Abstract: A double-sided pressure-sensitive adhesive tape includes a first pressure-sensitive adhesive layer, a base material, and a second pressure-sensitive adhesive layer in the stated order, in which the second pressure-sensitive adhesive layer has a pressure-sensitive adhesive strength with respect to a SUS304 steel plate, which is larger than a pressure-sensitive adhesive strength of the first pressure-sensitive adhesive layer with respect to the SUS304 steel plate, in which the pressure-sensitive adhesive strength of the first pressure-sensitive adhesive layer with respect to the SUS304 steel plate is from 0.5 N/20 mm to 5 N/20 mm, and in which the pressure-sensitive adhesive strength of the second pressure-sensitive adhesive layer with respect to the SUS304 steel plate and the pressure-sensitive adhesive strength of the first pressure-sensitive adhesive layer with respect to the SUS304 steel plate have a difference of from 3 N/20 mm to 20 N/20 mm.

Abstract: In a step of performing dicing by sticking a protective tape for protecting a wafer surface, in order to obtain a dicing method which ensures that there is no paste residue on a chip side face and that the protective tape is prevented from peeling from the wafer during the dicing and which is excellent in productivity, in a step of performing dicing by sticking a surface protective adhesive tape having an energy ray-curable adhesive layer on one surface of a substrate, thereby performing surface protection for the surface of the semiconductor wafer where an integrated circuit is to be formed, the energy ray-curable adhesive layer is cured by radiating energy rays beforehand to an inner circumferential portion of the wafer, and dicing is performed, with the energy ray-curable adhesive layer kept in an uncured condition by ensuring that energy rays are not radiated to an outer peripheral portion.

Abstract: The present invention provides a heat-resistant pressure-sensitive adhesive tape for the production of a semiconductor device, including a base material layer and a pressure-sensitive adhesive layer formed on each side of the base material layer, in which at least the pressure-sensitive adhesive layer at a side on which a semiconductor chip is to be encapsulated with a resin contains a silicone pressure-sensitive adhesive. The heat-resistant pressure-sensitive adhesive tape is used for temporarily fixing a chip in a method for producing a substrateless semiconductor package which does not use a metal lead frame.

Abstract: The present invention provides a heat-resistant adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer contains a rubber component and an epoxy resin component. The proportion of the rubber component in an organic substance in the adhesive is in the range of 20 to 60 wt %.

Abstract: The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step.

Abstract: To provide a pressure-sensitive adhesive sheet which protects a ground, thin, fragile adherend from “warping” and which can be removed from the fragile adherend after the completion of backgrinding without damaging and contaminating the fragile adherend. The pressure-sensitive adhesive sheet 5 includes a base layer A, a pressure-sensitive adhesive layer A, a base layer B, and a pressure-sensitive adhesive layer B arranged in this order, in which: the base layer A has a product of its Young's modulus at 25° C. and its thickness of 1.0×105 to 4.0×105 N/m and a product of its Young's modulus at 80° C. and its thickness of 2.8×105 N/m or less; the pressure-sensitive adhesive layer A has a shear modulus at 80° C. of 0.2 MPa or less; the base layer B has a product of its Young's modulus at 25° C. and its thickness of smaller than that of the base layer A and has, upon 80° C.

Abstract: To provide a pressure-sensitive adhesive tape for an electrochemical device that has an extremely low water content, that is unlikely to lead to “adhesive protrusion”, and that is not removed even when it is in contact with an electrolytic solution. The pressure-sensitive adhesive tape for an electrochemical device of the present invention includes a pressure-sensitive adhesive layer composed of an acrylic pressure-sensitive adhesive on at least one side of a plastic base, and is characterized by including the pressure-sensitive adhesive layer having a gel content of 60% or more and a thickness of 1 to 15 ?m, and by having a water absorption rate of 0.2% or less after immersion in water at 23° C. for 24 hours.

Abstract: A spontaneously rolling adhesive sheet that can spontaneously roll from one end in one direction, or two opposed ends towards the center as a result of thermal stimulus to thereby form one or two cylindrical rolled bodies includes: a spontaneously rolling laminated sheet configured by lamination in the order of a shrinkable film layer which has a principal shrinking characteristic in one predetermined axial direction, a bonding adhesive layer and a rigid film layer, an adhesive layer laminated onto the rigid film layer side of the spontaneously rolling laminated sheet, and an organic coating layer disposed between the rigid film layer and the adhesive layer.

Abstract: The present invention provides a method which includes sticking a surface protection sheet for dicing onto a surface of a wafer and cutting the sheet together with the wafer to protect the surface of the wafer from being contaminated by deposition of a dust such as swarf and the like, and picking up a chip without causing cracking or chipping in the chip after a dicing step, in the steps of dicing the wafer and then picking up the chip. The method includes: sticking the surface protection sheet for dicing onto the surface of the wafer; cutting the sheet together with the wafer; subsequently giving a stimulus to the surface protection sheet for dicing to peel the end of the chip from the dicing tape; and then picking up the chip.

Abstract: The present invention aims to provide a surface protection tape for use in a dicing step, which protects a surface of a material to be cut from staining owing to attachment of dust and the like such as shavings by sticking the surface protection tape on the surface of the material to be cut in the dicing step and cutting the tape together with the material to be cut, and which is easily peeled and removed from individual chips after the dicing step.

Abstract: The present invention relates to an adhesive sheet including a substrate and, an adherent layer containing heat-expandable microspheres, the adherent layer being disposed on at least one side of the substrate, in which the adherent layer has a thickness of 10 to 38 ?m, and wherein the heat-expandable microspheres have a maximum particle diameter equal to or smaller than the thickness of the adherent layer and have a mode diameter of 5 to 30 ?m. The adhesive sheet of the invention enables a high-accuracy processing in the step of processing an electronic part such as a small ceramic capacitor to thereby greatly improve product characteristics and productivity.

Abstract: The pressure-sensitive adhesive sheet with spontaneously rolling property of the invention is a pressure-sensitive adhesive sheet comprising a contractible film layer, an elastic layer, a rigid film layer, an intermediate layer, and a pressure-sensitive adhesive layer satisfying the following requirements and laminated in this order, which is capable of undergoing spontaneous rolling from one end part in one direction or from opposing two end parts toward a center to form one or two cylindrical rolls when a stimulus causing a contraction is applied: the elastic layer having a thickness of from 15 to 150 ?m and a shear modulus at 80° C. of from 1×104 Pa to 5×106 Pa, the intermediate layer having a shear modulus at 23° C. of from 1×104 Pa to 4×107 Pa, and the pressure-sensitive adhesive layer having a pressure-sensitive adhesive strength of the pressure-sensitive adhesive layer or the pressure-sensitive adhesive layer after an adhesion reducing treatment (180° peeling, vs.

Abstract: The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step.

Abstract: The present invention provides a heat-resistant adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer contains a rubber component and an epoxy resin component. The proportion of the rubber component in an organic substance in the adhesive is in the range of 20 to 60 wt %.

Abstract: A cooling plate having a cooling pipe mounted therein in a serpentine shape is placed in a stack manner on a rear face of a chuck table for suction-holding a rear face of the semiconductor wafer. A coolant is circulated through the cooling pipe, thereby cooling the chuck table. The semiconductor wafer is suction-held while the chuck table is cooled. In addition, the protective tape is joined to the semiconductor wafer while the chuck table is cooled. That is, the protective tape is joined to the surface of the semiconductor wafer while being cooled indirectly via the semiconductor wafer cooled in advance through direct contact to the chuck table during joining of the protective tape.

Abstract: To provide a pressure-sensitive adhesive sheet which protects a ground, thin, fragile adherend from “warping” and which can be removed from the fragile adherend after the completion of backgrinding without damaging and contaminating the fragile adherend. The pressure-sensitive adhesive sheet 5 includes a base layer A, a pressure-sensitive adhesive layer A, a base layer B, and a pressure-sensitive adhesive layer B arranged in this order, in which: the base layer A has a product of its Young's modulus at 25° C. and its thickness of 1.0×105 to 4.0×105 N/m and a product of its Young's modulus at 80° C. and its thickness of 2.8×105 N/m or less; the pressure-sensitive adhesive layer A has a shear modulus at 80° C. of 0.2 MPa or less; the base layer B has a product of its Young's modulus at 25° C. and its thickness of smaller than that of the base layer A and has, upon 80° C.

Abstract: The present invention relates to a self-rolling pressure-sensitive adhesive sheet, including a shrinkable film layer; a restriction layer disposed on a side of the shrinkable film layer; and a pressure-sensitive adhesive layer disposed on the side of the restriction layer which is opposite to the side on which the shrinkable film layer is disposed. The self-rolling pressure-sensitive adhesive sheet is a releasable pressure-sensitive adhesive sheet, in which the pressure-sensitive adhesive layer or the pressure-sensitive adhesive layer after an adhesiveness decreasing treatment has a pressure-sensitive adhesive power (180° C. peeling, against a silicon mirror wafer, tensile speed: 300 mm/min) of 6.

Abstract: The present invention is intended to provide a method for protecting a surface of an object to be cut from contamination due to the adhesion of dust and the like, including cutting scraps, by bonding a surface protection tape to the surface of the object to be cut, and cutting the surface protection tape together with the object to be cut in a dicing process and, after the dicing process, easily separating and removing the protection tape from individual chips. To this end, there is provided a method in which a dicing surface protection tape is bonded to a surface of an object to be cut, the tape is cut together with the object to be cut, and then the dicing surface protection tape is removed with the object to be cut inclined.

Abstract: The present invention provides a die attach film-provided dicing tape, which includes a dicing tape, a supporting tape and a die attach film laminated in this order, wherein the supporting tape is a tape having a self-rolling peelability, and a process for producing a semiconductor device by using the die attach film-provided dicing tape.

Abstract: The present invention provides a removable pressure sensitive adhesive sheet, which includes: a self-rolling pressure sensitive adhesive sheet which is capable of spontaneously rolling up by a thermal stimulation, the self-rolling pressure sensitive adhesive sheet including a first pressure sensitive adhesive layer, a first rigid film layer, an elastic layer and a heat contractible film layer laminated in this order; and a second pressure sensitive adhesive layer and a second rigid film layer laminated in this order on the heat contractible film layer side of the self-rolling pressure sensitive adhesive sheet, in which the second pressure sensitive adhesive layer is removable from the heat contractible film layer or the second rigid film layer is removable from the second pressure sensitive adhesive layer.