Abstract: A machining apparatus that need not exchange a processing nozzle when changing a shaping condition, and increases the use efficiency of a material. The processing nozzle that performs processing by ejecting a processing material towards a molten pool formed on a process surface by an energy line includes a cylindrical inner housing that incorporates a path through which the energy line passes, and ejects the energy line from one end. The processing nozzle also includes a cylindrical outer housing that incorporates the inner housing, and has an inner surface tapered in the ejection direction of the energy line ejected from the inner housing. The processing nozzle also includes a slide mechanism that changes, along the energy line, the relative position of the outer housing with respect to the inner housing.

Abstract: An optical processing head capable of reducing the energy loss at the time of optical processing is disclosed. The optical processing head includes a first optical element that converts light emitted by a light source into first parallel light, a second optical element that is arranged downstream of the first optical element and converts the first parallel light into first divergent light, a third optical element that is arranged downstream of the second optical element and converts the first divergent light into second parallel light, and a fourth optical element that is arranged downstream of the third optical element and converts the second parallel light into convergent light which is condensed on the processing surface side.

Abstract: An optical processing nozzle that homogeneously supplies a fluid to a processing surface in optical processing. The optical processing nozzle includes a beam path that is arranged so that a beam can pass through the beam path towards a processing surface in order to perform processing using a beam guided from a light source, and a channel structure that is arranged around the beam path and is configured to eject a fluid towards the processing surface. The channel structure includes an inflow port through which the fluid flows, at least two passage holes through which the fluid flowing from the inflow port passes, a channel that guides the fluid from the inflow port to the passage holes, and an ejection port from which the fluid having passed through the at least two passage holes is ejected toward the processing surface.

Abstract: An optical processing head capable of downsizing an apparatus while increasing the shaping accuracy of optical processing is disclosed. The optical processing head performs processing while moving, in a predetermined moving direction on a processing surface, an optical spot formed by condensing light emitted by a light source. The optical processing head includes an optical element that condenses light emitted by the light source to generate the optical spot of a shape elongated in the moving direction of the optical spot. Part of the optical spot is set as a processing region, the front side and/or rear side of the processing region in the moving direction is set as a pre-heating region and/or post-heating region, and a processing target object before and/or after processing in the region is heated.

Abstract: An optical processing head that detects a trouble of an optical processing head that will be generated at the time of optical processing before the trouble occurs is disclosed. The optical processing head that performs processing by condensing, on a process surface, a ray emitted by a light source for processing includes a cylindrical housing that surrounds a ray for processing emitted by the light source for processing, a ray emitter for inspection that is incorporated in the cylindrical housing and arranged outside the path of the ray for processing, and a light receiver that is incorporated in the cylindrical housing, arranged outside the path of the ray for processing, and receives a ray for inspection emitted by the ray emitter for inspection. The contamination of the inner surface of the cylindrical housing or the concentration of a scattering object flowing into the cylindrical housing is inspected by using a signal acquired from the light receiver.

Abstract: An overall apparatus is downsized by reducing the size of a light beam branching structure. There is provided an optical processing head including an optical element group that guides a processing light beam from a light source to a process surface, and a light beam branching portion that branches reflected light of the processing light beam from the process surface and an observation light beam for observing a state of the process surface. The light beam branching portion is arranged on a light beam path of the processing light beam, and includes, between the optical element group and the process surface, a half mirror that guides the observation light beam to an observation optical system.

Abstract: This specification discloses an optical processing head including a light guide portion that guides, to a process surface, a ray for processing. The light guide portion is further configured to guide, to the process surface, a ray for inspection different in wavelength from the ray for processing. The optical processing head further includes an inspection portion that inspects the state of the process surface based on reflected light of the ray for inspection reflected by the process surface. With the optical processing head, the state of the process surface can be easily inspected even during optical processing.

Abstract: This specification discloses an optical processing head including a light guide portion that guides, to a process surface, a ray for processing. The light guide portion is further configured to guide, to the process surface, a ray for inspection different in wavelength from the ray for processing. The optical processing head further includes an inspection portion that inspects the state of the process surface based on reflected light of the ray for inspection reflected by the process surface. With the optical processing head, the state of the process surface can be easily inspected even during optical processing.

Abstract: An optical processing nozzle that homogeneously supplies a fluid to a processing surface in optical processing is provided. The optical processing nozzle includes a beam path that is arranged so that a beam can pass through the beam path toward a processing surface in order to perform processing using a beam guided from a light source, and a channel structure that is arranged around the beam path and is configured to eject a fluid toward the processing surface. The channel structure includes an inflow port through which the fluid flows, at least two passage holes through which the fluid flowing from the inflow port passes, a channel that guides the fluid from the inflow port to the passage holes, and an ejection port from which the fluid having passed through the at least two passage holes is ejected toward the processing surface.

Abstract: An optical processing head that detects a trouble of an optical processing head that will be generated at the time of optical processing before the trouble occurs is disclosed. The optical processing head that performs processing by condensing, on a process surface, a ray emitted by a light source for processing includes a cylindrical housing that surrounds a ray for processing emitted by the light source for processing, a ray emitter for inspection that is incorporated in the cylindrical housing and arranged outside the path of the ray for processing, and a light receiver that is incorporated in the cylindrical housing, arranged outside the path of the ray for processing, and receives a ray for inspection emitted by the ray emitter for inspection. The contamination of the inner surface of the cylindrical housing or the concentration of a scattering object flowing into the cylindrical housing is inspected by using a signal acquired from the light receiver.

Abstract: A machining apparatus that need not exchange a processing nozzle when changing a shaping condition, and increases the use efficiency of a material is disclosed. The processing nozzle that performs processing by ejecting a processing material toward a molten pool formed on a process surface by an energy line includes a cylindrical inner housing that incorporates a path through which the energy line passes, and ejects the energy line from one end, a cylindrical outer housing that incorporates the inner housing, and has an inner surface tapered in the ejection direction of the energy line ejected from the inner housing, and a slide mechanism that changes, along the energy line, the relative position of the outer housing with respect to the inner housing.

Abstract: An optical processing head capable of reducing the energy loss at the time of optical processing is disclosed. The optical processing head includes a first optical element that converts light emitted by a light source into first parallel light, a second optical element that is arranged downstream of the first optical element and converts the first parallel light into first divergent light, a third optical element that is arranged downstream of the second optical element and converts the first divergent light into second parallel light, and a fourth optical element that is arranged downstream of the third optical element and converts the second parallel light into convergent light which is condensed on the processing surface side.

Abstract: An optical processing head capable of downsizing an apparatus while increasing the shaping accuracy of optical processing is disclosed. The optical processing head performs processing while moving, in a predetermined moving direction on a processing surface, an optical spot formed by condensing light emitted by a light source. The optical processing head includes an optical element that condenses light emitted by the light source to generate the optical spot of a shape elongated in the moving direction of the optical spot. Part of the optical spot is set as a processing region, the front side and/or rear side of the processing region in the moving direction is set as a pre-heating region and/or post-heating region, and a processing target object before and/or after processing in the region is heated.

Abstract: According to one embodiment, a method for producing a mask layout of an exposure mask for forming wiring of an integrated circuit device, includes estimating shape of the wiring formed based on an edge of a pattern included in an initial layout of the exposure mask. The method includes modifying shape of the edge if the estimated shape of the wiring does not satisfy a requirement.

Abstract: According to one embodiment, a process conversion difference in a processed pattern having undergone a process via the resist pattern can be predicted, based on results of simulation of a cross-sectional shape of the resist pattern by which predicted values of resist dimensions adapted to a relationship between a parameter for lithography and actual measurement values of the resist dimensions.

Abstract: According to one embodiment, a production method for a mask layout of an exposure mask includes evaluating a candidate layout by comparison between an imaged image group and a reference image group. The imaged image group is composed of a plurality of imaged images of patterns formed by performing lithography under a plurality of levels of exposure condition using the candidate layout. The reference image group is composed of a plurality of reference images produced by simulation on assumption of a plurality of levels of the exposure condition.

Abstract: According to one embodiment, an exposure tolerance estimation method is disclosed. The method can include setting a plurality of regions along a first surface of a substrate. The method can form a plurality of patterns for estimation by performing exposure on each of the regions using at least three levels of exposure condition using an exposure mask. The method can measure dimensions of the patterns for estimation and find relationships between the exposure condition and the dimensions. The method can select a first region from the regions. In the first region, a first dimension of a first pattern for estimation formed by exposure using a first exposure condition of an intermediate level out of the at least three levels falls within a previously set range. In addition, the method can calculate an exposure tolerance from a relationship between the first exposure condition and the first dimension.

Abstract: According to one embodiment, a method for manufacturing a semiconductor device includes forming a stacked body on a substrate. The stacked body includes a plurality of first conductive layers including a metallic element as a main component and a plurality of second conductive layers including a metallic element as a main component provided respectively between the first conductive layers. The method includes making a hole to pierce the stacked body. The method includes making a slit to divide the stacked body. The method includes making a gap between the first conductive layers by removing the second conductive layers by etching via the slit or the hole. The method includes forming a memory film including a charge storage film at a side wall of the hole. The method includes forming a channel body on an inner side of the memory film inside the hole.

Abstract: According to one embodiment, an exposure tolerance estimation method is disclosed. The method can include setting a plurality of regions along a first surface of a substrate. The method can form a plurality of patterns for estimation by performing exposure on each of the regions using at least three levels of exposure condition using an exposure mask. The method can measure dimensions of the patterns for estimation and find relationships between the exposure condition and the dimensions. The method can select a first region from the regions. In the first region, a first dimension of a first pattern for estimation formed by exposure using a first exposure condition of an intermediate level out of the at least three levels falls within a previously set range. In addition, the method can calculate an exposure tolerance from a relationship between the first exposure condition and the first dimension.

Abstract: According to one embodiment, a method for producing a mask layout of an exposure mask for forming wiring of an integrated circuit device, includes estimating shape of the wiring formed based on an edge of a pattern included in an initial layout of the exposure mask. The method includes modifying shape of the edge if the estimated shape of the wiring does not satisfy a requirement.