Abstract: A solder printing inspection device includes: an illumination device that irradiates, with a predetermined light, a printed circuit board on which a solder paste is printed; an imaging device that takes an image of the printed circuit board irradiated with the predetermined light and obtains image data; and a control device that: based on the image data, obtain three-dimensional measurement data of the solder paste printed on the printed circuit board, based on the three-dimensional measurement data, extracts upper portion shape data of an upper portion of the solder paste, the upper portion having a height equal to or higher than a predetermined height, and compares the upper portion shape data with a predetermined criterion and determines whether a quality of a three-dimensional shape of the upper portion of the solder paste is good or poor.

Abstract: A substrate foreign matter inspection device includes: an image data obtaining device that obtains image data of a target inspection area in the printed circuit board including a printed portion of the solder paste; a storage that stores a neural network and a model, the model being generated by learning of the neural network that includes an encoding portion and a decoding portion by using, as learning data, only image data of the target inspection area that do not include any foreign matter; and a control device that obtains reconfigured image data by inputting original image data obtained by the image data obtaining device into the model, compares the original image data with the reconfigured image data, and determines whether any foreign matter is present or absent on the printed circuit board based on a result of comparison with the reconfigured image data.

Abstract: A screen mask inspection device inspects a screen mask including a screen opening that forms a printing pattern, and includes: an inspection control device that detects solder position information of a solder paste printed on a substrate via the screen opening, and based on the solder position information, determines whether a quality of printing using the screen mask is good or bad, the solder position information being based on an amount of positional misalignment of the solder paste actually printed on the substrate relative to a predetermined reference position.

Abstract: A component mounting system includes: a component mounting machine that mounts an electronic component having a predetermined electrode portion on a solder printed on a substrate, the electronic component being fixed to the substrate with a thermosetting adhesive; and an adhesive inspection device. The component mounting machine: sets, with regard to the electronic component to be fixed with the adhesive that cures at a temperature lower than a melting temperature of the solder, a target mounting height along a height direction perpendicular to a face of the substrate on which the adhesive is applied; and mounts the electronic component at the target mounting height. The target mounting height is: an ideal mounting height based on design data; or a height lower than the ideal mounting height by a value that corresponds to a sinking of the electronic component as a result of melting of the solder.

Abstract: A component mounting system includes: a component mounting machine that mounts an electronic component having a predetermined electrode portion on a solder printed on a substrate, the electronic component being fixed to the substrate with a thermosetting adhesive; and an adhesive inspection device. The component mounting machine: sets, with regard to the electronic component to be fixed with the adhesive that cures at a temperature lower than a melting temperature of the solder, a target mounting height along a height direction perpendicular to a face of the substrate on which the adhesive is applied; and mounts the electronic component at the target mounting height. The target mounting height is: an ideal mounting height based on design data; or a height lower than the ideal mounting height by a value that corresponds to a sinking of the electronic component as a result of melting of the solder.

Abstract: A video tape recorder includes a capstan, a stationary magnetic head, a pair of rubber pinch rollers disposed on opposite sides of the capstan, and a pair of head-facing guides whereby to travel an endless tape at a high speed. Each pinch roller and head facing guide are mounted on a supporting member which may be rocked by a wire with a coil spring against the force of a tension spring so that the pinch roller and head facing guide can press the tape against the capstan and magnetic head. Such a state may be maintained by abutting the support member on a stop.