Abstract: A radiation-sensitive resin composition includes: a polymer including a structural unit including an acid-labile group; and a compound represented by formula (1). R1, R2, and R3 each independently represent a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms; X1, X2, and X3 each independently represent a group represented by formula (2); a sum of d, e, and f is no less than 1; R4 represents a hydrocarbon group having 1 to 20 carbon atoms and R5 represents a hydrocarbon group having 1 to 20 carbon atoms, or R4 and R5 taken together represent a heterocyclic structure having 4 to 20 ring atoms, together with the sulfur atom to which R4 and R5 bond; n is 0 or 1; A? represents a monovalent sulfonic acid anion; and Y represents —COO—, —OCO—, or —N(R7)CO—.

Abstract: A semiconductor device includes a first terminal, a second terminal, and a plurality of third terminals on a substrate. Memory chips are stacked on the substrate in an offset manner. Each memory chip has first pads, second pads, and third pads thereon. A first bonding wire is electrically connected to the first terminal and physically connected to a first pad of each memory chip. A second bonding wire is electrically connected to the second terminal and physically connected to a second pad of each memory chip. A third bonding wire electrically connects one third terminal to a third pad on each memory chip. A fourth bonding wire is connected to the first bonding wire at a first pad on a first memory chip of the stack and another first pad on the first memory chip. The fourth bonding wire straddles over the second bonding wire and the third bonding wire.

Abstract: According to one embodiment, a semiconductor device includes a first electrode, a second electrode, and a wire extending between the first electrode and the second electrode. The wire includes a first conductor in contact with the first electrode and the second electrode, and a second conductor that is provided inside the first conductor and has no contact with the first electrode and the second electrode.

Abstract: A semiconductor device includes a semiconductor chip having an electrode pad, a terminal having a terminal pad, and a bonding wire. The bonding wire includes a first end portion, a first bonded portion bonded to the electrode pad, a loop portion extending between the semiconductor chip and the terminal, and a second bonded portion bonded to the terminal pad. The second bonded portion is a wedge bonded portion comprising a second end portion of the bonding wire opposite to the first end portion. A length of the first bonded portion in the first direction is greater than a length of the second bonded portion in the first direction.

Abstract: A side sealing device for a twin-roll continuous casting apparatus, which supplies molten metal to a molten metal pool portion formed by a pair of rotating mold rolls and a pair of side weirs through an immersion nozzle and causes solidified shells to be formed and to grow on peripheral surfaces of the mold rolls to manufacture a cast strip, seals end surface sides of the mold rolls by each side weir. The side sealing device includes a side weir pressing unit that presses the side weir against end surfaces of the mold rolls, and a side weir lifter that pulls the side weir at least upward in a vertical direction.

Abstract: A semiconductor device includes a first terminal, a second terminal, and a plurality of third terminals on a substrate. Memory chips are stacked on the substrate in an offset manner. Each memory chip has first pads, second pads, and third pads thereon. A first bonding wire is electrically connected to the first terminal and physically connected to a first pad of each memory chip. A second bonding wire is electrically connected to the second terminal and physically connected to a second pad of each memory chip. A third bonding wire electrically connects one third terminal to a third pad on each memory chip. A fourth bonding wire is connected to the first bonding wire at a first pad on a first memory chip of the stack and another first pad on the first memory chip. The fourth bonding wire straddles over the second bonding wire and the third bonding wire.

Abstract: A semiconductor device includes a semiconductor chip having an electrode pad, a terminal having a terminal pad, and a bonding wire. The bonding wire includes a first end portion, a first bonded portion bonded to the electrode pad, a loop portion extending between the semiconductor chip and the terminal, and a second bonded portion bonded to the terminal pad. The second bonded portion is a wedge bonded portion comprising a second end portion of the bonding wire opposite to the first end portion. A length of the first bonded portion in the first direction is greater than a length of the second bonded portion in the first direction.

Abstract: According to one embodiment, a semiconductor device includes a first electrode, a second electrode, and a wire extending between the first electrode and the second electrode. The wire includes a first conductor in contact with the first electrode and the second electrode, and a second conductor that is provided inside the first conductor and has no contact with the first electrode and the second electrode.

Abstract: A side sealing device for a twin-roll continuous casting apparatus, which supplies molten metal to a molten metal pool portion formed by a pair of rotating mold rolls and a pair of side weirs through an immersion nozzle and causes solidified shells to be formed and to grow on peripheral surfaces of the mold rolls to manufacture a cast strip, seals end surface sides of the mold rolls by each side weir. The side sealing device includes a side weir pressing unit that presses the side weir against end surfaces of the mold rolls, and a side weir lifter that pulls the side weir at least upward in a vertical direction.

Abstract: A semiconductor device of an embodiment includes a substrate including a semiconductor element, a first electrode on the substrate and electrically connected to the semiconductor element, a second electrode on the substrate and electrically connected to the semiconductor element, and a terminal spaced from the first electrode, the substrate, and the second electrode. A first bonding wire has a first bonding portion bonded to the second electrode at a first end and a second bonding portion bonded to the terminal at a second end. A second bonding wire has a third bonding portion bonded to the second electrode at a first end and a fourth bonding portion bonded to the terminal at a second end. Each of the first and second bonding wires comprise copper and have a diameter less than or equal to 100 ?m.

Abstract: An axial floss fan includes: a casino, defining a wind tunnel; a frame haying a plurality of spokes extended from the casing to the center in the radial direction of the casing so as to be across the wind tunnel, and a frame hub connecting the plurality of spokes at the center in the radial direction of the casing; a stator supported by the frame hub, in which a winding is wounded around the stator; a rotor pivotally supported by the frame hub in a rotatable manner and having a permanent magnet; an impeller fixed to the rotor and having a plurality of rotor blades; and a step part formed in at least one surface of the frame hub.

Abstract: A power transmission device which is free from a possibility of breakage of a driving member is provided. A stepping motor (driving member) 61a configured to be driven on the basis of a command signal from a controller 70, a lead screw portion 61c configured to be rotationally driven in association with the drive of the stepping motor 61a, and a power transmitting member 65 configured to move along an axial direction X of the lead screw portion 61c in accordance with the rotation of the lead screw portion 61c and transmit a power to a power transmitted member 42e are provided, and the controller 70 is configured to control the output of the command signal to the stepping motor 61a to be stopped when the power transmitting member 65 is not moved along the axial direction X.

Abstract: A seal structure capable of achieving a waterproof structure at low cost while being flexibly adaptable to design change of a wire member, a method of forming the seal structure, a wire body and an electronic apparatus using them are provided. A seal structure 15 for sealing through holes 33, 43 of housings 31, 41 in which a wire member 20 is inserted is configured to include a covering C that includes a spacer member 11 disposed on one side of the through hole, secures the spacer member 11, the wire member 20 and the housings 31, 41 to each other and seals them.

Abstract: A surface mount type semiconductor device is disclosed. The semiconductor device has testing lands on a lower surface of a wiring substrate with a semiconductor chip mounted thereon. Lower surface-side lands with solder balls coupled thereto respectively and testing lands with solder balls not coupled thereto are formed on a lower surface of a wiring substrate. To suppress the occurrence of contact imperfection between the testing lands and land contacting contact pins provided in a probe socket, the diameter of each testing land is set larger than the diameter of each lower surface-side land. Even when the wiring substrate is reduced in size, electrical characteristic tests using the testing lands can be done with high accuracy.

Abstract: A surface mount type semiconductor device is disclosed. The semiconductor device has testing lands on a lower surface of a wiring substrate with a semiconductor chip mounted thereon. Lower surface-side lands with solder balls coupled thereto respectively and testing lands with solder balls not coupled thereto are formed on a lower surface of a wiring substrate. To suppress the occurrence of contact imperfection between the testing lands and land contacting contact pins provided in a probe socket, the diameter of each testing land is set larger than the diameter of each lower surface-side land. Even when the wiring substrate is reduced in size, electrical characteristic tests using the testing lands can be done with high accuracy.

Abstract: A power transmission device which is free from a possibility of breakage of a driving member is provided. A stepping motor (driving member) 61a configured to be driven on the basis of a command signal from a controller 70, a lead screw portion 61c configured to be rotationally driven in association with the drive of the stepping motor 61a, and a power transmitting member 65 configured to move along an axial direction X of the lead screw portion 61c in accordance with the rotation of the lead screw portion 61c and transmit a power to a power transmitted member 42e are provided, and the controller 70 is configured to control the output of the command signal to the stepping motor 61a to be stopped when the power transmitting member 65 is not moved along the axial direction X.

Abstract: A seal structure capable of achieving a waterproof structure at low cost while being flexibly adaptable to design change of a wire member, a method of forming the seal structure, a wire body and an electronic apparatus using them are provided. A seal structure 15 for sealing through holes 33, 43 of housings 31, 41 in which a wire member 20 is inserted is configured to include a covering C that includes a spacer member 11 disposed on one side of the through hole, secures the spacer member 11, the wire member 20 and the housings 31, 41 to each other and seals them.

Abstract: A game machine and information storage medium which can change at least one of game termination numbers specified for items including a lap number, life, time limit, player's vehicles, game points and game stages, for player's benefit, in comparison with the normal game termination number to be set by reception of a game charge for a normal one play of the game. This game machine comprises: an additional charge processing section for receiving an additional charge before game termination; a game termination number setting section for setting the game termination number for player's benefit in comparison with the normal game termination number set by reception of a game charge for a normal one play of the game; and a game termination processing section for processing for terminating the game when a specific number of laps or a time limit reaches the changed game termination number.