Abstract: The present invention relates to a liquid crystal display panel having a predetermined size, containing a wiring film formed of a metal, an insulating film containing an inorganic substance and a substrate formed of a non-alkali glass, in which the metal has the product of a Young's modulus (E) and a thermal expansion coefficient (?) at room temperature falling within a predetermined range, ? of the inorganic substance is smaller than that of the non-alkali glass, the non-alkali glass has E of from 70 GPa to 95 GPa and ? of from 32×10?7 to 45×10?7 (1/° C.) in which E and ? satisfies a predetermined formula, and has a predetermined composition.

Abstract: The present invention relates to a liquid crystal display panel having a predetermined size, containing a wiring film formed of a metal, an insulating film containing an inorganic substance and a substrate formed of a non-alkali glass, in which the metal has the product of a Young's modulus (E) and a thermal expansion coefficient (?) at room temperature falling within a predetermined range, ? of the inorganic substance is smaller than that of the non-alkali glass, the non-alkali glass has E of from 70 GPa to 95 GPa and ? of from 32×10?7 to 45×10?7 (1/° C.) in which E and ? satisfies a predetermined formula, and has a predetermined composition.

Abstract: The present invention relates to an alkali-free glass and a method for producing the same. More specifically, the present invention relates to an alkali-free glass suitable as a glass for substrates of various displays such as liquid crystal display, and a method for producing the same. According to the present invention, an alkali-free glass suitable as a glass for display substrates, in which inclusion of bubbles is greatly reduced by virtue of containing a refining agent and suppressing the stirring reboil, is obtained.

Abstract: To provide glass to be used for chemically tempered glass, of which the strength is less likely to be reduced even when indentations are formed thereon. Glass for chemical tempering, which comprises, as represented by mole percentage based on oxides, from 62 to 68% of SiO2, from 6 to 12% of Al2O3, from 7 to 13% of MgO, from 9 to 17% of Na2O, and from 0 to 7% of K2O, wherein the difference obtained by subtracting the content of Al2O3 from the total content of Na2O and K2O is less than 10%, and when ZrO2 is contained, its content is at most 0.8%. Chemically tempered glass obtained by chemically tempering such glass for chemical tempering. Such chemically tempered glass has a compressive stress layer formed on the glass surface, which has a thickness of at least 30 ?m and a surface compressive stress of at least 550 MPa.

Abstract: The present invention relates to a glass substrate for a high-frequency device, which includes SiO2 as a main component, the glass substrate having a total content of alkali metal oxides in the range of 0.001-5% in terms of mole percent on the basis of oxides, the alkali metal oxides having a molar ratio represented by Na2O/(Na2O+K2O) in the range of 0.01-0.99, and the glass substrate having a total content of Al2O3 and B2O3 in the range of 1-40% in terms of mole percent on the basis of oxides and having a molar ratio represented by Al2O3/(Al2O3+B2O3) in the range of 0-0.45, in which at least one main surface of the glass substrate has a surface roughness of 1.5 nm or less in terms of arithmetic average roughness Ra, and the glass substrate has a dielectric dissipation factor at 35 GHz of 0.007 or less.

Abstract: A first aspect of the present invention relates to a glass substrate having a content of alkali metal oxides, as represented by molar percentage based on oxides, of 0 to 0.1%, a devitrification-temperature viscosity of 103.2 dPa·s or higher, and an average coefficient of thermal expansion ? at 30 to 220° C. of 7.80 to 9.00 (ppm/° C.). A second aspect of the present invention relates to a glass substrate which is to be used for a support substrate for semiconductor packages, the glass substrate having a content of alkali metal oxides, as represented by molar percentage based on oxides, of 0 to 0.1% and a photoelastic constant of 10 to 26 nm/cm/MPa.

Abstract: To provide an alkali-free glass, of which the compaction is low, the strain point is high, and the ultraviolet transmittance is high, and which is easy to melt. An alkali-free glass, which comprises, as represented by mol % based on oxides, SiO2 from 65 to 75, Al2O3 from 9 to 15, B2O3 from 0 to 3, MgO from 0 to 12, CaO from 0 to 8, SrO from 0 to 6, and BaO from 0 to 5, wherein MgO+CaO+SrO+BaO is from 12 to 22, and 4.84[Fe2O3]+5.65[Na2O]+4.03[K2O]+4.55[SnO2] is at most 0.55, and of which the compaction is at most 80 ppm.

Abstract: A glass substrate has a compaction of 0.1 to 100 ppm. An absolute value |??50/100| of a difference between an average coefficient of thermal expansion ?50/100 of the glass substrate and an average coefficient of thermal expansion of single-crystal silicon at 50° C. to 100° C., an absolute value |??100/200| of a difference between an average coefficient of thermal expansion ?100/200 of the glass substrate and an average coefficient of thermal expansion of the single-crystal silicon at 100° C. to 200° C., and an absolute value |??200/300| of a difference between an average coefficient of thermal expansion ?200/300 of the glass substrate and an average coefficient of thermal expansion of the single-crystal silicon at 200° C. to 300° C. are 0.16 ppm/° C. or less.

Abstract: An alkali-free glass substrate which is a glass substrate includes, as represented by molar percentage based on oxides, 0.1% to 10% of ZnO. The alkali-free glass substrate has an average coefficient of thermal expansion ?50/100 at 50 to 100° C. of from 2.70 ppm/° C. to 3.20 ppm/° C., an average coefficient of thermal expansion ?200/300 at 200 to 300° C. of from 3.45 ppm/° C. to 3.95 ppm/° C., and a value ?200/300/?50/100 obtained by dividing the average coefficient of thermal expansion ?200/300 at 200 to 300° C. by the average coefficient of thermal expansion ?50/100 at 50 to 100° C. of from 1.20 to 1.30.

Abstract: An alkali-free glass substrate includes, as represented by molar percentage based on oxides, 11.0% or more of Al2O3, 8.0% or more of B2O3, and 1% or more of SrO. The alkali-free glass substrate has an average coefficient of thermal expansion ?100/200 at 100 to 200° C. of from 3.10 ppm/° C. to 3.70 ppm/° C., a Young's modulus of 76.0 GPa or less, and a density of 2.42 g/cm3 or more.

Abstract: To provide an alkali-free glass having a high specific elastic modulus, a suitable strain point, a low density, a not too low thermal expansion coefficient, a good clarity and a good solubility. An alkali-free glass, which comprises, as represented by mol % based on oxides, SiO2: 62 to 70%, Al2O3: 11 to 14%, B2O3: 3 to 6%, MgO: 7 to 10%, CaO: 3 to 9%, SrO: 1 to 5% and BaO: 0 to 1%, wherein [SiO2]+0.7[Al2O3]+1.2[B2O3]+0.5[MgO]+0.4[CaO]?0.25[SrO]?0.88[BaO] is at least 85, [SiO2]+0.45[Al2O3]+0.21[B2O3]?0.042[MgO]+0.042[CaO]+0.15[SrO]+0.38[BaO] is from 72 to 75, 0.4[SiO2]+0.4[Al2O3]+0.25[B2O3]?0.7[MgO]?0.88[CaO]?1.4[SrO]?1.7[BaO] is at most 19, the specific modulus is at least 32 MN·m/kg, the strain point is from 690 to 710° C., the density is at most 2.54 g/cm3, the average thermal expansion coefficient at from 50 to 350° C. is at least 35×10?7/° C., and the temperature T2 at which the glass viscosity reaches 102 dPa·s is from 1,610 to 1,680° C.

Abstract: To provide chemically tempered glass which is less likely to break even if scratched. Chemically tempered glass, which comprises, as represented by mole percentage based on the following oxides, from 56 to 72% of SiO2, from 8 to 20% of Al2O3, from 9 to 25% of Na2O, from 0 to 2% of K2O, and from 0 to 15% of MgO, and which has a surface compressive stress of at least 900 MPa and an internal tensile stress of at most 30 MPa. Glass for chemical tempering, which comprises, as represented by mole percentage based on the following oxides, from 56 to 69% of SiO2, from 8 to 16% of Al2O3, from 9 to 22% of Na2O, from 0 to 1% of K2O, from 5.5 to 14% of MgO, from 0 to 2% of ZrO2, and from 0 to 6% of B2O3.

Abstract: A glass substrate includes, as a glass matrix composition as represented by mole percentage based on oxides, SiO2: 55%-75%, Al2O3: 2%-15%, MgO: 0%-10%, CaO: 0%-10%, SrO: 0%-10%, BaO: 0%-15%, ZrO2: 0%-5%, Na2O: 0%-20%, K2O: 5%-30%, and Li2O: 0%-5.0%. The glass substrate has a total content of alkali metal oxides, as represented by mole percentage based on oxides, of 10%-30%, a value obtained by dividing the total content of alkali metal oxides by the content of SiO2 of 0.50 or smaller, a value obtained by dividing the content of Na2O by a value obtained by subtracting the content of Al2O3 from a total content of Na2O and K2O of 0.90 or smaller, and an average coefficient of thermal expansion ?1 at 50° C.-350° C. of 11 ppm/° C.-16 ppm/° C.

Abstract: A glass substrate contains, as a glass matrix composition as represented by mole percentage based on oxides, SiO2: 58-75%, Al2O3: 4.5-16%, B2O3: 0-6%, MgO: 0-6%, CaO: 0-6%, SrO: 5-20%, BaO: 5-20%, and MgO+CaO+SrO+BaO: 15-40%. The glass substrate has an alkali metal oxide content of 0-0.1% as represented by mole percentage based on oxides. The glass substrate has an average coefficient of thermal expansion ? of 56-90 (×10?7/° C.) at 50° C.-350° C.

Abstract: A glass substrate is laminated with a substrate containing silicon to thereby form a laminated substrate. The glass substrate has a concave surface and a convex surface and has one or more marks that distinguish between the concave surface and the convex surface.

Abstract: A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

Abstract: The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 ?m to 300 ?m, and an inclination angle due to the warpage of 0.0004° to 0.12°.

Abstract: To provide chemically tempered glass which is less likely to break even if scratched. Chemically tempered glass, which comprises, as represented by mole percentage based on the following oxides, from 56 to 72% of SiO2, from 8 to 20% of Al2O3, from 9 to 25% of Na2O, from 0 to 2% of K2O, and from 0 to 15% of MgO, and which has a surface compressive stress of at least 900 MPa and an internal tensile stress of at most 30 MPa. Glass for chemical tempering, which comprises, as represented by mole percentage based on the following oxides, from 56 to 69% of SiO2, from 8 to 16% of Al2O3, from 9 to 22% of Na2O, from 0 to 1% of K2O, from 5.5 to 14% of MgO, from 0 to 2% of ZrO2, and from 0 to 6% of B2O3.

Abstract: Provided is a non-alkali glass having a strain point of 680° C. or higher, having an average thermal expansion coefficient of from 30×10?7/° C. to 45×10?7/° C. at from 50° C. to 350° C., containing, indicated by mass % on the basis of oxides: SiO2: 54% to 66%, Al2O3: 10% to 27%, B2O3: 0.2% to 5.5%, MgO: 0% to 10%, CaO: 0% to 15%, SrO: 0% to 15%, BaO: 0% to 15%, and MgO+CaO+SrO+BaO: 8% to 25%, containing 600 mass ppm or less of Na2O, and satisfying a mass ratio (Na2O/B2O3) between Na2O and B2O3 being from 0.001 to 0.3.

Abstract: To provide chemically tempered glass which is less likely to break even if scratched. Chemically tempered glass, which comprises, as represented by mole percentage based on the following oxides, from 56 to 72% of SiO2, from 8 to 20% of Al2O3, from 9 to 25% of Na2O, from 0 to 2% of K2O, and from 0 to 15% of MgO, and which has a surface compressive stress of at least 900 MPa and an internal tensile stress of at most 30 MPa. Glass for chemical tempering, which comprises, as represented by mole percentage based on the following oxides, from 56 to 69% of SiO2, from 8 to 16% of Al2O3, from 9 to 22% of Na2O, from 0 to 1% of K2O, from 5.5 to 14% of MgO, from 0 to 2% of ZrO2, and from 0 to 6% of B2O3.