Patents by Inventor Kazuyuki Kohara
Kazuyuki Kohara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10196513Abstract: An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; (D) 47 to 75 mass % of silica filler with an average particle size of 0.3 ?m or more and 2 ?m or less; and (E) 0.1 to 8 mass % of elastomer, wherein the component (C) and the component (D) are contained by 50.1 to 77 mass % in total.Type: GrantFiled: November 28, 2014Date of Patent: February 5, 2019Assignee: NAMICS CORPORATIONInventors: Tomoya Yamazawa, Kazuyuki Kohara, Kodai Okoshi, Nobuyuki Abe
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Patent number: 9947604Abstract: An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; and (D) 40 to 75 mass % of silica filler with an average particle size of 0.3 ?m or more and 5 ?m or less. The component (C) and the component (D) are contained by 40.1 to 77 mass % in total.Type: GrantFiled: November 28, 2014Date of Patent: April 17, 2018Assignee: NAMICS CORPORATIONInventors: Kazuyuki Kohara, Tomoya Yamazawa, Kodai Okoshi, Nobuyuki Abe
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Patent number: 9805998Abstract: The purpose of the present invention is to provide: a liquid sealing material which has excellent PCT (pressure cooker test) resistance; and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material of the present invention contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and is characterized in that the boron content in the silica filler (C) has an average of 1-50 ppm.Type: GrantFiled: May 15, 2013Date of Patent: October 31, 2017Assignee: Namics CorporationInventors: Seiichi Ishikawa, Haruyuki Yoshii, Kazuyuki Kohara
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Patent number: 9748158Abstract: A liquid sealing material which has excellent PCT (pressure cooker test) resistance, and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and the boron content in the silica filler (C) has an average of 1-50 ppm.Type: GrantFiled: June 23, 2016Date of Patent: August 29, 2017Assignee: NAMICS CORPORATIONInventors: Seiichi Ishikawa, Haruyuki Yoshii, Kazuyuki Kohara
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Publication number: 20170022356Abstract: An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; (D) 47 to 75 mass % of silica filler with an average particle size of 0.3 ?m or more and 2 ?m or less; and (E) 0.1 to 8 mass % of elastomer, wherein the component (C) and the component (D) are contained by 50.1 to 77 mass % in total.Type: ApplicationFiled: November 28, 2014Publication date: January 26, 2017Inventors: Tomoya YAMAZAWA, Kazuyuki KOHARA, Kodai OKOSHI, Nobuyuki ABE
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Publication number: 20170005021Abstract: An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; and (D) 40 to 75 mass % of silica filler with an average particle size of 0.3 um or more and 5 ?m or less. The component (C) and the component (D) are contained by 40.1 to 77 mass % in total.Type: ApplicationFiled: November 28, 2014Publication date: January 5, 2017Inventors: Kazuyuki KOHARA, Tomoya YAMAZAWA, Kodai OKOSHI, Nobuyuki ABE
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Publication number: 20160300772Abstract: A liquid sealing material which has excellent PCT (pressure cooker test) resistance, and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and the boron content in the silica filler (C) has an average of 1-50 ppm.Type: ApplicationFiled: June 23, 2016Publication date: October 13, 2016Inventors: Seiichi ISHIKAWA, Haruyuki YOSHII, Kazuyuki KOHARA
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Patent number: 9204496Abstract: A planar heating element has an electrical insulating substrate, at least one pair of electrodes that includes thin metal wires covered with conductive cover layers and that is placed on a surface of the electrical insulating substrate, a polymer resistor that is placed on the electrical insulating substrate and that is supplied with electricity from the electrodes, and electrical insulating cover material 16 that covers the electrodes and the polymer resistor and that is made to adhere to the electrical insulating substrate by hot melt, and sectional shape of the conductive cover layers is of an ellipse in general with long axis parallel to the surface of the electrical insulating substrate.Type: GrantFiled: November 8, 2011Date of Patent: December 1, 2015Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Masaki Hanada, Yukio Abe, Koji Yoshimoto, Takahito Ishii, Kazuyuki Kohara
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Publication number: 20150175856Abstract: The purpose of the present invention is to provide: a liquid sealing material which has excellent PCT (pressure cooker test) resistance; and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material of the present invention contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and is characterized in that the boron content in the silica filler (C) has an average of 1-50 ppm.Type: ApplicationFiled: May 15, 2013Publication date: June 25, 2015Inventors: Seiichi Ishikawa, Haruyuki Yoshii, Kazuyuki Kohara
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Publication number: 20130220994Abstract: A planar heating element has an electrical insulating substrate, at least one pair of electrodes that includes thin metal wires covered with conductive cover layers and that is placed on a surface of the electrical insulating substrate, a polymer resistor that is placed on the electrical insulating substrate and that is supplied with electricity from the electrodes, and electrical insulating cover material 16 that covers the electrodes and the polymer resistor and that is made to adhere to the electrical insulating substrate by hot melt, and sectional shape of the conductive cover layers is of an ellipse in general with long axis parallel to the surface of the electrical insulating substrate.Type: ApplicationFiled: November 8, 2011Publication date: August 29, 2013Applicant: PANASONIC CORPORATIONInventors: Masaki Hanada, Yukio Abe, Koji Yoshimoto, Takahito Ishii, Kazuyuki Kohara
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Patent number: 8367987Abstract: The flexible PTC heating element according to the invention has one of the following constitutions. A portion of an electrodes and a PTC resistor is impregnated into a flexible substrate. A flexible substrate is made of resin foam or rubber material having a concave/convex shape formed on the surface. The flexible PTC heating element has an elongation deformation portion disposed to at least one of an electrode and a PTC resistor. A flexible substrate has adhesiveness and either a flexible substrate or a flexible cover material has an elongation control portion. Therefore, the flexible PTC heating element is highly flexible and excellent in vibration durability.Type: GrantFiled: January 18, 2006Date of Patent: February 5, 2013Assignee: Panasonic CorporationInventors: Takahito Ishii, Keiko Yasui, Seishi Terakado, Kazuyuki Kohara, Mitsuru Yoneyama
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Patent number: 7675004Abstract: A heating element includes a base substrate, a pair of electrodes, a resistor capable of generating heat, a conductive resin, a terminal member, a hot melt adhesion metal, a hot melt cohesion metal, and a lead wire. The pair of electrodes is provided on the base substrate, and the resistor is formed between the pair of electrodes. The conductive resin is provided on each of the electrodes, and the terminal member is provided on the conductive resin. The adhesion metal is provided on the terminal member, and the cohesion metal forms a molten phase along with the adhesion metal. An end of the lead wire is welded to the cohesion metal. The conductive resin is provided in the vicinity of the adhesion metal so as to be affected by heat of the adhesion metal.Type: GrantFiled: March 11, 2005Date of Patent: March 9, 2010Assignee: Panasonic CorporationInventors: Keizo Nakajima, Takahito Ishii, Keiko Yasui, Seishi Terakado, Takehiko Shigeoka, Kazuyuki Kohara, Mitsuru Yoneyama
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Patent number: 7366578Abstract: Typical numeric data for specifying a shape of a first product having a typical size are stored in a storage portion. By an input portion (10), a size of a second product other than the typical size is input. A calculating portion (4) determines recommended numeric data for specifying a shape of the second product based on the size of the second product and the typical numeric data. By the input portion (10), furthermore, corrected numeric data for the recommended numeric data are input. The calculating portion (4) decides the validity of the corrected numeric data. In the case in which the corrected numeric data have the validity, the calculating portion (4) determines final numeric data for specifying the shape of the second product based on the recommended numeric data and the corrected numeric data. Based on the final numeric data, the shape of the second product is drawn by CAD software.Type: GrantFiled: November 16, 2005Date of Patent: April 29, 2008Assignee: Sumitomo Rubber Industries, Ltd.Inventors: Takuya Yamamoto, Masatoshi Tanaka, Kazuyuki Kohara
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Publication number: 20070193996Abstract: A heating element includes a base substrate, a pair of electrodes, a resistor capable of generating heat, a conductive resin, a terminal member, a hot melt adhesion metal, a hot melt cohesion metal, and a lead wire. The pair of electrodes is provided on the base substrate, and the resistor is formed between the pair of electrodes. The conductive resin is provided on each of the electrodes, and the terminal member is provided on the conductive resin. The adhesion metal is provided on the terminal member, and the cohesion metal forms a molten phase along with the adhesion metal. An end of the lead wire is welded to the cohesion metal. The conductive resin is provided in the vicinity of the adhesion metal so as to be affected by heat of the adhesion metal.Type: ApplicationFiled: March 11, 2005Publication date: August 23, 2007Inventors: Keizo Nakajima, Takahito Ishii, Keiko Yasui, Seishi Terakado, Takehiko Shigeoka, Kazuyuki Kohara, Mitsuru Yoneyama
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Publication number: 20060138123Abstract: The flexible PTC heating element according to the invention has one of the following constitutions. A portion of an electrodes and a PTC resistor is impregnated into a flexible substrate. A flexible substrate is made of resin foam or rubber material having a concave/convex shape formed on the surface. The flexible PTC heating element has an elongation deformation portion disposed to at least one of an electrode and a PTC resistor. A flexible substrate has adhesiveness and either a flexible substrate or a flexible cover material has an elongation control portion. Therefore, the flexible PTC heating element is highly flexible and excellent in vibration durability.Type: ApplicationFiled: January 18, 2006Publication date: June 29, 2006Inventors: Takahito Ishii, Keiko Yasui, Seishi Terakado, Kazuyuki Kohara, Mitsuru Yoneyama
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Publication number: 20060136082Abstract: Typical numeric data for specifying a shape of a first product having a typical size are stored in a storage portion. By an input portion (10), a size of a second product other than the typical size is input. A calculating portion (4) determines recommended numeric data for specifying a shape of the second product based on the size of the second product and the typical numeric data. By the input portion (10), furthermore, corrected numeric data for the recommended numeric data are input. The calculating portion (4) decides the validity of the corrected numeric data. In the case in which the corrected numeric data have the validity, the calculating portion (4) determines final numeric data for specifying the shape of the second product based on the recommended numeric data and the corrected numeric data. Based on the final numeric data, the shape of the second product is drawn by CAD software.Type: ApplicationFiled: November 16, 2005Publication date: June 22, 2006Inventors: Takuya Yamamoto, Masatoshi Tanaka, Kazuyuki Kohara
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Patent number: 7049559Abstract: The flexible PTC heating element according to the invention has one of the following constitutions. A portion of an electrodes and a PTC resistor is impregnated into a flexible substrate. A flexible substrate is made of resin foam or rubber material having a concave/convex shape formed on the surface. The flexible PTC heating element has an elongation deformation portion disposed to at least one of an electrode and a PTC resistor. A flexible substrate has adhesiveness and either a flexible substrate or a flexible cover material has an elongation control portion. Therefore, the flexible PTC heating element is highly flexible and excellent in vibration durability.Type: GrantFiled: June 16, 2003Date of Patent: May 23, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Takahito Ishii, Keiko Yasui, Seishi Terakado, Kazuyuki Kohara, Mitsuru Yoneyama
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Publication number: 20050173414Abstract: The flexible PTC heating element according to the invention has one of the following constitutions. A portion of an electrodes and a PTC resistor is impregnated into a flexible substrate. A flexible substrate is made of resin foam or rubber material having a concave/convex shape formed on the surface. The flexible PTC heating element has an elongation deformation portion disposed to at least one of an electrode and a PTC resistor. A flexible substrate has adhesiveness and either a flexible substrate or a flexible cover material has an elongation control portion. Therefore, the flexible PTC heating element is highly flexible and excellent in vibration durability.Type: ApplicationFiled: June 16, 2003Publication date: August 11, 2005Inventors: Takahito Ishii, Keiko Yasui, Seishi Terakado, Kazuyuki Kohara, Mitsuru Yoneyama
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Patent number: 6198377Abstract: A plastic thermistor comprising a polyamide composition which comprises 100 wt. parts of a polyamide and 5.3 to 30 wt. parts of zinc iodide, or a polyamide composition which comprises a polyamide, an iodine-containing compound, and a metal oxide such as zinc oxide. Ion carrier properties of a metal iodide greatly increases temperature dependence of impedance, and the metal oxide such as zinc iodide functions as a receptor for iodide ions and prevents the formation of a metal iodide on the surfaces of metal electrodes. Furthermore, a linked cycle can be established that zinc oxide forms zinc iodide and then formed zinc iodide functions to increase the stability of half-wave current passage. Accordingly, the thermal stability of the plastic thermistor is improved for a long time, and the heat resistance stability of temperature sensors or thermosensitive heaters comprising the plastic thermistor is improved greatly.Type: GrantFiled: January 10, 1997Date of Patent: March 6, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Tadataka Yamazaki, Masahiko Ito, Kazuyuki Kohara