Abstract: A method for manufacturing a semiconductor device is disclosed. The method for manufacturing a semiconductor device includes preparing a base material, preparing a plurality of semiconductor elements each having a connection terminal, preparing a wiring board provided with a first wiring, arranging the plurality of semiconductor elements on the base material, covering the plurality of semiconductor elements on the base material with an insulating material, arranging the wiring board on at least one of the plurality of semiconductor elements so that the first wiring is connected to at least some of the connection terminals of the plurality of semiconductor elements covered with the insulating material, and forming a second wiring around the first wiring. The first wiring has finer wiring than the second wiring.

Abstract: A surface light source device includes a light source; a light guide plate that has a light entrance surface through which light enters, and that emits the light entering through the light entrance surface from a light exit surface; a wiring board; and a metal frame. The metal frame includes a bottom portion having a bottom surface that faces a surface on an opposite side to the light exit surface, a side wall erected on an outer periphery of the bottom surface, and a projecting portion provided on the side wall so as to project toward the bottom surface side. The metal frame houses the light source, the light guide plate, and the wiring board. At least a part of the light source is disposed between the bottom portion and the projecting portion, and the wiring board is disposed between the light source and the bottom portion.

Abstract: In order to be more compact and thin, this light emitting device includes LED elements embedded in a resin molded body such that light emitting units are exposed on a lateral surface of the resin molded body and positive electrodes and negative electrodes are exposed on a back surface which is perpendicular to the lateral surface of the resin molded body.

Abstract: A surface light source device includes a light source; a light guide plate that has a light entrance surface through which light enters, and that emits the light entering through the light entrance surface from a light exit surface; a wiring board; and a metal frame. The metal frame includes a bottom portion having a bottom surface that faces a surface on an opposite side to the light exit surface, a side wall erected on an outer periphery of the bottom surface, and a projecting portion provided on the side wall so as to project toward the bottom surface side. The metal frame houses the light source, the light guide plate, and the wiring board. At least a part of the light source is disposed between the bottom portion and the projecting portion, and the wiring board is disposed between the light source and the bottom portion.

Abstract: In order to be more compact and thin, this light emitting device includes LED elements embedded in a resin molded body such that light emitting units are exposed on a lateral surface of the resin molded body and positive electrodes and negative electrodes are exposed on a back surface which is perpendicular to the lateral surface of the resin molded body.