

Abstract: A wiring board includes a substrate having an opening, and an electronic part placed in the opening, wherein a space left in the opening is filled with an embedding resin having a base color tone selected from black, blue, green, red, orange, yellow, and violet.