Patents by Inventor Kazuyuki Miyano

Kazuyuki Miyano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9870983
    Abstract: A lead frame includes a die pad and a plurality of lead portions each including an internal terminal and an external terminal. The external terminals of the plurality of lead portions are arranged in an alternately staggered form such that the respective external terminals of a pair of lead portions adjacent to each other are alternatively located on an inside or an outside. A lead portion has an inside region located on the inside of a first external terminal, an outside region located on the outside of the first external terminal, and an external terminal region having the first external terminal. The inside region and the outside region are each formed thin by means of half etching. A maximum thickness of the outside region is larger than a maximum thickness of the inside region.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: January 16, 2018
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Satoshi Shibasaki, Koji Tomita, Masaki Yazaki, Kazuyuki Miyano, Atsushi Kurahashi, Kazuhito Uchiumi, Masachika Masuda
  • Publication number: 20170077011
    Abstract: A lead frame includes a die pad and a plurality of lead portions each including an internal terminal and an external terminal. The external terminals of the plurality of lead portions are arranged in an alternately staggered form such that the respective external terminals of a pair of lead portions adjacent to each other are alternatively located on an inside or an outside. A lead portion has an inside region located on the inside of a first external terminal, an outside region located on the outside of the first external terminal, and an external terminal region having the first external terminal. The inside region and the outside region are each formed thin by means of half etching. A maximum thickness of the outside region is larger than a maximum thickness of the inside region.
    Type: Application
    Filed: November 29, 2016
    Publication date: March 16, 2017
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Satoshi SHIBASAKI, Koji TOMITA, Masaki YAZAKI, Kazuyuki MIYANO, Atsushi KURAHASHI, Kazuhito UCHIUMI, Masachika MASUDA
  • Patent number: 9543169
    Abstract: A lead frame includes a die pad and a plurality of lead portions each including an internal terminal and an external terminal. The external terminals of the plurality of lead portions are arranged in an alternately staggered form such that the respective external terminals of a pair of lead portions adjacent to each other are alternatively located on an inside or an outside. A lead portion has an inside region located on the inside of a first external terminal, an outside region located on the outside of the first external terminal, and an external terminal region having the first external terminal. The inside region and the outside region are each formed thin by means of half etching. A maximum thickness of the outside region is larger than a maximum thickness of the inside region.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: January 10, 2017
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Satoshi Shibasaki, Koji Tomita, Masaki Yazaki, Kazuyuki Miyano, Atsushi Kurahashi, Kazuhito Uchiumi, Masachika Masuda
  • Publication number: 20160189978
    Abstract: A lead frame includes a die pad and a plurality of lead portions each including an internal terminal and an external terminal. The external terminals of the plurality of lead portions are arranged in an alternately staggered form such that the respective external terminals of a pair of lead portions adjacent to each other are alternatively located on an inside or an outside. A lead portion has an inside region located on the inside of a first external terminal, an outside region located on the outside of the first external terminal, and an external terminal region having the first external terminal. The inside region and the outside region are each formed thin by means of half etching. A maximum thickness of the outside region is larger than a maximum thickness of the inside region.
    Type: Application
    Filed: January 8, 2016
    Publication date: June 30, 2016
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Satoshi SHIBASAKI, Koji TOMITA, Masaki YAZAKI, Kazuyuki MIYANO, Atsushi KURAHASHI, Kazuhito UCHIUMI, Masachika MASUDA
  • Patent number: 9263374
    Abstract: A semiconductor device includes, a lead frame having a die pad and a plurality of leads each disposed around the die pad, a semiconductor element rested on the die pad of the lead frame, and bonding wires for electrically interconnecting the lead of the lead frame and the semiconductor element. The lead frame, the semiconductor element, and the bonding wires are sealed with a sealing resin section. The sealing resin section includes a central region provided over and around the semiconductor device, and a marginal region provided in the periphery of the central region. Thickness of the central region is greater than that of the marginal region.
    Type: Grant
    Filed: September 12, 2011
    Date of Patent: February 16, 2016
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Masachika Masuda, Koji Tomita, Tadashi Okamoto, Yasunori Tanaka, Hiroshi Ohsawa, Kazuyuki Miyano, Atsushi Kurahashi, Hiromichi Suzuki
  • Patent number: 9257306
    Abstract: A lead frame includes a die pad and a plurality of lead portions each including an internal terminal and an external terminal. The external terminals of the plurality of lead portions are arranged in an alternately staggered form such that the respective external terminals of a pair of lead portions adjacent to each other are alternatively located on an inside or an outside. A lead portion has an inside region located on the inside of a first external terminal, an outside region located on the outside of the first external terminal, and an external terminal region having the first external terminal. The inside region and the outside region are each formed thin by means of half etching. A maximum thickness of the outside region is larger than a maximum thickness of the inside region.
    Type: Grant
    Filed: April 16, 2014
    Date of Patent: February 9, 2016
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Satoshi Shibasaki, Koji Tomita, Masaki Yazaki, Kazuyuki Miyano, Atsushi Kurahashi, Kazuhito Uchiumi, Masachika Masuda
  • Publication number: 20140319663
    Abstract: A lead frame includes a die pad and a plurality of lead portions each including an internal terminal and an external terminal. The external terminals of the plurality of lead portions are arranged in an alternately staggered form such that the respective external terminals of a pair of lead portions adjacent to each other are alternatively located on an inside or an outside. A lead portion has an inside region located on the inside of a first external terminal, an outside region located on the outside of the first external terminal, and an external terminal region having the first external terminal. The inside region and the outside region are each formed thin by means of half etching. A maximum thickness of the outside region is larger than a maximum thickness of the inside region.
    Type: Application
    Filed: April 16, 2014
    Publication date: October 30, 2014
    Inventors: Satoshi SHIBASAKI, Koji TOMITA, Masaki YAZAKI, Kazuyuki MIYANO, Atsushi KURAHASHI, Kazuhito UCHIUMI, Masachika MASUDA
  • Patent number: 8247888
    Abstract: Provided is a semiconductor device capable of preventing a semiconductor chip from being damaged by any sharp burrs of a metallic shielding plate. The semiconductor device includes a semiconductor chip and a metallic shielding plate provided on a circuit surface of the semiconductor chip. The metallic shielding plate is disposed in such a manner that a second surface of a shielding plate body is directed towards the circuit surface of the semiconductor chip, and burrs are positioned contiguous to the second surface of the shielding plate body. At distal ends of the burrs, cutting burrs are formed in a direction orthogonal to the second surface. The sharp burrs extend in a direction opposite to the semiconductor chip, so that the sharp burrs are prevented from damaging the circuit surface of the semiconductor chip.
    Type: Grant
    Filed: February 9, 2010
    Date of Patent: August 21, 2012
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Masachika Masuda, Kazunori Oda, Koji Tomita, Kazuyuki Miyano
  • Publication number: 20120074544
    Abstract: A semiconductor device includes, a lead frame having a die pad and a plurality of leads each disposed around the die pad, a semiconductor element rested on the die pad of the lead frame, and bonding wires for electrically interconnecting the lead of the lead frame and the semiconductor element. The lead frame, the semiconductor element, and the bonding wires are sealed with a sealing resin section. The sealing resin section includes a central region provided over and around the semiconductor device, and a marginal region provided in the periphery of the central region. Thickness of the central region is greater than that of the marginal region.
    Type: Application
    Filed: September 12, 2011
    Publication date: March 29, 2012
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Masachika MASUDA, Koji TOMITA, Tadashi OKAMOTO, Yasunori TANAKA, Hiroshi OHSAWA, Kazuyuki MIYANO, Atsushi KURAHASHI, Hiromichi SUZUKI
  • Publication number: 20100270660
    Abstract: Provided is a semiconductor device capable of preventing a semiconductor chip from being damaged by any sharp burrs of a metallic shielding plate. The semiconductor device includes a semiconductor chip and a metallic shielding plate provided on a circuit surface of the semiconductor chip. The metallic shielding plate is disposed in such a manner that a second surface of a shielding plate body is directed towards the circuit surface of the semiconductor chip, and burrs are positioned contiguous to the second surface of the shielding plate body. At distal ends of the burrs, cutting burrs are formed in a direction orthogonal to the second surface. The sharp burrs extend in a direction opposite to the semiconductor chip, so that the sharp burrs are prevented from damaging the circuit surface of the semiconductor chip.
    Type: Application
    Filed: February 9, 2010
    Publication date: October 28, 2010
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Masachika Masuda, Kazunori Oda, Koji Tomita, Kazuyuki Miyano
  • Patent number: 6185401
    Abstract: A toner supply container for supplying toner into a main assembly of an electrophotographic image forming apparatus includes a toner accommodating portion for accommodating toner to be supplied into a main assembly of the electrophotographic image forming apparatus; a toner discharging opening for discharging the toner accommodated in the toner accommodating portion, the toner discharging opening being provided in the toner accommodating portion; a sealing member for openably sealing the toner discharging opening; an openable member for openably sealing the toner discharging opening; a rotatable member which is rotatable relative to the toner accommodating portion; a rotating force receiving portion for receiving rotating force produced by rotation of the rotatable member through a rotating force transmission member provided in the main assembly of the electrophotographic image forming apparatus to unseal the toner discharging opening by the rotation of the rotatable member when the toner supply container is
    Type: Grant
    Filed: September 29, 1998
    Date of Patent: February 6, 2001
    Assignee: Canon Kabushiki Kaisha
    Inventors: Akihito Kanamori, Kazuyuki Miyano, Hideki Goto, Tatsuya Goto
  • Patent number: 6131008
    Abstract: A developer cartridge includes a cylindrical body for accommodating a developer with a discharge opening, provided in a cylindrical portion of the cylindrical body, for permitting discharge of the developer. A sealing member seals the discharge opening. A stirring member is provided in the cylindrical body and includes a shaft for receiving a driving force to rotate the stirring member and elastic stirring blades provided on the shaft. The stirring blades have free end portions bent in a radial direction.
    Type: Grant
    Filed: November 3, 1998
    Date of Patent: October 10, 2000
    Assignee: Canon Kabushiki Kaisha
    Inventors: Akihito Kanamori, Yutaka Ban, Kazuhiko Omata, Kazuyuki Miyano
  • Patent number: 5926675
    Abstract: The present invention provides a seal member removing tool for removing a seal member fitted in a developing agent loading opening of a developing agent container, comprising a bent body portion, and an abutment portion provided on one end of the body portion and adapted to abut against the seal member from inside of the container to remove the seal member from the container. The present invention further provides seal member removing method effected by using such a seal member removing tool.
    Type: Grant
    Filed: May 11, 1998
    Date of Patent: July 20, 1999
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kazuyuki Miyano, Hiroumi Morinaga
  • Patent number: 5870652
    Abstract: A developer cartridge comprising a cylindrical portion for accommodating a developer, being provided with a hole at a longitudinal end, wherein the developer is capable of being supplied into the cylindrical portion through the hole, a removable cap for capping the hole, and a gripping member for covering the cap and having a plate-like grip. A developing remanufacturing method, wherein the cartridge includes a cylindrical portion having an opening extending in a longitudinal direction, the cylindrical portion being provided with a hole at a longitudinal end, a cap for capping the hole and a gripping member, includes the steps of removing the gripping member, removing the cap, sealing the opening, supplying a developer through the hole, capping the hole, and mounting the gripping member.
    Type: Grant
    Filed: December 28, 1994
    Date of Patent: February 9, 1999
    Assignee: Canon Kabushiki Kaisha
    Inventors: Akihito Kanamori, Yutaka Ban, Kazuhiko Omata, Kazuyuki Miyano
  • Patent number: 5839670
    Abstract: A pneumatic pulverizer comprises an accelerating tube for carrying and accelerating powder to be pulverized with high-pressure gas and a pulverizing chamber for pulverizing the powder to be pulverized. The back end of the accelerating tube is provided with a pulverization powder feed port for feeding powder to be pulverized to the accelerating tube, the pulverizing chamber has an impact member having an impact surface opposed to the opening plane of the outlet of the accelerating tube, the and a side wall against which the powder to be pulverized that has been pulverized by the impact member collides to further pulverize.
    Type: Grant
    Filed: May 1, 1996
    Date of Patent: November 24, 1998
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kazuhiko Omata, Hitoshi Kanda, Momosuke Takaichi, Satoshi Mitsumura, Kazuyuki Miyano
  • Patent number: 5691093
    Abstract: An image forming method has developing an electrostatic latent image on an electrostatic latent image bearing member by the use of a toner containing a wax component, to form a toner image on the electrostatic latent image bearing member;transferring the toner image to the surface of a recording medium; andfixing the toner image on the recording medium, to the recording medium.The recording medium has a laminated film having a substrate layer and a wax component absorption layer for absorbing a wax component contained in the toner. The wax component absorption layer is formed of a resin capable of inhibiting crystal growth of the wax component. The wax component absorption layer is capable of absorbing the wax component contained in the toner when the toner image is fixed to the recording medium.
    Type: Grant
    Filed: July 25, 1995
    Date of Patent: November 25, 1997
    Assignee: Canon Kabushiki Kaisha
    Inventors: Makoto Kanbayashi, Takashige Kasuya, Tatsuya Nakamura, Tatsuhiko Chiba, Kazuyuki Miyano
  • Patent number: 5579101
    Abstract: A developer cartridge detachably mountable to a developing apparatus having a shutter for closing and opening a developer receiving opening, includes a cylindrical portion for accommodating a developer, the cylindrical portion being provided with an opening extending along a length thereof; a sealing member for sealing the opening; a first projection for moving the shutter to an open position for the developer receiving opening in interrelation with rotation of the developer cartridge in a first direction; and a second projection for moving the shutter to a close position for the developer receiving opening in interrelation with rotation of the developer cartridge in a second direction which is opposite from the first direction.
    Type: Grant
    Filed: December 28, 1994
    Date of Patent: November 26, 1996
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kazuhiko Omata, Yutaka Ban, Akihito Kanamori, Kazuyuki Miyano
  • Patent number: 5577670
    Abstract: A pneumatic pulverizer comprises an accelerating tube for carrying and accelerating powder to be pulverized with high-pressure gas and a pulverizing chamber for pulverizing the powder to be pulverized. The back end of the accelerating tube is provided with a pulverization powder feed port for feeding powder to be pulverized to the accelerating tube, the pulverizing chamber has an impact member having an impact surface opposed to the opening plane of the outlet of the accelerating tube, and a side wall against which the powder to be pulverized that has been pulverized by the impact member collides to further pulverize. The closest distance from the side wall to a margin of the impact member is shorter than the closest distance from the front wall of the pulverizing chamber opposed to the impact surface to the margin of the impact member to prevent pulverized powder from fusing, coagulating, and getting coarser, and prevent localized abrasion of an impact surface the impact member and the accelerating tube.
    Type: Grant
    Filed: January 18, 1995
    Date of Patent: November 26, 1996
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kazuhiko Omata, Hitoshi Kanda, Momosuke Takaichi, Satoshi Mitsumura, Kazuyuki Miyano
  • Patent number: 5578407
    Abstract: A color toner for developing an electrostatic image has color toner particles containing a binder resin and a colorant.The color toner particles have been obtained by mixing a mixture containing at least a polymerizable monomer, the colorant and a polymerization initiator to prepare a polymerizable monomer composition, dispersing the polymerizable monomer composition in an aqueous medium to carry out granulation, and polymerizing polymerizable monomers in the aqueous medium.The colorant comprises fine organic pigment particles or fine organic dye particles having an acetic acid adsorption heat in n-heptane of from 0.1 mJ/m.sup.2 to 80 mJ/m.sup.2.
    Type: Grant
    Filed: October 28, 1994
    Date of Patent: November 26, 1996
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takashige Kasuya, Tatsuya Nakamura, Makoto Kanbayashi, Tatsuhiko Chiba, Kazuyuki Miyano, Koji Inaba
  • Patent number: 5571653
    Abstract: A toner for developing an electrostatic image comprises toner particles containing a binder resin, a colorant and a wax. The toner contains polymerizable vinyl monomer or a mixture of organic solvent and polymerizable vinyl monomer in an amount of not more than 1,000 ppm. The toner particles are those obtained by mixing a mixture containing, at least, one or plural kinds of polymerizable vinyl monomer, a styrene-diene copolymer comprised of styrene or a styrene derivative and butadiene or isoprene in a copolymerization weight ratio of from 95:5 to 65:35, the colorant, the wax and a polymerization initiator to prepare a polymerizable monomer composition; dispersing the polymerizable monomer composition in an aqueous medium to carry out granulation; and polymerizing the polymerizable vinyl monomer in the aqueous medium.
    Type: Grant
    Filed: October 19, 1994
    Date of Patent: November 5, 1996
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takashige Kasuya, Tatsuya Nakamura, Makoto Kanabayashi, Tatsuhiko Chiba, Kazuyuki Miyano, Koji Inaba