Abstract: A reduced-pressure processing apparatus which comprises a wafer table, two processing chambers, and three load-locking chambers. The wafer table temporarily supports a workpiece. In the first processing chamber, a first process is performed on a workpiece under a reduced pressure, In the second processing chamber, a second process is performed on the workpiece under a reduced pressure. The first load-locking chamber is connected to the first processing chamber, for allowing to be pneumatically disconnected from the first processing chamber, and allowing a passage of a workpiece into and from the first processing chamber and to and from the temporary holding means. The second load-locking chamber is connected to the second processing chamber, for allowing to be pneumatically disconnected from the second processing chamber, and allowing a passage of a workpiece into and from the second processing chamber and to and from the temporary supporting means.