Abstract: A resin composition containing graft copolymer having at least one isocyanate group and 10,000 to 20,000 number-average molecular weight or high-molecular-weight polymer having at least one isocyanate group and 10,000 to 200,000 number-average molecular weight, and low-molecular-weight polymer having or not having an isocyanate group and 500 to 8,000 number-average molecular weight. This resin composition has tackiness at ordinary temperature, and long pot life. It can be used for reactive hot melt type adhesives (which can omit hot press process), reactive hot melt type pressure-sensitive adhesives, or coating material.

Abstract: There is disclosed a resin composition containing graft copolymer having at least one isocyanate group and 10,000 to 20,000 of number-average molecular weight or high-molecular-weight polymer having at least one isocyanate group and 10,000 to 200,000 of number-average molecular weight, and low-molecular-weight polymer having or not having an isocyanate group and 500 to 8,000 of number-average molecular weight is disclosed. This resin composition has tackiness at ordinary temperature, and long pot life. It can be used to reactive hot melt type adhesives (which can omit hot press process), reactive hot melt type pressure-sensitive adhesives, or coating material.

Abstract: There is disclosed an actinic-radiation-curing, hot-melt pressure-sensitive adhesive composition, which comprises a mixture in a limited mixing ratio of an acrylic high-molecular-weight polymer that is made up of main chain having a molecular weight of 8,000 to 100,000 and a glass transition temperature of -75.degree. to -20.degree. C., and branched chain, in which the main chains and/or branched chains have or at least one ethylenically unsaturated group; and a low-molecular-weight polymer having a molecular weight of 500 to 8,000 and a glass transition temperature of lower than 100.degree. C., which polymer has or does not have an ethylenically unsaturated group in the molecule.

Abstract: A semiconductor sealing resin composition which comprises (a) a modified epoxy resin which is a graft copolymer of a epoxy resin and a vinyl polymer having dispersed therein a silicone rubber with an average particle diameter less than 1.0.mu.; (b) a curing agent; and (c) an inorganic filler. The sealing composition has a low elastic modulus, a low heat expansion coefficient, a high resistance to heat and a high resistance to thermal expansion.

Abstract: This invention provides a photosetting resin composition suitable as a coating material for optical transmission glass fibers. Owing to the inclusion of a urethane-modified (meth)acrylate and a monoacrylate represented by the following general formula [I]:CH.sub.2 .dbd.CHCO(OC.sub.2 H.sub.4).sub.n OCH.sub.2 CH(C.sub.2 H.sub.5)(CH.sub.2).sub.3 CH.sub.3 [I]wherein n stands for an integer of 1-8, the photosetting resin composition enjoys a high photosetting speed and permits the formation of a coating film of a low modulus of elasticity. Moroever, the modulus of elasticity of the coating film has small temperature dependency at low temperatures. The present invention can hence provide light-transmitting glass fibers having excellent characteristics in optical transmission. The preferred monomer has been identified in the resin parts as 2-ethyl hexoxy ethyl acrylate, and also as 2-(2-ethylhexoxy) ethyl acrylate, and further as 2-[(2-ethylhexyl)oxy]ethyl acrylate.