Patents by Inventor Kazuyuki Nakano

Kazuyuki Nakano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7502170
    Abstract: An illumination apparatus includes a through-hole for detection formed at a center portion, and irradiates diffused light and directional light to an object to be detected. The apparatus includes an annular diffusion plate which diffuses light, a light source disposed annularly, and an annular reflection plate which reflects light from the light source to the side of said object to be detected. The diffusion plate, light source, and reflection plate are disposed in the order from the side of said object to be detected. The diffused light is generated by irradiating light from said light source to the object to be detected through said diffusion plate. Light from said light source is reflected by said reflection plate and then irradiated to the object to be detected.
    Type: Grant
    Filed: June 27, 2003
    Date of Patent: March 10, 2009
    Assignee: Panasonic Corporation
    Inventors: Kazuyuki Nakano, Youichi Tanaka, Hiroyoshi Saitoh, Junichi Hada
  • Patent number: 7210222
    Abstract: The present invention provides a power supply control method which is executed by the electronic component mounting apparatus. A drive power source and a control power source are separately connected and shut-off in accordance with a command from a control device to each of component feed drive parts for driving component feed devices, a component transfer drive device for driving a component transfer device, and a circuit board positioning drive device for driving a circuit board positioning device. The control device detects an individual occurrence of a halt condition of each of constituent parts of an electronic component mounting apparatus and shuts off a drive power source to the drive device in the halt condition. Thus, wasteful power consumption is eliminated and production is continued with a necessary minimum power.
    Type: Grant
    Filed: January 16, 2004
    Date of Patent: May 1, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Keizo Izumida, Takeshi Takeda, Kazuyuki Nakano
  • Publication number: 20050238222
    Abstract: The invention aims to provide, an illumination apparatus which, even if an object to be detected is of a mirror surface shape and of a concavity and convexity shape, can carry out appropriate illumination which corresponded to it, over trying to realize low cost and miniaturization with a simple configuration, and accordingly enables to recognize an object to be detected without an error, and a recognition apparatus and a component mounting apparatus which were equipped with this. In this invention, an annular diffusion plate 14, a fixing plate 15 having light sources for directional light 12 and light sources for diffused light 13 annularly on the upper and lower surfaces thereof, and an annular reflective plate 17 reflecting light from the light sources for directional light 12 to the detected object 10 are disposed in a case 11 in order from the side of the detected object 10. And through-holes 18, 21, 22 for passing light to an image pickup camera 20 therethrough are provided.
    Type: Application
    Filed: June 27, 2003
    Publication date: October 27, 2005
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazuyuki Nakano, Youichi Tanaka, Hiroyoshi Saitoh, Junichi Hada
  • Patent number: 6945381
    Abstract: There is provided a circuit board fixing table having a structure in which no vibration or shock is applied to a transport motor when a circuit board is fixed and an electronic component mounting apparatus utilizing the circuit board fixing table and capable of mounting electronic components without causing operational failures during transportation. A circuit board fixing table for transporting a circuit board placed on transport belts to a predetermined position and fixing it with an elevating fixing device, the table having a transport motor provided separately from a support member for the transport belts for driving the transport belts and power transmission mechanisms A and B for transmitting a driving force of the transport motor to the transport belts.
    Type: Grant
    Filed: December 10, 2001
    Date of Patent: September 20, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Izumi Miura, Hirofumi Obara, Naoto Mimura, Kazuyuki Nakano
  • Patent number: 6938335
    Abstract: A component mounting method recognizes reference marks on a printed circuit board and an electronic component, and uses these reference marks to determine a shift between a position of the circuit board and a position of the electronic component. This shift is corrected and then the electronic component is mounted to the printed circuit board such that electrical connecting portions of the circuit board are connected to electrical connecting portions of the electronic component. The reference marks are formed simultaneously with corresponding electrical connecting portions via a mask, such that in order to accurately position the electrical connecting portions, it is only necessary to accurately relatively position the reference marks.
    Type: Grant
    Filed: May 24, 2002
    Date of Patent: September 6, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takeshi Kuribayashi, Kazuyuki Nakano
  • Patent number: 6920686
    Abstract: A component mounting apparatus has an intermittently rotated rotary mounting section which has a driver at an upper part for driving motors of mounting heads arranged on periphery of the rotary mounting section. A controller in a stationary part of the apparatus inputs power and control signals to the rotating driver which is formed in an annular shape, and includes motor driver mounting plates with motor drivers for controlling power supplied to each motor. The motor driver mounting plates are arranged radially around a rotation axis of the rotating driver with planar surfaces in parallel to the rotation axis.
    Type: Grant
    Filed: March 19, 2001
    Date of Patent: July 26, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kenji Okamoto, Kazuyuki Nakano, Takeshi Takeda
  • Publication number: 20040143964
    Abstract: The present invention provides an electronic component mounting apparatus which can reduce a consumption power amount in comparison with the background art, and a power supply control method which is executed by the electronic component mounting apparatus. A drive power source and a control power source are separately connected and shut-off in accordance with a command from a control device (104) to each of component feed drive parts (107A, 107B) for driving component feed devices (101A, 101B), a component transfer drive device (108) for driving a component transfer device (102), and a circuit board positioning drive device (109) for driving a circuit board positioning device (103). The control device detects an individual occurrence of halt condition of each of constitution parts of an electronic component mounting apparatus (100) and shuts off the drive power source to the drive device in the halt condition.
    Type: Application
    Filed: January 16, 2004
    Publication date: July 29, 2004
    Inventors: Keizo Izumida, Takeshi Takeda, Kazuyuki Nakano
  • Patent number: 6701611
    Abstract: The present invention provides an electronic component mounting apparatus which can reduce a consumption power amount in comparison with the background art, and a power supply control method which is executed by the electronic component mounting apparatus. A drive power source and a control power source are separately connected and shut-off in accordance with a command from a control device to each of component feed drive parts for driving component feed devices, a component transfer drive device for driving a component transfer device, and a circuit board positioning drive device for driving a circuit board positioning device. The control device detects an individual occurrence of halt condition of each of constitution parts of an electronic component mounting apparatus and shuts off the drive power source to the drive device in the halt condition. Thus, a wasteful power consumption is eliminated and the production is continued with a necessary minimum power.
    Type: Grant
    Filed: October 18, 2001
    Date of Patent: March 9, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Keizo Izumida, Takeshi Takeda, Kazuyuki Nakano
  • Patent number: 6542238
    Abstract: An electronic component mounting apparatus (1) includes a device for illuminating a mark (9) on a printed circuit board (14) for recognition. The illumination device (10) includes a light path adjustable member (5). This light path adjustable member (5) is disposed between an illumination source unit (2) and the object (9) to be illuminated. At least one of the light incidence side and the emission side of the light path adjustable member (5) is divided into a plurality of subareas (6), (7), (8), each having a different index of refraction. Each of the subareas (6), (7), (8) emits light at a respective different index of refraction. The emitted light can be collected on a specific area containing the object (9), and appropriate illumination light can thus be emitted to the object (9).
    Type: Grant
    Filed: October 12, 2000
    Date of Patent: April 1, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yasutaka Tsuboi, Kazuyuki Nakano, Shozo Fukuda
  • Publication number: 20020194729
    Abstract: A method of positioning an electronic component, such as a BGA component, with respect to a mounting head. The BGA component is positioned through positional detection of a reference mark and inspection, and the positional correction is executed by checking the holding posture. Through inspection using the reference mark as a reference position, the dropout, dislocation, shortage of solder amount of the solder bumps of the component are subjected to a quality check (S4). If of normal quality, the component is moved closer to the mounting position of the printed board on a mounting table by a mounting head (S5). A recognition mark in the target mounting position of the printed board is confirmed and recognized (S6). By determining the mounting position through mounting position detection and component inspection result, the mounting position is corrected (S7) and the height of the mounting head is controlled and mounted (S8).
    Type: Application
    Filed: May 24, 2002
    Publication date: December 26, 2002
    Inventors: Takeshi Kuribayashi, Kazuyuki Nakano
  • Patent number: 6429387
    Abstract: An electronic component, such as a BGA component, and a method of positioning with respect to a mounting head the component. The BGA component is positioned through positional detection of a reference mark and inspection, and the positional correction is executed by checking the holding posture. Through the inspection using the reference mark as a reference position, the dropout, dislocation, shortage of solder amount of the solder bumps of the component are subject to a quality check (S4). If of normal quality, the component is moved closer to the mounting-position of the printed board on a mounting table by a mounting head (S5). A recognition mark in the target mounting position of the printed board is confirmed and recognized (S6). By determining the mounting position through mounting position detection and component inspection result, the mounting position is corrected (S7) and the height of the mounting head is controlled and the component is mounted (S8).
    Type: Grant
    Filed: June 11, 1999
    Date of Patent: August 6, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takeshi Kuribayashi, Kazuyuki Nakano
  • Publication number: 20020069517
    Abstract: There is provided a circuit board fixing table having a structure in which no vibration or shock is applied to a transport motor when a circuit board is fixed and an electronic component mounting apparatus utilizing the circuit board fixing table and capable of mounting electronic components without causing operational failures during transportation. A circuit board fixing table for transporting a circuit board placed on transport belts to a predetermined position and fixing it with an elevating fixing device, the table having a transport motor provided separately from a support member for the transport belts for driving the transport belts and power transmission mechanisms A and B for transmitting a driving force of the transport motor to the transport belts.
    Type: Application
    Filed: December 10, 2001
    Publication date: June 13, 2002
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Izumi Miura, Hirofumi Obara, Naoto Mimura, Kazuyuki Nakano
  • Publication number: 20020020056
    Abstract: An intermittently rotated rotary mounting section 1 of a component mounting apparatus has a driver 15 at its upper part for driving the motors 11 of each of a plurality of mounting heads 10 arranged on the periphery of the rotary mounting section. A controller is built in a stationary part of the apparatus, from which power and control signals are input to the rotating driver 15. The driver 15 is formed in an annular shape, and includes a plurality of motor driver mounting plates 30, to which motor drivers 24 for controlling power supply to each motor 11 are attached. The motor driver mounting plates 30 are arranged radially around the rotation axis of the driver 15 with their planar surfaces in parallel to the rotation axis.
    Type: Application
    Filed: March 19, 2001
    Publication date: February 21, 2002
    Inventors: Kenji Okamoto, Kazuyuki Nakano, Takeshi Takeda
  • Publication number: 20010027877
    Abstract: Processing is started (S1), and control of mounting processes is successively executed by mounting program instructions of a storage section (S2). An electronic component is positioned with respect to a mounting head, taken out, and held (S3). The BGA component is positioned through positional detection of a reference mark and inspection, and the correcting is executed by checking the holding posture. Through the inspection using the reference mark as a reference position, the dropout, dislocation, shortage of solder amount of the solder bumps of the component are subjected to quality check (S4). The normal component is moved closer to the mounting position of the printed board on a mounting table by a mounting head (S5). A recognition mark in the target mounting position of the printed board is confirmed and recognized (S6).
    Type: Application
    Filed: June 18, 2001
    Publication date: October 11, 2001
    Inventors: Takeshi Kuribayashi, Kazuyuki Nakano
  • Patent number: 6263813
    Abstract: The present invention relates to an apparatus for preventing a double chain stitching from raveling. Looper thread engaging structure engages with the looper thread consecutive to the looper from the cloth by moving when the looper is at the forward position and forms a looper thread loop consecutive from the cloth at the engaged portion by driving a sewing machine in the engaged state. A looper thread cutter cuts the looper thread loop at the engaged portion and a thread cutter cuts the loop-shaped needle thread consecutive to the needle via the looper from the cloth and the looper thread consecutive to the looper from the cloth between the cloth and the looper. Therefore, it is able to prevent a double chain stitching from raveling from the stitching end side. Further, defining structure is provided to define the moving distance of the looper thread engaging structure.
    Type: Grant
    Filed: April 10, 2000
    Date of Patent: July 24, 2001
    Assignee: Pegasus Sewing Machines Mfg. Co., Ltd.
    Inventors: Fumio Toume, Kazuyuki Nakano, Masashi Watanabe
  • Patent number: 5853108
    Abstract: When feeding parts (102) to a mounting machine (A) by using a parts feed cassette (B), prior to parts feed, air is preliminarily supplied to the parts feed cassette (B) to put the parts (102) in neat order, and the parts (102) are preliminarily sent up to a final position in a parts feed route (113). Accordingly, if the parts (102) cannot be securely sent up to the parts feed position (114) in the parts feed route (113) by supplying air (1b) only for a specific limited time for feeding parts (102), the parts (102) can be preliminarily sent forward in neat order, and by the supply of air (1b) for parts feed, the parts (102) can be fed quickly, securely, and stably.
    Type: Grant
    Filed: August 16, 1996
    Date of Patent: December 29, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takashi Ando, Yoshihisa Tachiyama, Yoshimi Ohara, Tsukasa Tanihara, Akio Yamagami, Kazuyuki Nakano, Shigeki Imafuku
  • Patent number: 4824373
    Abstract: A denture base of pressure-formed, superplastic alloy plate, and a method of making a metal denture base, includes providing a superplastic alloy plate and a female die having a finishing surface, and pressure-forming the alloy plate on the finishing surface of the female die at a temperature where the alloy exhibits superplasticity.
    Type: Grant
    Filed: October 2, 1987
    Date of Patent: April 25, 1989
    Assignees: Sankin Industry Co., Sumitomo Metal Industries, Ltd.
    Inventors: Minoru Okada, Yoshiaki Shida, Tomio Nishikawa, Isamu Kato, Kazuyuki Nakano, Ryozo Isomura
  • Patent number: 4485132
    Abstract: A method of continuous coating of metallic strip material carried into practice by using a continuous strip coating device wherein the thickness of the coating is decided by a gap between a pickup roll and a thickness control member spaced apart a predetermined distance from the surface of the pickup roll. The method includes the step of (1) setting the pressure of the paint and/or the size of the gap based on the data obtained by preliminary experiments, or (2) directly measuring the gap between the surface of the pickup roll and the thickness control member and feeding back the measurement, to bring the actual size of the gap into agreement with the value set beforehand at all times.
    Type: Grant
    Filed: July 16, 1982
    Date of Patent: November 27, 1984
    Assignees: Hitachi, Ltd., Nisshin Steel Co., Ltd.
    Inventors: Yoshihisa Furuzono, Toshiyuki Kajiwara, Toshiyuki Kadota, Kazuyuki Nakano, Kenzi Tabusi
  • Patent number: 4202687
    Abstract: A low melting point Ni-Cr alloy is fusible easily with a low-calorie heat source commonly and easily available. The alloy comprises, Ni, Cr, Cu, Mn and Al as the principal components thereof and an appropriate deoxidizer. There is further added at least one alloy element selected from the group consisting of Ga, Nb and Zr or other alloy elements if circumstances permit. The low melting point of the alloy disclosed herein simplifies casting facilities, makes plaster molds usable and facilitates the removal of products after casting.
    Type: Grant
    Filed: March 28, 1979
    Date of Patent: May 13, 1980
    Assignee: Sankin Industry Co., Ltd.
    Inventors: Kentaro Murayama, Kazuyuki Nakano