Abstract: An optical wave guide device is manufactured by bonding an optical wave guide to an optical modulator through an upper cladding layer. The optical wave guide includes a glass substrate, a lower cladding layer and cores, and the optical modulator includes elements (heaters), which are disposed on the lower surface of a glass substrate, for modulating the light propagating in the cores, and electrodes and wire bond pads which are disposed on the front surface thereof. The elements are connected to the electrodes via through-holes. With this arrangement, there can be provided an optical waveguide device, in which cores are not degraded in manufacturing processes and elements for modulating the light propagating in the cores are unlikely to be exfoliated.

Abstract: The spacers 3 and 4 and the recess is formed on the supporting substrate 2 to support the upper cladding layer 7. The intermediate surface 22 and 23 lower than the top surface of the spacers 3 and 4 and higher than the inner bottom surface of the recess is formed on the supporting substrate 2. Each of the height between the top surface of the spacers 3 and 4 and the intermediate surfaces 22 and 23, and the height between the intermediate surfaces 22 and 23 and the inner bottom surface of the recess of the second substrate 2 becomes thin compared with the total thickness of the lower cladding layer. Thus, when the resin for the lower cladding layer 9 is cured to shrinkage, the inner stress in the resin is dispersed and the occurrence of the wrinkle 12 and the void decreases.

Abstract: An optical waveguide device includes a first substrate, where the first substrate includes a first plate and an optical waveguide region disposed on the first plate, and where the optical waveguide region includes a core for transmitting light and a cladding surrounding the core. The optical waveguide device further includes a second substrate, where the second substrate includes a second plate having a spacer. Additionally, a surface including the optical waveguide region of the first substrate opposes a surface including the spacer of the second substrate, the spacer is formed the region which is out of the core of the first substrate, a top surface of the spacer is in contact with the first substrate, the first substrate and the second substrate are bound with adhesive material, and the entire surface of the core is in contact with the adhesive material.

Abstract: A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.

Abstract: An optical multiplexer/demultiplexer having a high isolation characteristic, a small polarization dependency and capable of being reduced in size is disclosed. An end portion of a core and an end portion of a core are arranged in opposed relation to each other with a thin-film filter interposed therebetween. The end portion of the core far from the filter and the end portion of the core far from the filter are arranged in substantially parallel to each other. The core is arranged in such a manner as to branch from the filter-side end portion of the core and to be optically coupled with the core. The end portion of the core near to the filter and the end portion of the core near to the filter are curved. The end portion of the core near to the filter is curved in a manner protruded toward the core. The end portion of each of the core and the core far from the filter reaches an end of an optical waveguide, and the end portion of the core far from the filter reaches a side of the optical waveguide.

Abstract: An optical module wherein an electrical signal leak from the light-emitting device or the like or a crosstalk between a light-emitting device and a light-receiving device is difficult to occur, even if the light-emitting device or the light-receiving device is arranged close to an optical waveguide or an optical fiber. An optical waveguide is mounted as laminated on the top face of a silicon substrate. The end face of the optical waveguide is cut by a dicing blade or laser beam so as to be finished to be smooth, and a cut groove is formed on the silicon substrate by this process. A slope is formed at the edge of the cut groove between the cut groove and an electrode pad, wherein the top face of the silicon substrate and the surface of the slope are covered with an insulating film. The light-emitting device is bonded on the electrode pad with a brazing filler metal.

Abstract: A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.

Abstract: A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.

Abstract: A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.

Abstract: The spacers 3 and 4 and the recess is formed on the supporting substrate 2 to support the upper cladding layer 7. The intermediate surface 22 and 23 lower than the top surface of the spacers 3 and 4 and higher than the inner bottom surface of the recess is formed on the supporting substrate 2. Each of the height between the top surface of the spacers 3 and 4 and the intermediate surfaces 22 and 23, and the height between the intermediate surfaces 22 and 23 and the inner bottom surface of the recess of the second substrate 2 becomes thin compared with the total thickness of the lower cladding layer. Thus, when the resin for the lower cladding layer 9 is cured to shrinkage, the inner stress in the resin is dispersed and the occurrence of the wrinkle 12 and the void decreases.

Abstract: An optical multiplexer/demultiplexer having a high isolation characteristic, a small polarization dependency and capable of being reduced in size is disclosed. An end portion of a core and an end portion of a core are arranged in opposed relation to each other with a thin-film filter interposed therebetween. The end portion of the core far from the filter and the end portion of the core far from the filter are arranged in substantially parallel to each other. The core is arranged in such a manner as to branch from the filter-side end portion of the core and to be optically coupled with the core. The end portion of the core near to the filter and the end portion of the core near to the filter are curved. The end portion of the core near to the filter is curved in a manner protruded toward the core. The end portion of each of the core and the core far from the filter reaches an end of an optical waveguide, and the end portion of the core far from the filter reaches a side of the optical waveguide.

Abstract: In an optical waveguide device, a rectangle, which uses a filter insertion groove as its diagonal line and uses points on filter insertion grooves adjacent to the above filter insertion groove as its apexes, is assumed as a unit rectangle, and the size of the optical waveguide device is set to an integer multiple of the unit rectangle. In this case, even if filter insertion grooves are formed in a state in which a plurality of the optical waveguide devices are disposed in matrix, the respective optical waveguide devices can be formed in the same shape. Further, the filter insertion grooves formed to the respective optical waveguide devices do not divide portions other than the target portion of other optical waveguide devices. Therefore, the manufacturing processes of the optical waveguide device can be simplified and are suitable for mass production, and manufacturing cost can be suppressed thereby.

Abstract: A method of manufacturing an optical waveguide device includes providing an optical fiber guide for fixing an optical fiber and optical element placing portions for providing element mounting benches outside a waveguide fixing region of a silicon substrate. A metallic thin film is formed outside the waveguide fixing region of the silicon substrate. After an optical waveguide substrate is bonded to a whole of an upper surface of the silicon substrate through a bonding resin which will become an upper cladding layer, the optical waveguide substrate is diced along an edge of the waveguide fixing region, and the optical waveguide substrate outside the waveguide fixing region is removed to expose the optical fiber guide and the optical element placing portions.

Abstract: An optical wave guide device is manufactured by bonding an optical wave guide to an optical modulator through an upper cladding layer. The optical wave guide includes a glass substrate, a lower cladding layer and cores, and the optical modulator includes elements (heaters), which are disposed on the lower surface of a glass substrate, for modulating the light propagating in the cores, and electrodes and wire bond pads which are disposed on the front surface thereof. The elements are connected to the electrodes via through-holes. With this arrangement, there can be provided an optical waveguide device, in which cores are not degraded in manufacturing processes and elements for modulating the light propagating in the cores are unlikely to be exfoliated.

Abstract: In an optical waveguide device, a rectangle, which uses a filter insertion groove as its diagonal line and uses points on filter insertion grooves adjacent to the above filter insertion groove as its apexes, is assumed as a unit rectangle, and the size of the optical waveguide device is set to an integer multiple of the unit rectangle. In this case, even if filter insertion grooves are formed in a state in which a plurality of the optical waveguide devices are disposed in matrix, the respective optical waveguide devices can be formed in the same shape. Further, the filter insertion grooves formed to the respective optical waveguide devices do not divide portions other than the target portion of other optical waveguide devices. Therefore, the manufacturing processes of the optical waveguide device can be simplified and are suitable for mass production, and manufacturing cost can be suppressed thereby.