Abstract: A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.

Abstract: A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.

Abstract: A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.

Abstract: A wiring board where an electronic component is mounted on a main surface via a bump and at least a part of the periphery of the electronic component is covered with resin, the wiring board includes a dam provided at least at a part of the periphery of an area where the electronic component is mounted, on the main surface of the wiring board; wherein a surface of the dam contacting the resin has a configuration where a curved line is continuously formed.

Abstract: A circuit substrate for improving the reliability and productivity of a semiconductor device, and that semiconductor device. In a circuit substrate to which a semiconductor element is to be flip-chip mounted, at least one island-shaped electrically conductive layer is selectively disposed together with a wiring layer at an element mounting area where the semiconductor element is to be mounted, and an insulating resin layer is disposed over the island-shaped electrically conductive layer. The semiconductor element is secured at the element mounting area to the circuit substrate by an adhesion material to make a semiconductor device. With this, delaminating of the wiring layer inside the semiconductor device is suppressed, and the damage of an electrode is suppressed. The circuit substrate has high reliability and the semiconductor device, having the circuit substrate, is implemented.

Abstract: A wiring board where an electronic component is mounted on a main surface via a bump and at least a part of the periphery of the electronic component is covered with resin, the wiring board includes a dam provided at least at a part of the periphery of an area where the electronic component is mounted, on the main surface of the wiring board; wherein a surface of the dam contacting the resin has a configuration where a curved line is continuously formed.

Abstract: A circuit substrate for improving the reliability and productivity of a semiconductor device, and that semiconductor device. In a circuit substrate to which a semiconductor element is to be flip-chip mounted, at least one island-shaped electrically conductive layer is selectively disposed together with a wiring layer at an element mounting area where the semiconductor element is to be mounted, and an insulating resin layer is disposed over the island-shaped electrically conductive layer. The semiconductor element is secured at the element mounting area to the circuit substrate by an adhesion material to make a semiconductor device. With this, delaminating of the wiring layer inside the semiconductor device is suppressed, and the damage of an electrode is suppressed. The circuit substrate has high reliability and the semiconductor device, having the circuit substrate, is implemented.

Abstract: A semiconductor device includes a semiconductor element having a main surface where an outside connection terminal pad is provided. The semiconductor element is connected to a conductive layer on a supporting board via a plurality of convex-shaped outside connection terminals provided on the outside connection terminal pad and a connection member; and the connection member commonly covers the convex-shaped outside connection terminals.

Abstract: A semiconductor chip is secured in a state deformed into a substantially cylinder shape by a coating material formed on its surface. The deformed semiconductor chip is flip-chip connected to an interposer and sealed with sealing resin onto the interposer. Solder balls are provided, as external terminals, on the other side of the interposer.

Abstract: A stacked semiconductor device is disclosed that has a three-dimensional structure using general-purpose semiconductor device units (semiconductor devices) that are stacked with an interposer substrate being provided between an upper device unit and a lower device unit. The upper device unit includes a semiconductor device, a first wiring substrate, and an external connection terminal. The lower device unit includes a semiconductor device, a second wiring substrate, and a connection electrode that is prepared on the upper surface of the second wiring substrate. The interposer substrate includes a circuit board, a first conductive material connecting to the connection electrode, a second conductive material formed in a form position of the external connection terminal that is electrically connected to the second conductive material, and a third conductive material for electrically connecting the first conductive material and the second conductive material.

Abstract: A semiconductor chip is secured in a state deformed into a substantially cylinder shape by a coating material formed on its surface. The deformed semiconductor chip is flip-chip connected to an interposer and sealed with sealing resin onto the interposer. Solder balls are provided, as external terminals, on the other side of the interposer.

Abstract: A stacked semiconductor device is disclosed that has a three-dimensional structure using general-purpose semiconductor device units (semiconductor devices) that are stacked with an interposer substrate being provided between an upper device unit and a lower device unit. The upper device unit includes a semiconductor device, a first wiring substrate, and an external connection terminal. The lower device unit includes a semiconductor device, a second wiring substrate, and a connection electrode that is prepared on the upper surface of the second wiring substrate. The interposer substrate includes a circuit board, a first conductive material connecting to the connection electrode, a second conductive material formed in a form position of the external connection terminal that is electrically connected to the second conductive material, and a third conductive material for electrically connecting the first conductive material and the second conductive material.

Abstract: A substrate of a semiconductor device has a first surface on which a semiconductor element is fixed and a second surface opposite to the first surface. An adhesive is provided between the semiconductor element and the first surface of the substrate. At least one though hole is formed which extends between the first surface and the second surface of the substrate. A pattern member is formed on the first surface of the substrate so as to cover a part of an opening of the through hole.

Abstract: A substrate of a semiconductor device has a first surface on which a semiconductor element is fixed and a second surface opposite to the first surface. An adhesive is provided between the semiconductor element and the first surface of the substrate. At least one though hole is formed which extends between the first surface and the second surface of the substrate. A pattern member is formed on the first surface of the substrate so as to cover a part of an opening of the through hole.

Abstract: An ice thermal storage apparatus that uses ice as a thermal storage material, wherein without using a brine that is a heat transfer medium for chilling water to form ice, a thermal storage material in the form of an aqueous solution to which an additive is added so that supercooling can be secured stably is supercooled to the freezing point or below directly by a refrigerating apparatus, the supercooled aqueous solution is made into ice in the form of sherbet by a desupercooling apparatus over a thermal storage tank, and the remaining thermal storage material having the freezing temperature that has not been made into ice is sent again into the refrigerating apparatus to form a cycle so that ice can be formed in the thermal storage tank continuously.

Abstract: A stator for rotating electric machine includes a stator body having a stator core and a stator coil, a pair of stator clampers of a ring form which hold the stator core by clamping the same with their inner side surfaces from both sides of the stator core, a pair of stator supporting members of a ring form which are connected to the inside of a rotating machine frame so that each of the inner circumferential surfaces of the stator supporting members faces each of the outer circumferential surfaces of the stator clampers, an annular groove formed in at least one of the inner circumferential surface of the stator supporting members and the outer circumferential surface of the stator clampers, inlet and outlet ports formed in the stator clampers or the stator supporting members to be communicated with the annular groove, and an adhesive filled in the groove from the inlet with pressure.