Patents by Inventor Kazuya Kitazawa
Kazuya Kitazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11833620Abstract: Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt % of a (carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt % of a rosin, and furthermore contains a solvent. The (carboxyalkyl)isocyanurate adduct is a mono(carboxyalkyl)isocyanurate adduct, a bis(carboxyalkyl)isocyanurate adduct, a tris(carboxyalkyl)isocyanurate adduct, or a combination of two or more of these.Type: GrantFiled: January 16, 2019Date of Patent: December 5, 2023Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Yutaka Hashimoto, Kazuyori Takagi, Tomoko Nagai, Nanako Miyagi, Kazuya Kitazawa, Akiko Takaki, Kazuhiro Minegishi, Teppei Otsuki, Rina Horikoshi, Ryuichi Tsuda, Hiroyoshi Kawasaki, Masato Shiratori
-
Patent number: 11738415Abstract: A flux for soldering contains 10 to 40 wt % of coumarin, 5 to 30 wt % of a monoamide-based thixotropic agent and 40 to 80 wt % of a solvent. A solder paste contains the flux and a solder powder. A method for producing a soldered product includes supplying the solder paste to a soldering portion of an electronic circuit board, mounting an electronic component onto the soldering portion and heating the soldering portion up to a temperature at which the solder powder melts in a reducing atmosphere containing a reducing gas to join the electronic component and the electronic circuit board.Type: GrantFiled: March 22, 2021Date of Patent: August 29, 2023Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Takafumi Ohtake, Hiroaki Kawamata, Shinji Kikuchi, Keisuke Shinozaki, Yuki Fujino, Kazuya Kitazawa
-
Publication number: 20230122883Abstract: A flux for a solder paste includes rosin, an activator and a solvent. The solvent includes a monoalkylene glycol-based solvent and a solid solvent that is solid at 20° C. The total content of the monoalkylene glycol-based solvent and the solid solvent ranges from 40% by mass to 60% by mass with the total amount of the flux as 100%. The content of the solid solvent ranges from 5% by mass to 25% by mass with the total amount of the flux as 100%.Type: ApplicationFiled: March 25, 2021Publication date: April 20, 2023Inventors: Ryuji Ukai, Kazuya Kitazawa, Hiroaki Kawamata, Shinji Kikuchi, Keisuke Shinozaki
-
Publication number: 20230107101Abstract: A flux for soldering contains 10 to 40 wt % of coumarin, 5 to 30 wt % of a monoamide-based thixotropic agent and 40 to 80 wt % of a solvent. A solder paste contains the flux and a solder powder. A method for producing a soldered product includes supplying the solder paste to a soldering portion of an electronic circuit board, mounting an electronic component onto the soldering portion and heating the soldering portion up to a temperature at which the solder powder melts in a reducing atmosphere containing a reducing gas to join the electronic component and the electronic circuit board.Type: ApplicationFiled: March 22, 2021Publication date: April 6, 2023Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Takafumi OHTAKE, Hiroaki KAWAMATA, Shinji KIKUCHI, Keisuke SHINOZAKI, Yuki FUJINO, Kazuya KITAZAWA
-
Patent number: 11571771Abstract: If a flux contains an amount of thixotropic agent necessary for obtaining the effect of suppressing a heating sagging, the amount of flux residue increases, and, if applied for uses that do not involve washing, a large amount of flux residue derived from the thixotropic agent remains around the soldered portions, thereby affecting chemical and electrical reliability; and that washing performance is poor in uses involving washing of the flux residue. Accordingly, this soldering flux contains nanofibers of one or more kinds from among polysaccharides, modified polysaccharides, and incompletely modified polysaccharides being modified from polysaccharides into modified polysaccharides, by an amount of 50 wt ppm or more and 3000 wt ppm or less with respect to a total amount of flux.Type: GrantFiled: July 9, 2018Date of Patent: February 7, 2023Assignee: Senju Metal Industry Co., Ltd.Inventors: Kazuya Kitazawa, Takayuki Kobayashi, Yusuke Kawano
-
Publication number: 20220331916Abstract: A solder paste includes a solder powder and a flux. The flux includes a rosin, an activator, a solvent, and a thixotropic agent containing a polyethylene glycol. A content of the polyethylene glycol is 10 mass % to 20 mass % with respect to a total mass of the flux, a content of the thixotropic agent excluding the polyethylene glycol is 5 mass % or less with respect to the total mass of the flux, and a content of the rosin is more than 15 mass % and 50 mass % or less with respect to the total mass of the flux.Type: ApplicationFiled: August 28, 2020Publication date: October 20, 2022Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Ryuji UKAI, Kengo OHTA, Sakie OKADA, Kazuya KITAZAWA
-
Publication number: 20220127445Abstract: Provided are: a resin composition for soldering use, which has excellent compatibility with a rosin-based resin and excellent temperature cycle reliability and is therefore suitable for a flux for soldering use; and a soldering composition and a flux cored solder, in each of which the resin composition for soldering use is used. The resin composition for soldering use comprises: an acrylic resin having a number average molecular weight of 500 or more and less than 2000 as determined by mass spectrometry using a time-of-flight mass spectrometer; and a rosin-based resin, a polyethylene-based resin or a polypropylene-based resin. Alternatively, the resin composition for soldering use comprises: an acrylic resin having a weight average molecular weight of 500 or more and less than 2000 as determined by mass spectrometry using a time-of-flight mass spectrometer; and a rosin-based resin, a polyethylene-based resin or a polypropylene-based resin.Type: ApplicationFiled: March 27, 2020Publication date: April 28, 2022Inventors: Hiroyoshi KAWASAKI, Masato SHIRATORI, Yoko KURASAWA, Motohiro ONITSUKA, Kazuya KITAZAWA, Akiko TAKAKI
-
Publication number: 20210060715Abstract: Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt % of a (2-carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt % of a rosin, and furthermore contains a solvent. The (2-carboxyalkyl)isocyanurate adduct is a mono(2-carboxyalkyl)isocyanurate adduct, a bis(2-carboxyalkyl)isocyanurate adduct, a tris(2-carboxyalkyl)isocyanurate adduct, or a combination of two or more of these.Type: ApplicationFiled: January 16, 2019Publication date: March 4, 2021Inventors: Yutaka HASHIMOTO, Kazuyori TAKAGI, Tomoko NAGAI, Nanako MIYAGI, Kazuya KITAZAWA, Akiko TAKAKI, Kazuhiro MINEGISHI, Teppei OTSUKI, Rina HORIKOSHI, Ryuichi TSUDA, Hiroyoshi KAWASAKI, Masato SHIRATORI
-
Publication number: 20200130110Abstract: If a flux contains an amount of thixotropic agent necessary for obtaining the effect of suppressing a heating sagging, the amount of flux residue increases, and, if applied for uses that do not involve washing, a large amount of flux residue derived from the thixotropic agent remains around the soldered portions, thereby affecting chemical and electrical reliability; and that washing performance is poor in uses involving washing of the flux residue. Accordingly, this soldering flux contains nanofibers of one or more kinds from among polysaccharides, modified polysaccharides, and incompletely modified polysaccharides being modified from polysaccharides into modified polysaccharides, by an amount of 50 wt ppm or more and 3000 wt ppm or less with respect to a total amount of flux.Type: ApplicationFiled: July 9, 2018Publication date: April 30, 2020Inventors: Kazuya Kitazawa, Takayuki Kobayashi, Yusuke Kawano
-
Patent number: 10632492Abstract: A defect may occur in which as the amount of fluid discharged by a fluid discharge device decreases, a mask is not filled with the fluid even when the fluid is discharged. In order to fill a workpiece with the fluid, it is necessary to replace air in the workpiece corresponding to a discharge part with the fluid. The air in the workpiece is removed in advance, thereby filling the workpiece with the discharged fluid. A fluid discharge device in which, at one end of a discharge head, a suction port for sucking air in the mask on the workpiece, and a fluid discharge device having a discharge nozzle formed thereon for discharging the fluid are formed is used.Type: GrantFiled: January 13, 2016Date of Patent: April 28, 2020Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Takashi Nauchi, Hideki Nakamura, Toshihiko Mutsuji, Kazuya Kitazawa
-
Patent number: 10160064Abstract: A purpose of the present invention is to provide a flux having an improved cleaning property by suppressing a carbonization of a flux residue. A flux contains an organic acid, a thixotropic agent, rosin and a solvent wherein a fatty acid monoalkylol amide having 14-20 carbon atoms is contained as the thixotropic agent. The fatty acid monoethanol amide is added in an amount of 3-10% by weight as the thixotropic agent. In addition, a dicarboxylic acid having 10 or less carbon atoms is added in an amount of 4-10% by weight as the organic acid. Moreover, the solvent is added in an amount of 30-60% by weight.Type: GrantFiled: August 12, 2013Date of Patent: December 25, 2018Assignee: Senju Metal Industry Co., Ltd.Inventors: Hideki Mori, Kazuya Kitazawa
-
Patent number: 9902022Abstract: Provided is a flux which can remove metal oxides to improve solder wettability and can fix the object to be soldered with flux residue. The flux contains thermosetting resin, and long-chain dibasic acid mixture including one or more species of first long-chain dibasic acid having an alkyl group in a side chain, the first long-chain dibasic acid being added as a hardening agent for hardening the thermosetting resin and an activator, and second long-chain dibasic acid having an alkyl group and an alkoxycarbonyl group in a side chain and having carbon number of 8 or more in a main chain between the carboxyl groups at opposite terminals. It is preferable that content of the thermosetting resin is 30% through 70% and content of the long-chain dibasic acid mixture is 20% through 60%.Type: GrantFiled: February 27, 2015Date of Patent: February 27, 2018Assignee: Senju Metal Industry Co., Ltd.Inventors: Masashi Uehata, Yasuyuki Yamagawa, Kazuya Kitazawa, Yoshinori Takagi
-
Publication number: 20180021803Abstract: A defect may occur in which as the amount of fluid discharged by a fluid discharge device decreases, a mask is not filled with the fluid even when the fluid is discharged. In order to fill a workpiece with the fluid, it is necessary to replace air in the workpiece corresponding to a discharge part with the fluid. The air in the workpiece is removed in advance, thereby filling the workpiece with the discharged fluid. A fluid discharge device in which, at one end of a discharge head, a suction port for sucking air in the mask on the workpiece, and a fluid discharge device having a discharge nozzle formed thereon for discharging the fluid are formed is used.Type: ApplicationFiled: January 13, 2016Publication date: January 25, 2018Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Takashi NAUCHI, Hideki NAKAMURA, Toshihiko MUTSUJI, Kazuya KITAZAWA
-
Publication number: 20170190005Abstract: Provided is a flux which can remove metal oxides to improve solder wettability and can fix the object to be soldered with flux residue. The flux contains thermosetting resin, and long-chain dibasic acid mixture including one or more species of first long-chain dibasic acid having an alkyl group in a side chain, the first long-chain dibasic acid being added as a hardening agent for hardening the thermosetting resin and an activator, and second long-chain dibasic acid having an alkyl group and an alkoxycarbonyl group in a side chain and having carbon number of 8 or more in a main chain between the carboxyl groups at opposite terminals. It is preferable that content of the thermosetting resin is 30% through 70% and content of the long-chain dibasic acid mixture is 20% through 60%.Type: ApplicationFiled: February 27, 2015Publication date: July 6, 2017Applicant: Senju Metal Industry Co., LtdInventors: Masashi Uehata, Yasuyuki Yamagawa, Kazuya Kitazawa, Yoshinori Takagi
-
Publication number: 20160184936Abstract: A purpose of the present invention is to provide a flux having an improved cleaning property by suppressing a carbonization of a flux residue. A flux contains an organic acid, a thixotropic agent, rosin and a solvent wherein a fatty acid monoalkylol amide having 14-20 carbon atoms is contained as the thixotropic agent. The fatty acid monoethanol amide is added in an amount of 3-10% by weight as the thixotropic agent. In addition, a dicarboxylic acid having 10 or less carbon atoms is added in an amount of 4-10% by weight as the organic acid. Moreover, the solvent is added in an amount of 30-60% by weight.Type: ApplicationFiled: August 12, 2013Publication date: June 30, 2016Applicant: SENJU METAL INDUSTRY CO,. LTD.Inventors: Hideki Mori, Kazuya Kitazawa