Abstract: Provided is a production method for indan and hydrindane, including a reaction step of introducing a raw material composition including tetrahydroindene into a continuous reactor including a solid catalyst containing platinum, and bringing the raw material composition into contact with the solid catalyst under the conditions of 150° C. to 350° C. to obtain a reaction product including indan and hydrindane, in which the amount (mol/min) of hydrogen molecules is 5 times or less the amount (mol/min) of tetrahydroindene, and the amount (mol/min) of oxygen molecules is 0.1 times or less the amount (mol/min) of tetrahydroindene.

Abstract: A secondary battery includes a positive electrode, a negative electrode, and a separator. The separator is interposed between the positive electrode and the negative electrode. The separator includes a porous layer, a first adhesion layer, and a second adhesion layer. The first adhesion layer is provided between the porous layer and the positive electrode, and is adhered to the positive electrode. The second adhesion layer is provided between the porous layer and the negative electrode, and is adhered to the negative electrode. After the separator is heated at a heating temperature of 130° C.±5° C. for a heating time of one hour, an adhesion strength of the first adhesion layer with respect to the positive electrode is larger than an adhesion strength of the first adhesion layer with respect to the porous layer, and an adhesion strength of the second adhesion layer with respect to the negative electrode is larger than an adhesion strength of the second adhesion layer with respect to the porous layer.

Abstract: A non-aqueous electrolyte secondary battery is provided and includes an electrode body and a non-aqueous electrolytic solution. The electrode body includes a plurality of positive electrodes, a plurality of negative electrodes, and a plurality of separators, and the positive electrodes and the negative electrodes are stacked such that the separators are sandwiched therebetween, and such that the separators are protruded from peripheral edges of the positive electrodes and negative electrodes. Peripheral edges of the separators adjacent to each other with the positive electrode interposed therebetween have contact with each other, and peripheral edges of the separators adjacent to each other with the negative electrode interposed therebetween have contact with each other. The separator includes a substrate, a first surface layer provided on a first surface of the substrate, and a second surface layer provided on a second surface of the substrate.

Abstract: Provided is a semiconductor mounting structure capable of suppressing cracks generated in solder and effectively radiating heat of a heat-generated semiconductor. A DRAM package, a SoC board on which the DRAM package is mounted, and a main board on which the SoC board is mounted are provided. A silicon chip is mounted on a surface of the SoC board facing the main board, and the main board has an opening portion at least at a position facing the silicon chip of the SoC board.

Abstract: A method for producing xylene, including a conversion reaction step of bringing a raw material containing a light hydrocarbon having 2 to 7 carbon atoms as a main component into contact with a crystalline aluminosilicate-containing catalyst to produce a product containing a monocyclic aromatic hydrocarbon having 6 to 8 carbon atoms and a xylene conversion step of subjecting the product to a disproportionation reaction or a transalkylation reaction.

Abstract: The present invention provides an indene composition having a content of indene of 80 to 99.5% by mass, in which a content ratio of a hydrocarbon compound having a condensed ring structure of a 5-membered ring and a 6-membered ring, and having 9 or 10 carbon atoms, in a component contained in addition to indene, is 90% by mass or more, and a content of benzonitrile is 0.5% by mass or less, and a content of sulfur is 5 ppm by mass or less.

Abstract: A package includes a flat portion to which an imaging element chip is fixed, a wall portion surrounding a fixed surface of the imaging element chip in the flat portion, and a plurality of first terminals electrically connected to the imaging element chip. A protective cover seals the imaging element chip in a state where the protective cover overlaps the wall portion. A conductive member is provided between the first terminal exposed from a rear surface of the package and a second terminal formed on a circuit board disposed to face the rear surface of the package to fix the package and the circuit board and electrically connect the first terminal and the second terminal to each other. The protective cover and the wall portion are fixed by an adhesive having a Young's modulus of 500 MPa or more.

Abstract: The present invention provides an indene composition having a content of indene of 80 to 99.5% by mass, in which a content ratio of a hydrocarbon compound having a condensed ring structure of a 5-membered ring and a 6-membered ring, and having 9 or 10 carbon atoms, in a component contained in addition to indene, is 90% by mass or more, and a content of benzonitrile is 0.5% by mass or less, and a content of sulfur is 5 ppm by mass or less.

Abstract: A method for producing xylene, including a conversion reaction step of bringing a raw material containing a light hydrocarbon having 2 to 7 carbon atoms as a main component into contact with a crystalline aluminosilicate-containing catalyst to produce a product containing a monocyclic aromatic hydrocarbon having 6 to 8 carbon atoms and a xylene conversion step of subjecting the product to a disproportionation reaction or a transalkylation reaction.

Abstract: An imaging unit (50) includes an imaging sensor chip (1), a package substrate (2) on which the imaging sensor chip (1) is mounted, an adhesion member (5) that adheres a back surface of the imaging sensor chip (1) opposite to a light receiving surface (10) and a bottom surface (2d) that is a surface of the package substrate (2) on which the imaging sensor chip (1) is mounted to each other, and a circuit board (52) that is adhered to a back surface of the package substrate (2) opposite to the bottom surface (2d). The adhesion member (5) is composed of a central adhesion part (5a) adhered to a central portion (1A) of the imaging sensor chip (1) and a peripheral adhesion part (5b) adhered to a peripheral portion (1B) of the imaging sensor chip (1) that is separated from the central portion (1A).

Abstract: An imager includes: an imaging sensor chip; a fixing member to which the imaging sensor chip is fixed, and which is electrically connected to the imaging sensor chip and has a first linear expansion coefficient; and a circuit board that is fixed to the fixing member via a conductive member, the circuit board comprises a first member having the first linear expansion coefficient and a second member having a second linear expansion coefficient smaller than the first linear expansion coefficient and larger than a linear expansion coefficient of a semiconductor substrate forming the imaging sensor chip, and a content of the second member in the back side portion is greater than a content of the second member in the front side portion.

Abstract: An imager includes: a fixing member as defined herein; a sealing member as defined herein; a circuit board as defined herein; and a conductive member as defined herein, in a state of being viewed from a direction perpendicular to a light receiving surface of the imaging sensor chip, an outer edge of a region where the conductive member is disposed overlaps the wall portion of the fixing member, and a distance between a position overlapping the outer edge in the wall portion and an end of the wall portion on a side of the concave portion is 20% or more of a width of the wall portion in a direction parallel to the light receiving surface.

Abstract: An imager includes: an imaging sensor chip; a fixing member to which the imaging sensor chip is fixed, and which is electrically connected to the imaging sensor chip and has a first linear expansion coefficient; and a circuit board that is fixed to the fixing member via a conductive member, the circuit board comprises a first member having the first linear expansion coefficient and a second member having a second linear expansion coefficient smaller than the first linear expansion coefficient and larger than a linear expansion coefficient of a semiconductor substrate forming the imaging sensor chip, and a content of the second member in the back side portion is greater than a content of the second member in the front side portion.

Abstract: An imager includes: a fixing member as defined herein; a sealing member as defined herein; a circuit board as defined herein; and a conductive member as defined herein, in a state of being viewed from a direction perpendicular to a light receiving surface of the imaging sensor chip, an outer edge of a region where the conductive member is disposed overlaps the wall portion of the fixing member, and a distance between a position overlapping the outer edge in the wall portion and an end of the wall portion on a side of the concave portion is 20% or more of a width of the wall portion in a direction parallel to the light receiving surface.

Abstract: A work machine includes: a bed having a table positioned on the upper surface thereof; sidewalls positioned to the left and right of the bed and projecting to the rear of the rear surface of the bed; support members for each supporting the bed in relation to a floor surface by using two points on the sidewalls to the left and right of the bed, and using at least one other point; a vertically moving body for moving along a pair of left and right vertical guides positioned in the vertical direction down to the vicinity of the floor surface on the rear surface of the bed; and a vertical drive means for moving the vertically moving body as one of the abovementioned relative movements, and having a pair of left and right feed screws positioned in parallel with the vertical guides.

Abstract: A machine tool includes: a bed, the upper surface of which has the table provided thereon; a cut debris duct which is provided so as to extend rearward from a cut debris discharge opening open at the center, in the left-right direction, of the rear face of the bed, and which discharges cut debris from within the bed to outside of the machine tool; a bifurcated vertically movable body which vertically moves along a pair of vertical guides, and which straddles the cut debris duct, the pair of vertical guides vertically extending on the rear face of the bed at positions on both the left and right sides of the cut debris duct; and a pair of left and right feed screws which extend parallel to the vertical guides, and which move the vertically movable body along the vertical guides.

Abstract: A machine tool includes: a bed, the upper surface of which has the table provided thereon; a cut debris duct which is provided so as to extend rearward from a cut debris discharge opening open at the center, in the left-right direction, of the rear face of the bed, and which discharges cut debris from within the bed to outside of the machine tool; a bifurcated vertically movable body which vertically moves along a pair of vertical guides, and which straddles the cut debris duct, the pair of vertical guides vertically extending on the rear face of the bed at positions on both the left and right sides of the cut debris duct; and a pair of left and right feed screws which extend parallel to the vertical guides, and which move the vertically movable body along the vertical guides.

Abstract: A work machine includes: a bed having a table positioned on the upper surface thereof; sidewalls positioned to the left and right of the bed and projecting to the rear of the rear surface of the bed; support members for each supporting the bed in relation to a floor surface by using two points on the sidewalls to the left and right of the bed, and using at least one other point; a vertically moving body for moving along a pair of left and right vertical guides positioned in the vertical direction down to the vicinity of the floor surface on the rear surface of the bed; and a vertical drive means for moving the vertically moving body as one of the abovementioned relative movements, and having a pair of left and right feed screws positioned in parallel with the vertical guides.

Abstract: According to the machine tool according to the present invention, a top-bottom guide is attached to a back surface of a base frame. By being guided by this top-bottom guide, the lifter moves in the top-bottom direction with respect to the base frame. A drive source which drives rotation of a top-bottom feed screw which extends parallel to the top-bottom guide is attached to a back surface of the base frame. This drive source is coupled with a bottom end of the top-bottom feed screw. As a result, compared to when the drive source is coupled with a top end of the top-bottom feed screw, the center of gravity of the machine tool can be set to a lower position. In this way, a machine tool can be increased in stability.

Abstract: According to the machine tool according to the present invention, a top-bottom guide is attached to a back surface of a base frame. By being guided by this top-bottom guide, the lifter moves in the top-bottom direction with respect to the base frame. A drive source which drives rotation of a top-bottom feed screw which extends parallel to the top-bottom guide is attached to a back surface of the base frame. This drive source is coupled with a bottom end of the top-bottom feed screw. As a result, compared to when the drive source is coupled with a top end of the top-bottom feed screw, the center of gravity of the machine tool can be set to a lower position. In this way, a machine tool can be increased in stability.