Abstract: In a multilayer substrate, a quasi-coaxial line is formed as a structure for transmitting a high-frequency signal generated by a mounted high-frequency device from an uppermost layer to a lowermost layer to externally output and for transmitting an externally input high-frequency signal from the lowermost layer to the high-frequency device. The quasi-coaxial line has: a central conductor being a vertical through hole via that connects between a metal pattern formed on an upper surface of the uppermost layer and a metal pattern formed on a lower surface of the lowermost layer; and outer conductors being a plurality of interlayer vias that are circularly arranged around the central conductor and connect between two or more layers. Whole or a part of the vertical through hole via is substituted by a capacitor structure formed of conductor pads facing each other without any via.

Abstract: In a multilayer substrate, a quasi-coaxial line is formed as a structure for transmitting a high-frequency signal generated by a mounted high-frequency device from an uppermost layer to a lowermost layer to externally output and for transmitting an externally input high-frequency signal from the lowermost layer to the high-frequency device. The quasi-coaxial line has: a central conductor being a vertical through hole via that connects between a metal pattern formed on an upper surface of the uppermost layer and a metal pattern formed on a lower surface of the lowermost layer; and outer conductors being a plurality of interlayer vias that are circularly arranged around the central conductor and connect between two or more layers. Whole or a part of the vertical through hole via is substituted by a capacitor structure formed of conductor pads facing each other without any via.

Abstract: Four rows on one side of linear arrays arranged at equal intervals in the vertical direction and arranged at a predetermined interval in the horizontal direction form transmission channels and remaining twelve rows form a reception channel group. Among the remaining twelve rows, linear arrays of four rows in the center form a reception-first-array with each row set as a channel unit. Linear arrays of eight rows on both sides form a reception-second-array with two rows set as a channel unit. In wide-angle-middle-detection-processing, signals are combined using the reception-first-array. In long-detection-processing, signals are combined using the reception-second-array. Second null of a radiation pattern by a transmission array and first null of the reception-second-array are matched. The first null of the transmission array is filled such that a gain difference between the first null and a first side lobe of the transmission array is within a predetermined value.

Abstract: Four rows on one side of linear arrays arranged at equal intervals in the vertical direction and arranged at a predetermined interval in the horizontal direction form transmission channels and remaining twelve rows form a reception channel group. Among the remaining twelve rows, linear arrays of four rows in the center form a reception-first-array with each row set as a channel unit. Linear arrays of eight rows on both sides form a reception-second-array with two rows set as a channel unit. In wide-angle-middle-detection-processing, signals are combined using the reception-first-array. In long-detection-processing, signals are combined using the reception-second-array. Second null of a radiation pattern by a transmission array and first null of the reception-second-array are matched. The first null of the transmission array is filled such that a gain difference between the first null and a first side lobe of the transmission array is within a predetermined value.

Abstract: A high-frequency module has an antenna configured by integrally connecting a slot plate laid out with radiation slots to a plate having plural thin plates formed with a waveguide for supplying power to the slot plate, using a diffusion bonding. The waveguide of the antenna is connected to a dielectric waveguide of a high-frequency package via a waveguide provided on a resin substrate, thereby configuring a slot antenna at low cost, and connecting a power-supply slot of the slot antenna to a waveguide terminal of the high-frequency package with low loss.

Abstract: To provide a high-frequency module having an antenna configured by integrally connecting a slot plate laid out with radiation slots to a plate having plural thin plates formed with a waveguide for supplying power to the slot plate, using a diffusion bonding. The waveguide of the antenna is connected to a dielectric waveguide of a high-frequency package via a waveguide provided on a resin substrate, thereby configuring a slot antenna at low cost, and connecting a power-supply slot of the slot antenna to a waveguide terminal of the high-frequency package with low loss.

Abstract: The invention provides a dielectric substrate; a ground conductor pattern is formed on one surface of the dielectric substrate and which has a ground conductor pattern omission portion; a strip conductor pattern formed on a surface of the dielectric substrate opposite to the surface having the ground conductor pattern; a conductor pattern for shorting of a waveguide formed so as to be continuously connected to the strip conductor pattern; connecting conductors for connecting the ground conductor pattern and the conductor pattern to each other within the dielectric substrate; and a waveguide connected to the dielectric substrate so as to correspond to the ground conductor pattern omission portion. Also, a microstrip line is constituted by the strip conductor pattern, the ground conductor pattern, and the dielectric substrate. Further, a dielectric waveguide shorting portion is constituted by the conductor pattern, the ground conductor pattern, and the connecting conductors.

Abstract: The invention provides a dielectric substrate; a ground conductor pattern is formed on one surface of the dielectric substrate and which has a ground conductor pattern omission portion; a strip conductor pattern formed on a surface of the dielectric substrate opposite to the surface having the ground conductor pattern; a conductor pattern for shorting of a waveguide formed so as to be continuously connected to the strip conductor pattern; connecting conductors for connecting the ground conductor pattern and the conductor pattern to each other within the dielectric substrate; and a waveguide connected to the dielectric substrate so as to correspond to the ground conductor pattern omission portion. Also, a microstrip line is constituted by the strip conductor pattern, the ground conductor pattern, and the dielectric substrate. Further, a dielectric waveguide shorting portion is constituted by the conductor pattern, the ground conductor pattern, and the connecting conductors.

Abstract: A phase shifter includes an FET 2a having its drain electrode connected to an input/output terminal 1a; and FET 2b having its drain electrode connected to the source electrode of the FET 2a and its source electrode connected to an input/output terminal 1b; and FET 2c having its drain electrode connected to the source electrode of the FET 2a; and an inductor 3a having its first terminal connected to the source electrode of the FET 2c and its second terminal connected to a ground. It can reduce the insertion loss by narrowing the gate width of the FET 2a, and carries out the phase shift of a high-frequency signal with suppressing the reflection.

Abstract: The invention provides a dielectric substrate; a ground conductor pattern is formed on one surface of the dielectric substrate and which has a ground conductor pattern omission portion; a strip conductor pattern formed on a surface of the dielectric substrate opposite to the surface having the ground conductor pattern; a conductor pattern for shorting of a waveguide formed so as to be continuously connected to the strip conductor pattern; connecting conductors for connecting the ground conductor pattern and the conductor pattern to each other within the dielectric substrate; and a waveguide connected to the dielectric substrate so as to correspond to the ground conductor pattern omission portion. Also, a microstrip line is constituted by the strip conductor pattern, the ground conductor pattern, and the dielectric substrate. Further, a dielectric waveguide shorting portion is constituted by the conductor pattern, the ground conductor pattern, and the connecting conductors.

Abstract: A phase shifter includes an FET 2a having its drain electrode connected to an input/output terminal 1a; an FET 2b having its drain electrode connected to the source electrode of the FET 2a and its source electrode connected to an input/output terminal 1b; an FET 2c having its drain electrode connected to the source electrode of the FET 2a; and an inductor 3a having its first terminal connected to the source electrode of the FET 2c and its second terminal connected to a ground. It can reduce the insertion loss by narrowing the gate width of the FET 2a, and carries out the phase shift of a high-frequency signal with suppressing the reflection.

Abstract: The invention provides a dielectric substrate; a ground conductor pattern is formed on one surface of the dielectric substrate and which has a ground conductor pattern omission portion; a strip conductor pattern formed on a surface of the dielectric substrate opposite to the surface having the ground conductor pattern; a conductor pattern for shorting of a waveguide formed so as to be continuously connected to the strip conductor pattern; connecting conductors for connecting the ground conductor pattern and the conductor pattern to each other within the dielectric substrate; and a waveguide connected to the dielectric substrate so as to correspond to the ground conductor pattern omission portion. Also, a microstrip line is constituted by the strip conductor pattern, the ground conductor pattern, and the dielectric substrate. Further, a dielectric waveguide shorting portion is constituted by the conductor pattern, the ground conductor pattern, and the connecting conductors.

Abstract: A miniaturized phase shifter and a multi-bit phase shifter are provided, in which filters are constructed using capacitors at FET pinch-off and pass phase can be shifted by turning the FET on and off, the phase shifter including: a first FET having a drain electrode connected to an input terminal and a source electrode connected to an output terminal; a second FET, in which one of a drain electrode and a source electrode thereof is connected to the source electrode of the first FET and the other is connected to ground via a first inductor; and a third FET, in which one of a drain electrode and a source electrode thereof is connected to the drain electrode of the first FET and the other is connected to ground via a second inductor.

Abstract: A miniaturized phase shifter and a multi-bit phase shifter are provided, in which filters are constructed using capacitors at FET pinch-off and pass phase can be shifted by turning the FET on and off, the phase shifter including: a first FET having a drain electrode connected to an input terminal and a source electrode connected to an output terminal; a second FET, in which one of a drain electrode and a source electrode thereof is connected to the source electrode of the first FET and the other is connected to ground via a first inductor; and a third FET, in which one of a drain electrode and a source electrode thereof is connected to the drain electrode of the first FET and the other is connected to ground via a second inductor.

Abstract: A phase shifter, which can switch between a phase delay circuit and a phase leading circuit consisting of inductors and capacitors, is constituted by disposing FETs having inductors or capacitors arranged in parallel with the source and drain electrodes of each FET connected and controlling a bias voltage to be applied to the gate electrodes of the FETs to switch between the on and off conditions of the FETs. Thus, a phase shifter obtained has a small frequency characteristic.

Abstract: There is provided a small size phase shifter which can shift a phase by 180 degrees wherein the accuracy of preset phase is less dependent on frequency. The phase shifter comprises first to fourth switches provided between a first line pair and a second line pair. By turning the first and second switches ON and the third and fourth switches OFF, a signal inputted to the first line pair is outputted from the second line pair in phase. By turning the first and second switches OFF and the third and fourth switches ON, a signal inputted to the first line pair is outputted from the second line pair out of phase. A small-size phase shifter which has the accuracy of preset phase less dependent on frequency can then be obtained.

Abstract: A transmit-receive module for a phased array radar comprises a phase shifter, high-power amplifier, low-noise amplifier, and duplexer which are constituted with field-effect transistors and a control circuit for processing negative-voltage signal data to control and drive the above RF devices.Therefore, a compact small-power-consumption transmit-receive module is obtained because a level conversion circuit for driving the RF devices is disused and the RF devices are directly driven by a control circuit. Moreover, the entire transmit-receive module can be downsized because a plurality of unit arrays are constituted with one control circuit.

Abstract: An integrated circuit package having enhanced mounting density is provided. The package includes a microwave integrated circuit and a drive circuit therefor, both accommodated in a casing having a layer structure made of a multi-layer ceramic. Through holes in a multi-layer ceramic are utilized for wiring so that the number of conductive tracks provided on the same plane can be reduced and the mounting density can be enhanced. The integrated circuit and the drive circuit are disposed in the casing vertically with respect to each other to reduce the overall longitudinal dimension of the package and enhance mounting density. High frequency connectors adapted to feed high frequency signals to the integrated circuit, and connector pins adapted to supply external control signals and a power signal to the drive circuit, are connected on the underside surface of the casing.

Abstract: A case for housing integrated microwave circuits comprises a metal conductor body for carrying the integrated circuits on the upper surface thereof, the first and second dielectric substrates stacked on each other and also stacked on the upper surface of the body and having square holes for receiving the integrated circuits. The first substrate has strip line patterns for connecting signal input/output pads of the integrated circuits to each other and external signal terminals, and openings each filled with a conductive metal connected to the body. The second substrate has openings each filled with the conductive metal and electromagnetic shielding partitions between the adjacent square holes to provide isolation of a wave guide mode between the integrated circuits. The openings of both substrates are correspondingly arranged to connect the conductive metals thereof so that electromagnetic shielding is effected.

Abstract: An antenna system comprises a plurality of element antennas for both transmission and reception of signals, which are constituted on an optical profile surface and are divided into a plurality of blocks, each including at least more than two element antennas; a plurality of miniature transmitters/receivers connected respectively to the plurality of element antennas, which are adapted to switch between a transmission mode and a reception mode, to control the phase shift of transmission signals and amplify the controlled transmission signals in the transmission mode or to control the phase shift of reception signals and amplify the controlled reception signals; a plurality of power supply circuits connected respectively to the plurality of blocks, each of which is adapted to distribute the transmission signals to the corresponding block, or to synthesize the reception signal from the corresponding block; a plurality of reception signal converting units connected respectively to the plurality of power supply cir