Patents by Inventor Kazuyuki Kohara

Kazuyuki Kohara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10196513
    Abstract: An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; (D) 47 to 75 mass % of silica filler with an average particle size of 0.3 ?m or more and 2 ?m or less; and (E) 0.1 to 8 mass % of elastomer, wherein the component (C) and the component (D) are contained by 50.1 to 77 mass % in total.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: February 5, 2019
    Assignee: NAMICS CORPORATION
    Inventors: Tomoya Yamazawa, Kazuyuki Kohara, Kodai Okoshi, Nobuyuki Abe
  • Patent number: 9947604
    Abstract: An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; and (D) 40 to 75 mass % of silica filler with an average particle size of 0.3 ?m or more and 5 ?m or less. The component (C) and the component (D) are contained by 40.1 to 77 mass % in total.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: April 17, 2018
    Assignee: NAMICS CORPORATION
    Inventors: Kazuyuki Kohara, Tomoya Yamazawa, Kodai Okoshi, Nobuyuki Abe
  • Patent number: 9805998
    Abstract: The purpose of the present invention is to provide: a liquid sealing material which has excellent PCT (pressure cooker test) resistance; and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material of the present invention contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and is characterized in that the boron content in the silica filler (C) has an average of 1-50 ppm.
    Type: Grant
    Filed: May 15, 2013
    Date of Patent: October 31, 2017
    Assignee: Namics Corporation
    Inventors: Seiichi Ishikawa, Haruyuki Yoshii, Kazuyuki Kohara
  • Patent number: 9748158
    Abstract: A liquid sealing material which has excellent PCT (pressure cooker test) resistance, and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and the boron content in the silica filler (C) has an average of 1-50 ppm.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: August 29, 2017
    Assignee: NAMICS CORPORATION
    Inventors: Seiichi Ishikawa, Haruyuki Yoshii, Kazuyuki Kohara
  • Publication number: 20170022356
    Abstract: An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; (D) 47 to 75 mass % of silica filler with an average particle size of 0.3 ?m or more and 2 ?m or less; and (E) 0.1 to 8 mass % of elastomer, wherein the component (C) and the component (D) are contained by 50.1 to 77 mass % in total.
    Type: Application
    Filed: November 28, 2014
    Publication date: January 26, 2017
    Inventors: Tomoya YAMAZAWA, Kazuyuki KOHARA, Kodai OKOSHI, Nobuyuki ABE
  • Publication number: 20170005021
    Abstract: An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; and (D) 40 to 75 mass % of silica filler with an average particle size of 0.3 um or more and 5 ?m or less. The component (C) and the component (D) are contained by 40.1 to 77 mass % in total.
    Type: Application
    Filed: November 28, 2014
    Publication date: January 5, 2017
    Inventors: Kazuyuki KOHARA, Tomoya YAMAZAWA, Kodai OKOSHI, Nobuyuki ABE
  • Publication number: 20160300772
    Abstract: A liquid sealing material which has excellent PCT (pressure cooker test) resistance, and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and the boron content in the silica filler (C) has an average of 1-50 ppm.
    Type: Application
    Filed: June 23, 2016
    Publication date: October 13, 2016
    Inventors: Seiichi ISHIKAWA, Haruyuki YOSHII, Kazuyuki KOHARA
  • Patent number: 9204496
    Abstract: A planar heating element has an electrical insulating substrate, at least one pair of electrodes that includes thin metal wires covered with conductive cover layers and that is placed on a surface of the electrical insulating substrate, a polymer resistor that is placed on the electrical insulating substrate and that is supplied with electricity from the electrodes, and electrical insulating cover material 16 that covers the electrodes and the polymer resistor and that is made to adhere to the electrical insulating substrate by hot melt, and sectional shape of the conductive cover layers is of an ellipse in general with long axis parallel to the surface of the electrical insulating substrate.
    Type: Grant
    Filed: November 8, 2011
    Date of Patent: December 1, 2015
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masaki Hanada, Yukio Abe, Koji Yoshimoto, Takahito Ishii, Kazuyuki Kohara
  • Publication number: 20150175856
    Abstract: The purpose of the present invention is to provide: a liquid sealing material which has excellent PCT (pressure cooker test) resistance; and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material of the present invention contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and is characterized in that the boron content in the silica filler (C) has an average of 1-50 ppm.
    Type: Application
    Filed: May 15, 2013
    Publication date: June 25, 2015
    Inventors: Seiichi Ishikawa, Haruyuki Yoshii, Kazuyuki Kohara
  • Publication number: 20130220994
    Abstract: A planar heating element has an electrical insulating substrate, at least one pair of electrodes that includes thin metal wires covered with conductive cover layers and that is placed on a surface of the electrical insulating substrate, a polymer resistor that is placed on the electrical insulating substrate and that is supplied with electricity from the electrodes, and electrical insulating cover material 16 that covers the electrodes and the polymer resistor and that is made to adhere to the electrical insulating substrate by hot melt, and sectional shape of the conductive cover layers is of an ellipse in general with long axis parallel to the surface of the electrical insulating substrate.
    Type: Application
    Filed: November 8, 2011
    Publication date: August 29, 2013
    Applicant: PANASONIC CORPORATION
    Inventors: Masaki Hanada, Yukio Abe, Koji Yoshimoto, Takahito Ishii, Kazuyuki Kohara
  • Patent number: 8367987
    Abstract: The flexible PTC heating element according to the invention has one of the following constitutions. A portion of an electrodes and a PTC resistor is impregnated into a flexible substrate. A flexible substrate is made of resin foam or rubber material having a concave/convex shape formed on the surface. The flexible PTC heating element has an elongation deformation portion disposed to at least one of an electrode and a PTC resistor. A flexible substrate has adhesiveness and either a flexible substrate or a flexible cover material has an elongation control portion. Therefore, the flexible PTC heating element is highly flexible and excellent in vibration durability.
    Type: Grant
    Filed: January 18, 2006
    Date of Patent: February 5, 2013
    Assignee: Panasonic Corporation
    Inventors: Takahito Ishii, Keiko Yasui, Seishi Terakado, Kazuyuki Kohara, Mitsuru Yoneyama
  • Patent number: 7675004
    Abstract: A heating element includes a base substrate, a pair of electrodes, a resistor capable of generating heat, a conductive resin, a terminal member, a hot melt adhesion metal, a hot melt cohesion metal, and a lead wire. The pair of electrodes is provided on the base substrate, and the resistor is formed between the pair of electrodes. The conductive resin is provided on each of the electrodes, and the terminal member is provided on the conductive resin. The adhesion metal is provided on the terminal member, and the cohesion metal forms a molten phase along with the adhesion metal. An end of the lead wire is welded to the cohesion metal. The conductive resin is provided in the vicinity of the adhesion metal so as to be affected by heat of the adhesion metal.
    Type: Grant
    Filed: March 11, 2005
    Date of Patent: March 9, 2010
    Assignee: Panasonic Corporation
    Inventors: Keizo Nakajima, Takahito Ishii, Keiko Yasui, Seishi Terakado, Takehiko Shigeoka, Kazuyuki Kohara, Mitsuru Yoneyama
  • Patent number: 7366578
    Abstract: Typical numeric data for specifying a shape of a first product having a typical size are stored in a storage portion. By an input portion (10), a size of a second product other than the typical size is input. A calculating portion (4) determines recommended numeric data for specifying a shape of the second product based on the size of the second product and the typical numeric data. By the input portion (10), furthermore, corrected numeric data for the recommended numeric data are input. The calculating portion (4) decides the validity of the corrected numeric data. In the case in which the corrected numeric data have the validity, the calculating portion (4) determines final numeric data for specifying the shape of the second product based on the recommended numeric data and the corrected numeric data. Based on the final numeric data, the shape of the second product is drawn by CAD software.
    Type: Grant
    Filed: November 16, 2005
    Date of Patent: April 29, 2008
    Assignee: Sumitomo Rubber Industries, Ltd.
    Inventors: Takuya Yamamoto, Masatoshi Tanaka, Kazuyuki Kohara
  • Publication number: 20070193996
    Abstract: A heating element includes a base substrate, a pair of electrodes, a resistor capable of generating heat, a conductive resin, a terminal member, a hot melt adhesion metal, a hot melt cohesion metal, and a lead wire. The pair of electrodes is provided on the base substrate, and the resistor is formed between the pair of electrodes. The conductive resin is provided on each of the electrodes, and the terminal member is provided on the conductive resin. The adhesion metal is provided on the terminal member, and the cohesion metal forms a molten phase along with the adhesion metal. An end of the lead wire is welded to the cohesion metal. The conductive resin is provided in the vicinity of the adhesion metal so as to be affected by heat of the adhesion metal.
    Type: Application
    Filed: March 11, 2005
    Publication date: August 23, 2007
    Inventors: Keizo Nakajima, Takahito Ishii, Keiko Yasui, Seishi Terakado, Takehiko Shigeoka, Kazuyuki Kohara, Mitsuru Yoneyama
  • Publication number: 20060138123
    Abstract: The flexible PTC heating element according to the invention has one of the following constitutions. A portion of an electrodes and a PTC resistor is impregnated into a flexible substrate. A flexible substrate is made of resin foam or rubber material having a concave/convex shape formed on the surface. The flexible PTC heating element has an elongation deformation portion disposed to at least one of an electrode and a PTC resistor. A flexible substrate has adhesiveness and either a flexible substrate or a flexible cover material has an elongation control portion. Therefore, the flexible PTC heating element is highly flexible and excellent in vibration durability.
    Type: Application
    Filed: January 18, 2006
    Publication date: June 29, 2006
    Inventors: Takahito Ishii, Keiko Yasui, Seishi Terakado, Kazuyuki Kohara, Mitsuru Yoneyama
  • Publication number: 20060136082
    Abstract: Typical numeric data for specifying a shape of a first product having a typical size are stored in a storage portion. By an input portion (10), a size of a second product other than the typical size is input. A calculating portion (4) determines recommended numeric data for specifying a shape of the second product based on the size of the second product and the typical numeric data. By the input portion (10), furthermore, corrected numeric data for the recommended numeric data are input. The calculating portion (4) decides the validity of the corrected numeric data. In the case in which the corrected numeric data have the validity, the calculating portion (4) determines final numeric data for specifying the shape of the second product based on the recommended numeric data and the corrected numeric data. Based on the final numeric data, the shape of the second product is drawn by CAD software.
    Type: Application
    Filed: November 16, 2005
    Publication date: June 22, 2006
    Inventors: Takuya Yamamoto, Masatoshi Tanaka, Kazuyuki Kohara
  • Patent number: 7049559
    Abstract: The flexible PTC heating element according to the invention has one of the following constitutions. A portion of an electrodes and a PTC resistor is impregnated into a flexible substrate. A flexible substrate is made of resin foam or rubber material having a concave/convex shape formed on the surface. The flexible PTC heating element has an elongation deformation portion disposed to at least one of an electrode and a PTC resistor. A flexible substrate has adhesiveness and either a flexible substrate or a flexible cover material has an elongation control portion. Therefore, the flexible PTC heating element is highly flexible and excellent in vibration durability.
    Type: Grant
    Filed: June 16, 2003
    Date of Patent: May 23, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takahito Ishii, Keiko Yasui, Seishi Terakado, Kazuyuki Kohara, Mitsuru Yoneyama
  • Publication number: 20050173414
    Abstract: The flexible PTC heating element according to the invention has one of the following constitutions. A portion of an electrodes and a PTC resistor is impregnated into a flexible substrate. A flexible substrate is made of resin foam or rubber material having a concave/convex shape formed on the surface. The flexible PTC heating element has an elongation deformation portion disposed to at least one of an electrode and a PTC resistor. A flexible substrate has adhesiveness and either a flexible substrate or a flexible cover material has an elongation control portion. Therefore, the flexible PTC heating element is highly flexible and excellent in vibration durability.
    Type: Application
    Filed: June 16, 2003
    Publication date: August 11, 2005
    Inventors: Takahito Ishii, Keiko Yasui, Seishi Terakado, Kazuyuki Kohara, Mitsuru Yoneyama
  • Patent number: 6198377
    Abstract: A plastic thermistor comprising a polyamide composition which comprises 100 wt. parts of a polyamide and 5.3 to 30 wt. parts of zinc iodide, or a polyamide composition which comprises a polyamide, an iodine-containing compound, and a metal oxide such as zinc oxide. Ion carrier properties of a metal iodide greatly increases temperature dependence of impedance, and the metal oxide such as zinc iodide functions as a receptor for iodide ions and prevents the formation of a metal iodide on the surfaces of metal electrodes. Furthermore, a linked cycle can be established that zinc oxide forms zinc iodide and then formed zinc iodide functions to increase the stability of half-wave current passage. Accordingly, the thermal stability of the plastic thermistor is improved for a long time, and the heat resistance stability of temperature sensors or thermosensitive heaters comprising the plastic thermistor is improved greatly.
    Type: Grant
    Filed: January 10, 1997
    Date of Patent: March 6, 2001
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tadataka Yamazaki, Masahiko Ito, Kazuyuki Kohara