Patents by Inventor Kazutoshi Maehara

Kazutoshi Maehara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low profile process kit
    Patent number: 8409355
    Abstract: Embodiments of process kits for substrate supports of semiconductor substrate process chambers are provided herein. In some embodiments, a process kit for a semiconductor process chamber may include an annular body being substantially horizontal and having an inner and an outer edge, and an upper and a lower surface; an inner lip disposed proximate the inner edge and extending vertically from the upper surface; and an outer lip disposed proximate the outer edge and on the lower surface, and having a shape conforming to a surface of the substrate support pedestal. In some embodiments, a process kit for a semiconductor process chamber my include an annular body having an inner and an outer edge, and having an upper and lower surface, the upper surface disposed at a downward angle of between about 5-65 degrees in an radially outward direction from the inner edge toward the outer edge.
    Type: Grant
    Filed: April 24, 2008
    Date of Patent: April 2, 2013
    Assignee: Applied Materials, Inc.
    Inventors: Muhammad M. Rasheed, Teruki Iwashita, Hiroshi Otake, Yuki Koga, Kazutoshi Maehara, Xinglong Chen, Sudhir Gondhalekar, Dmitry Lubomirsky
  • LOW PROFILE PROCESS KIT
    Publication number: 20090266299
    Abstract: Embodiments of process kits for substrate supports of semiconductor substrate process chambers are provided herein. In some embodiments, a process kit for a semiconductor process chamber may include an annular body being substantially horizontal and having an inner and an outer edge, and an upper and a lower surface; an inner lip disposed proximate the inner edge and extending vertically from the upper surface; and an outer lip disposed proximate the outer edge and on the lower surface, and having a shape conforming to a surface of the substrate support pedestal. In some embodiments, a process kit for a semiconductor process chamber my include an annular body having an inner and an outer edge, and having an upper and lower surface, the upper surface disposed at a downward angle of between about 5-65 degrees in an radially outward direction from the inner edge toward the outer edge.
    Type: Application
    Filed: April 24, 2008
    Publication date: October 29, 2009
    Applicant: APPLIED MATERIALS, INC.
    Inventors: MUHAMMAD M. RASHEED, TERUKI IWASHITA, HIROSHI OTAKE, YUKI KOGA, KAZUTOSHI MAEHARA, XINGLONG CHEN, SUDHIR GONDHALEKAR, DMITRY LUBOMIRSKY
  • Substrate support with clamping electrical connector
    Patent number: 7354288
    Abstract: A substrate support comprises a ceramic disc with an electrode that is chargeable through an electrode terminal. An electrical connector connects an external power source to the electrode terminal. The electrical connector has a pair of opposing pincer arms, a groove sized to fit around the electrode terminal, and a pair of through holes to receive a tightening assembly capable of tightening the opposing pincer arms about the electrode terminal.
    Type: Grant
    Filed: June 3, 2005
    Date of Patent: April 8, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Kazutoshi Maehara, Visweswaren Sivaramakrishnan, Kentaro Wada, Mark A. Fodor, Andrzei Kaszuba
  • Substrate support with clamping electrical connector
    Publication number: 20060272774
    Abstract: A substrate support comprises a ceramic disc with an electrode that is chargeable through an electrode terminal. An electrical connector connects an external power source to the electrode terminal. The electrical connector has a pair of opposing pincer arms, a groove sized to fit around the electrode terminal, and a pair of through holes to receive a tightening assembly capable of tightening the opposing pincer arms about the electrode terminal.
    Type: Application
    Filed: June 3, 2005
    Publication date: December 7, 2006
    Inventors: Kazutoshi Maehara, Visweswaren Sivaramakrishnan, Kentaro Wada, Mark Fodor, Andrzei Kaszuba