Abstract: An electronic device comprising: an array substrate having a first electrode and a second electrode; a first connecting member arranged on the first electrode; a first LED chip mounted on the first connecting member; a second connecting member arranged on the second electrode and being thicker than the first connecting member; and a second LED chip mounted on the second connecting member. A distance from a reference surface of the array substrate to a top surface of the second connecting member is larger than a distance from the reference surface to a top surface of the first connecting member.

Abstract: Performance of an electronic device is improved. A substrate for transfer includes a substrate having a surface and made of a visible light transmitting material, and an elastic deformation portion fixed on the surface of the substrate, transmitting visible light, and made of an elastically deformable material. The elastic deformation portion includes a plurality of element holding portions, and a plurality of protrusions arranged at positions not overlapping with the plurality of element holding portions, and protruding higher than the plurality of element holding portions when the surface of the substrate is a reference plane.

Abstract: An information processing device includes a control unit configured to determine whether to include a regenerative brake in specifications of a proposed vehicle based on regenerative brake operation data acquired while a first vehicle including the regenerative brake is traveling in a predetermined area. The proposed vehicle is a vehicle proposed as a vehicle for a customer to drive in the predetermined area.

Abstract: Disclosed is a manufacturing method of a display device including: transferring at least one inorganic light-emitting diode formed over a base substrate onto a first carrier substrate; arranging a plurality of spacers configured to be elastically deformed over a substrate over which a pixel including a plurality of sub-pixels is arranged; and transforming the at least one inorganic light-emitting diode over the first carrier substrate onto the substrate. The manufacturing method may further include removing the plurality of spacers.

Abstract: A method for manufacturing a display device includes preparing a circuit board including a drive circuit for driving a LED chip, forming a connecting electrode on the circuit board, forming an adhesive layer on the connecting electrode, adhering a terminal electrode of the LED chip on the adhesive layer and joining the connecting electrode and the terminal electrode by irradiating a laser light. The adhesive layer may be formed only on a upper surface of the connecting electrode.

Abstract: A display device includes a substrate, a first electrode and a second electrode on the substrate, and an LED chip disposed on the first electrode and the second electrode and having an n-side pad electrode and a p-side pad electrode. The n-side pad electrode has a first protruding portion, the first protruding portion protruding toward the substrate and in contact with the first electrode, and the p-side pad electrode has a second protruding portion, the second protruding portion protruding toward the substrate and in contact with the second electrode.

Abstract: A display device includes a first substrate, a light-emitting element on the first substrate, a second substrate opposed to the first substrate, a first protruding structure surrounding the light-emitting element on a surface of the second substrate opposed to the first substrate, and a light-shielding film overlapping the first protruding structure between the first substrate and the second substrate, wherein a supplementary angle of an inclination angle of a side surface of the first protruding structure is 30 degrees or more and 90 degrees or less. In addition, the display device further includes a reflective film on the side surface of the first protruding structure. Furthermore, the light-shielding film is located between the first protruding structure and the second substrate. Besides, a surface of the first protruding structure on a side of the second substrate is smaller than the light-shielding film.

Abstract: According to one embodiment, a display device including a display panel including a mount side curved to correspond to the curved shape of a display surface, a flat circuit board, and a first flexible wiring board mounted on the display panel in a first end side while being connected to the circuit board in a second end side, wherein the first flexible wiring board includes a first base member including a first surface and a second surface, a first line positioned in the first surface side, and a first protection layer covering the first line, and includes a first bending part to be bent between a first bending boundary and a second bending boundary, the second bending boundary is inclined with respect to the first bending boundary, and the first base member includes a first groove positioned in the first bending part and formed in the second surface.

Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.

Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.

Abstract: According to one embodiment, a display device includes a plurality of light emitting elements mounted on an insulating substrate, a plurality of lines connected to the plurality of light emitting elements, and a planarization film provided between the light emitting elements and the insulating substrate, wherein each of the plurality of light emitting elements comprises a first electrode and a second electrode that are connected to the lines, the planarization film includes a recess portion around each of the light emitting elements, a reflective portion formed of a reflective material is provided on a side surface of the recess portion.

Abstract: According to an aspect, a manufacturing method of a display device includes: obtaining a first reference position on a surface of a holding substrate based on positions of a plurality of first alignment marks of the holding substrate; and aligning the holding substrate with a transfer destination substrate such that the first reference position on the holding substrate and a second reference position on a surface of the transfer destination substrate coincide. The holding substrate is sectioned into a plurality of first sections and a plurality of second sections when viewed from one direction. Each of the first sections is provided in a part of a gap between the second sections when viewed from the one direction, has a light transmission rate higher than a light transmission rate of the second sections, and forms the first alignment mark through which light passes when viewed from the one direction.

Abstract: According to one embodiment, a wafer for electronic components, includes a sapphire substrate including a first surface and a second surface on an opposite side to the first surface and a plurality of electronic components located on a side of the first surface, and the sapphire substrate includes trench portions located between respective adjacent electronic components, and the trench portions extend linearly in plan view.

Abstract: According to one embodiment, a method of mounting electronic components, includes placing a workpiece comprising an insulating substrate including a first surface, a circuit board including a terminal portion and a spacer, a sapphire substrate including a second surface and a wafer including the electronic components, bringing the pressure jig into contact with a part of the sapphire substrate to apply a load on a contact part between a part of an upper surface of the spacer and the second surface, pressing the sapphire substrate toward the circuit board with the pressure jig, to bring other part of the upper surface of the spacer into contact with the second surface and flatten the sapphire substrate.

Abstract: Disclosed is a display device including a substrate, a plurality of pixels, a counter substrate, and at least one rib. The plurality of pixels is located over the substrate and each includes a light-emitting diode. The counter substrate is located over the plurality of pixels. The at least one rib is formed over the counter substrate, located over a region between the plurality of light-emitting diodes included in the plurality of pixels, and has a height larger than a height of the light-emitting diode.

Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.

Abstract: According to one embodiment, a display device includes an array substrate having a first main surface on which a plurality of light emitting elements spaced apart from each other is provided and a second main surface located on an opposite side of the first main surface, an optical resin layer provided between the plurality of light emitting elements and on the plurality of light emitting elements on the first main surface of the array substrate, and a light transmitting layer provided on the optical resin layer. The optical resin layer has a refractive index of 1.40 or more and 1.60 or less, and translucency of 90% or more.

Abstract: An LED module includes a first electrode, a second electrode arranged isolated from the first electrode, a first bump on the first electrode, a second bump on the second electrode, a protrusion between the first electrode and the second electrode, and an LED chip having a first pad electrode and a second pad electrode. The protrusion has insulating properties, the first pad electrode of the LED chip is disposed opposite the first electrode, the second pad electrode is disposed opposite the second electrode, the first pad electrode is connected to the first electrode through the first bump, and the second pad electrode is connected to the second electrode through the second bump.

Abstract: A wearable device according to an embodiment comprises a body configured to surround the outside of a subject, a light emitting unit arranged on an inner periphery of the body and including at least one first light emitting element, a light-receiving unit arranged on the inner periphery of the body and arranged opposite the light emitting unit, a display unit arranged on an outer periphery of the body and including at least one second light emitting element, and a first flexible substrate mounted with the at least one first light emitting element and the at least one second light emitting element, and the first flexible substrate has a first surface and a second surface opposite to the first surface, and the at least one first light emitting element and the at least one second light emitting element are mounted on the first surface of the first flexible substrate.

Abstract: An LED module has a first layer including a first plane, an LED chip arranged on the first plane, a second layer surrounding the LED chip and including a convex part on the first plane, and a third layer arranged outside the LED chip and overlapping an upper surface of the first layer, a side surface of the second layer, and a part of the upper surface of the second layer. In the LED module, a height of the convex part of the second layer is lower than a height of the upper surface of the LED chip, and the first layer, the second layer and the third layer include conductive films.