Patents by Inventor Kazuto Koshimizu

Kazuto Koshimizu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130077653
    Abstract: A temperature sensor excellent in durability under a high-pressure atmosphere of hydrogen is provided. The temperature sensor includes a thermistor element body comprising an oxide sintered body, a pair of lead wires each electrically connected to the element body and comprising Pt or a Pt alloy, and a sealing glass sealing the element body and a part of the lead wires including a portion connected to the element body. The pair of lead wires comprising any of Pt, an alloy comprising Pt and one or two of Ir and Pd, and an alloy of Pd and Ir, and the temperature sensor is used under an atmosphere of hydrogen.
    Type: Application
    Filed: June 27, 2012
    Publication date: March 28, 2013
    Applicant: SHIBAURA ELECTRONICS CO., LTD.
    Inventors: Kazuto KOSHIMIZU, Takayuki NAKAYA, Satoshi UCHIYAMA
  • Patent number: 6880969
    Abstract: In a temperature sensor including a pair of electrode wires for signal lead-out, bonded to both opposing end faces of a thermistor device, this invention aims at preventing peeling, of bond portions, between the electrode wires and the thermistor device. This object can be accomplished by sealing the thermistor device 3 and the bond portions between the thermistor device 3 and the electrode wires 4 by using an electrically insulating glass member 6, and holding the pair of electrode wires 4 by using a holding member 8 made of an electrically insulating ceramic while a gap is kept between them.
    Type: Grant
    Filed: March 25, 2002
    Date of Patent: April 19, 2005
    Assignees: Denso Corporation, Shibaura Electronics Co., Ltd.
    Inventors: Tomohiro Adachi, Atsushi Kurano, Kazuto Koshimizu, Norihiko Shimura, Takamasa Yoshihara
  • Publication number: 20020172258
    Abstract: In a temperature sensor including a pair of electrode wires for signal lead-out, bonded to both opposing end faces of a thermistor device, this invention aims at preventing peeling, of bond portions, between the electrode wires and the thermistor device. This object can be accomplished by sealing the thermistor device 3 and the bond portions between the thermistor device 3 and the electrode wires 4 by using an electrically insulating glass member 6, and holding the pair of electrode wires 4 by using a holding member 8 made of an electrically insulating ceramic while a gap is kept between them.
    Type: Application
    Filed: March 25, 2002
    Publication date: November 21, 2002
    Inventors: Tomohiro Adachi, Atsushi Kurano, Kazuto Koshimizu, Norihiko Shimura, Takamasa Yoshihara