Abstract: An enclosed switchboard includes: a device containing board which contains main circuit devices such as circuit breakers; and a cable connection board which is arranged side by side adjacently to the device containing board, and contains cables that input and output electric power to/from the main circuit devices. In the enclosed switchboard, the cable connection board is configured by one housing; and the inside of the housing is divided into two by a partition plate to be comparted to a cable lead-in compartment which contains lead-in side cables and a cable lead-out compartment which contains lead-out side cables.

Abstract: An enclosed switchboard includes: a device containing board which contains main circuit devices such as circuit breakers; and a cable connection board which is arranged side by side adjacently to the device containing board, and contains cables that input and output electric power to/from the main circuit devices. In the enclosed switchboard, the cable connection board is configured by one housing; and the inside of the housing is divided into two by a partition plate to be comparted to a cable lead-in compartment which contains lead-in side cables and a cable lead-out compartment which contains lead-out side cables.

Abstract: An enclosed switchboard includes: a device containing board which contains main circuit devices such as circuit breakers; and a cable connection board which is arranged side by side adjacently to the device containing board, and contains cables that input and output electric power to/from the main circuit devices. In the enclosed switchboard, the cable connection board is configured by one housing; and the inside of the housing is divided into two by a partition plate to be comparted to a cable lead-in compartment which contains lead-in side cables and a cable lead-out compartment which contains lead-out side cables.

Abstract: An enclosed switchboard includes: a device containing board which contains main circuit devices such as circuit breakers; and a cable connection board which is arranged side by side adjacently to the device containing board, and contains cables that input and output electric power to/from the main circuit devices. In the enclosed switchboard, the cable connection board is configured by one housing; and the inside of the housing is divided into two by a partition plate to be comparted to a cable lead-in compartment which contains lead-in side cables and a cable lead-out compartment which contains lead-out side cables.

Abstract: An enclosed switchboard includes: a device containing board which contains main circuit devices such as circuit breakers; and a cable connection board which is arranged side by side adjacently to the device containing board, and contains cables that input and output electric power to/from the main circuit devices. In the enclosed switchboard, the cable connection board is configured by one housing; and the inside of the housing is divided into two by a partition plate to be comparted to a cable lead-in compartment which contains lead-in side cables and a cable lead-out compartment which contains lead-out side cables.

Abstract: An enclosed switchboard includes: a device containing board which contains main circuit devices such as circuit breakers; and a cable connection board which is arranged side by side adjacently to the device containing board, and contains cables that input and output electric power to/from the main circuit devices. In the enclosed switchboard, the cable connection board is configured by one housing; and the inside of the housing is divided into two by a partition plate to be comparted to a cable lead-in compartment which contains lead-in side cables and a cable lead-out compartment which contains lead-out side cables.

Abstract: A method of manufacturing a magnetic head device includes forming a thin film magnetic head element over a substrate, the thin film magnetic head element including a magnetoresistance (MR) element. The substrate is cut such that the MR element is exposed on a side surface of the substrate. The side surface is then polished. Afterward, a magnetically degenerated layer is removed from the thin film magnetic head element along the side surface. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Abstract: Reflecting layers in first, second and third regions are separated from a reflecting layer in the surrounding region by a separating groove. The first region is folded in a valley shape from a substrate at a groove, the first region and the second region are folded in a valley shape at a groove, the third region is folded in a valley shape from the substrate at a groove, and the second region and the third region are folded in a mountain shape by a line.

Abstract: An upper reflecting layer in a main region, a first support region and a second support region is separated from an upper reflecting layer in the surrounding region by separating grooves. The first support region and the second support region are folded in a valley shape from a substrate at grooves, and the first support region, the second support region and the main region are folded in a mountain shape, and the upper reflecting layer in the main region faces parallel to the substrate with spacing.

Abstract: An upper reflecting layer in a main region, a first support region and a second support region is separated from an upper reflecting layer in the surrounding region by separating grooves. The first support region and the second support region are folded in a valley shape from a substrate at grooves, and the first support region, the second support region and the main region are folded in a mountain shape, and the upper reflecting layer in the main region faces parallel to the substrate with spacing.

Abstract: Reflecting layers in first, second and third regions are separated from a reflecting layer in the surrounding region by a separating groove. The first region is folded in a valley shape from a substrate at a groove, the first region and the second region are folded in a valley shape at a groove, the third region is folded in a valley shape from the substrate at a groove, and the second region and the third region are folded in a mountain shape by a line.

Abstract: An apparatus and method for manufacturing magnetic head device. In one embodiment, the magnetic head device includes a thin film magnetic head element having a reproduction element part comprised of a magnetoresistance effect element formed by layering on one surface of a slider. The magnetoresistance effect element is exposed on a side to oppose a magnetic recording media. Dry etching is used to remove a degenerated layer produced on the exposed side of the magnetoresistance effect element by polishing the surface of the side opposing the magnetic recording media.

Abstract: An apparatus and method for manufacturing magnetic head device. In one embodiment, the magnetic head device includes a thin film magnetic head element having a reproduction element part comprised of a magnetoresistance effect element formed by layering on one surface of a slider. The magnetoresistance effect element is exposed on a side to oppose a magnetic recording media. Dry etching is used to remove a degenerated layer produced on the exposed side of the magnetoresistance effect element by polishing the surface of the side opposing the magnetic recording media.