Abstract: A wiring board includes a first substrate, a second substrate composed of a material different from a material of the first substrate, a wiring supported by the first substrate, and a terminal supported by the second substrate and connected to the wiring. The first and second substrates are disposed on a same side with respect to the wiring. In a plan view, the first substrate overlaps the wiring but not the terminal. In the plan view, the second substrate overlaps the terminal.

Abstract: A method for manufacturing a wiring board includes: disposing a first resist material on a substrate; forming a first resist layer by curing the first resist material; forming a resin layer on a release film; forming a conductor portion on the resin layer; covering the conductor portion by disposing a second resist material on the resin layer; forming a second resist layer by curing the second resist material; bringing the first resist layer into contact with the second resist layer, and thereafter bonding the first resist layer and the second resist layer by thermocompression bonding; and releasing the release film from the resin layer.

Abstract: An electroconductive paste according to the present invention contains a binder (A), a silver powder (B), crosslinked resin particles (C) having a glass transition temperature of 35° C. or lower, and an organic solvent (D).

Abstract: A stretchable wiring board includes: a first stretchable substrate; an overcoat layer; and a conductor layer interposed at least partly between the first stretchable substrate and the overcoat layer. The conductor layer includes a wiring portion covered with the overcoat layer and a connection portion that has a surface exposed from the overcoat layer. The exposed surface of the connection portion is flush with a top surface of the overcoat layer.

Abstract: An electroconductive paste according to the present invention contains a binder (A), a silver powder (B), crosslinked resin particles (C) having a glass transition temperature of 35° C. or lower, and an organic solvent (D).

Abstract: A stretchable wiring body includes: a conductor that includes a binder and conductive particles dispersed in the binder; and soft resins that are embedded in the binder and are softer than the binder. The conductive particles are not covered with the soft resins.

Abstract: A stretchable wiring board includes: a first stretchable substrate; an overcoat layer; and a conductor layer interposed at least partly between the first stretchable substrate and the overcoat layer. The conductor layer includes a wiring portion covered with the overcoat layer and a connection portion that has a surface exposed from the overcoat layer. The exposed surface of the connection portion is flush with a top surface of the overcoat layer.

Abstract: A method is provided for manufacturing a wiring board that includes a conductor part including a first line and a second line wider than the first line. The method includes: a first process of forming the first line and a boundary line corresponding to at least a portion of an outline of the second line near the first line; and a second process of forming a remaining portion of the second line.

Abstract: A method is provided for manufacturing a wiring board that includes a conductor part including a first line and a second line wider than the first line. The method includes: a first process of forming the first line and a boundary line corresponding to at least a portion of an outline of the second line near the first line; and a second process of forming a remaining portion of the second line.

Abstract: A touch sensor (2) includes: a substrate (21); a net-shaped electrode (22) which is provided on the substrate (21) and includes conductive wires (221) arranged in a net form; and an outer edge wire (23) which is provided in at least a part of an outer edge of the net-shaped electrode (22) and is integrally formed with the net-shaped electrode. The conductive wire (221) includes a large-width portion which is provided in at least one of lateral parts of a connection portion and gradually widens according to approaching the outer edge wire (23), and the connection portion is a portion of the conductive wire (221) which is connected to the outer edge wire (23). Expressions (1) and (2) are satisfied: A?100 [?m]??(1) B/A?½??(2). In Expressions (1) and (2), “A” is a width of the outer edge wire (23), and “B” is a largest width of the conductive wires (221) in a portion where the large-width portion (222) is provided.

Abstract: A touch sensor (2) includes: a substrate (21); a net-shaped electrode (22) which is provided on the substrate (21) and includes conductive wires (221) arranged in a net form; and an outer edge wire (23) which is provided in at least a part of an outer edge of the net-shaped electrode (22) and is integrally formed with the net-shaped electrode. The conductive wire (221) includes a large-width portion which is provided in at least one of lateral parts of a connection portion and gradually widens according to approaching the outer edge wire (23), and the connection portion is a portion of the conductive wire (221) which is connected to the outer edge wire (23). Expressions (1) and (2) are satisfied: A?100 [?m]??(1) B/A?½??(2). In Expressions (1) and (2), “A” is a width of the outer edge wire (23), and “B” is a largest width of the conductive wires (221) in a portion where the large-width portion (222) is provided.

Abstract: The present invention is a membrane wiring board provided with an insulating substrate, and at least one circuit portion provided on the insulating substrate and obtained by coating a circuit layer, formed by an electrically conductive paste containing electrically conductive particles, with an insulating coating layer, wherein the circuit layer contains a resin component having a gel fraction of 90% or more.

Abstract: The present invention provides an electroconductive paste for electron beam curing that allows the formation of a circuit board having an electroconductive layer that has superior hardness and bendability as well as superior adhesion to a plastic base even if used in a high-temperature environment. The present invention is an electroconductive paste for electron beam curing comprising an electroconductive powder, a radical polymerizable composition and a plasticizer, wherein the plasticizer is incorporated at a ratio of 5 parts by mass to 20 parts by mass based on 100 parts by mass of the radical polymerizable composition.

Abstract: The present invention is a membrane wiring board provided with an insulating substrate, and at least one circuit portion provided on the insulating substrate and obtained by coating a circuit layer, formed by an electrically conductive paste containing electrically conductive particles, with an insulating coating layer, wherein the circuit layer contains a resin component having a gel fraction of 90% or more.

Abstract: The present invention provides an electroconductive paste for electron beam curing that allows the formation of a circuit board having an electroconductive layer that has superior hardness and bendability as well as superior adhesion to a plastic base even if used in a high-temperature environment. The present invention is an electroconductive paste for electron beam curing comprising an electroconductive powder, a radical polymerizable composition and a plasticizer, wherein the plasticizer is incorporated at a ratio of 5 parts by mass to 20 parts by mass based on 100 parts by mass of the radical polymerizable composition.