Abstract: Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other.

Abstract: Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other.

Abstract: Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other.

Abstract: Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other.

Abstract: Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other.

Abstract: A thermoplastic liquid polymer film and a method of producing the same are provided. The method includes preparing a thermoplastic liquid crystal polymer film that has dielectric constants of not larger than 3.25 both in an MD direction and in a TD direction; and performing drawing of the film while heating the film at a temperature in a range from a temperature (Td-60° C.) that is 60° C. lower than a heat deformation temperature (Td) of the film to a temperature (Td-5° C.) that is 5° C. lower than Td. The temperature of the heating during the drawing of the film may be in a range from a temperature (Td-40° C.) that is 40° C. lower than a heat deformation temperature (Td) of the film subjected to the drawing to a temperature (Td-10° C.) that is 10° C. lower than Td.

Abstract: Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other.

Abstract: To prevent erroneous recognitions of line failures by a network apparatus, an alarm notifying controller region is provided independent from an actual data region in a connection between a line interface of the network apparatus and a terminal interface unit (line set). When a line is set within the network apparatus, an alarm notification path from the line interface to the line set is simultaneously set. When a line failure is detected by the line interface, information is notified the alarm notification path to all of the line sets connected to this line interface. In the line sets, a signal state of an interface is changed with respect to each sort of terminal interfaces, so that the line failure is notified to the terminal.

Abstract: To prevent erroneous recognitions of line failures by a network apparatus, an alarm notifying controller region s provided independent from an actual data region in a connection between a line interface of the network apparatus and a terminal interface unit (line set). When a line is set within the network apparatus, an alarm notification path from the line interface to the line set is simultaneously set. When a line failure is detected by the line interface, information is notified the alarm notification path to all of the line sets connected to this line interface. In the line sets, a signal state of an interface is changed with respect to each sort of terminal interfaces, so that the line failure is notified to the terminal.

Abstract: An optical filter, such as a low-pass filter, which is disposed between a photo-taking lens mounted on a mount part of the camera body having an image sensor disposed on an image forming plane and a main mirror disposed within the camera body, is held in position jointly by a holding member fixed to the lower end of a front aperture part of the camera body and an elastic member fixed to the rear side of the holding member with a resilient force applied to the optical filter. In mounting the photo-taking lens on the camera body, when an end part of the photo-taking lens comes to touch the optical filter, the optical filter is allowed to temporarily move to escape from the photo-taking lens and to come back to its original position upon completion of the lens mounting operation.