Patents by Inventor Kazuya SOEJIMA

Kazuya SOEJIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin Composition, Method for Manufacturing Cured Product, Cured Product, Patterned Cured Product, Interlayer Insulation Film, Cover Coating Layer, Surface Protection Film, and Electronic Component
    Publication number: 20220291584
    Abstract: A resin composition comprising the following component (A), the following component (B), and one or more selected from the group consisting of the following component (C) and the following component (D).
    Type: Application
    Filed: August 8, 2019
    Publication date: September 15, 2022
    Inventors: Ayaka AZUMA, Satoshi ABE, Kazuya SOEJIMA
  • Photosensitive resin composition, cured product of same, interlayer insulating film, surface protective film and electronic component
    Patent number: 11021572
    Abstract: Provided is a photosensitive resin composition containing; (A) a polymer having an acidic functional group or a substituent derived therefrom; (B) a photoreactive compound; (C) a solvent; and (D) a nitrogen-containing aromatic compound represented by the following general formula (1).
    Type: Grant
    Filed: July 25, 2017
    Date of Patent: June 1, 2021
    Assignee: HD MICROSYSTEMS, LTD.
    Inventors: Ayaka Azuma, Satoshi Abe, Kazuya Soejima, Masato Nishimura, Tadamitsu Nakamura
  • Polymide precursor resin composition
    Patent number: 10725379
    Abstract: A resin composition including the following components (a) and (b). (a) A polyimide precursor having a structural unit represented by the following general formula (1); and (b) a compound represented by the following general formula (2): wherein in the formula R1 is a tetravalent organic group, R2 is a divalent organic group and R3 and R4 are independently a hydrogen atom, an alkyl group, a cycloalkyl group or a monovalent organic group having a carbon-carbon unsaturated double bond.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: July 28, 2020
    Assignee: Hitachi Chemical DuPont MicroSystems, Ltd.
    Inventors: Keishi Ono, Tetsuya Enomoto, Masayuki Ohe, Keiko Suzuki, Kazuya Soejima, Etsuharu Suzuki
  • PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT OF SAME, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM AND ELECTRONIC COMPONENT
    Publication number: 20190161580
    Abstract: Provided is a photosensitive resin composition containing; (A) a polymer having an acidic functional group or a substituent derived therefrom; (B) a photoreactive compound; (C) a solvent; and (D) a nitrogen-containing aromatic compound represented by the following general formula (1).
    Type: Application
    Filed: July 25, 2017
    Publication date: May 30, 2019
    Inventors: Ayaka AZUMA, Satoshi ABE, Kazuya SOEJIMA, Masato NISHIMURA, Tadamitsu NAKAMURA
  • Polyimide precursor, photosensitive resin composition containing said polyimide precursor, and cured-pattern-film manufacturing method and semiconductor device using said photosensitive resin composition
    Patent number: 9751984
    Abstract: A polyimide precursor including a structural unit represented by the following general formula (1) in a ratio of 50 mol % or more based on the total structural units. In the general formula (1), A is a tetravalent organic group represented by the following general formula (2a), a tetravalent organic group represented by the following general formula (2b), or a tetravalent organic group represented by the following general formula (2c), and B is a divalent organic group represented by the following general formula (3).
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: September 5, 2017
    Assignee: HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
    Inventors: Tetsuya Enomoto, Keishi Ono, Masayuki Ohe, Keiko Suzuki, Kazuya Soejima, Etsuharu Suzuki
  • POLYIMIDE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAID POLYIMIDE PRECURSOR, AND CURED-PATTERN-FILM MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE USING SAID PHOTOSENSITIVE RESIN COMPOSITION
    Publication number: 20150353685
    Abstract: A polyimide precursor including a structural unit represented by the following general formula (1) in a ratio of 50 mol % or more based on the total structural units. In the general formula (1), A is a tetravalent organic group represented by the following general formula (2a), a tetravalent organic group represented by the following general formula (2b), or a tetravalent organic group represented by the following general formula (2c), and B is a divalent organic group represented by the following general formula (3).
    Type: Application
    Filed: December 19, 2013
    Publication date: December 10, 2015
    Applicant: HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
    Inventors: Tetsuya Enomoto, Keishi Ono, Masayuki Ohe, Keiko Suzuki, Kazuya Soejima, Etsuharu Suzuki
  • POLYMIDE PRECURSOR RESIN COMPOSITION
    Publication number: 20150337116
    Abstract: A resin composition including the following components (a) and (b). (a) A polyimide precursor having a structural unit represented by the following general formula (1); and (b) a compound represented by the following general formula (2): wherein in the formula R1 is a tetravalent organic group, R2 is a divalent organic group and R3 and R4 are independently a hydrogen atom, an alkyl group, a cycloalkyl group or a monovalent organic group having a carbon-carbon unsaturated double bond.
    Type: Application
    Filed: December 13, 2013
    Publication date: November 26, 2015
    Applicant: Hitachi Chemical DuPont MicroSystems, Ltd.
    Inventors: Keishi ONO, Tetsuya ENOMOTO, Masayuki OHE, Keiko SUZUKI, Kazuya SOEJIMA, Etsuharu SUZUKI