Patents by Inventor Ke-Ping Huang

Ke-Ping Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240096705
    Abstract: A semiconductor device includes a plurality of channel layers vertically separated from one another. The semiconductor device also includes an active gate structure comprising a lower portion and an upper portion. The lower portion wraps around each of the plurality of channel layers. The semiconductor device further includes a gate spacer extending along a sidewall of the upper portion of the active gate structure. The gate spacer has a bottom surface. Moreover, a dummy gate dielectric layer is disposed between the gate spacer and a topmost channel layer of plurality of channel layers. The dummy gate dielectric layer is in contact with a top surface of the topmost channel layer, the bottom surface of the gate spacer, and the sidewall of the gate structure.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuei-Yu Kao, Chen-Yui Yang, Hsien-Chung Huang, Chao-Cheng Chen, Shih-Yao Lin, Chih-Chung Chiu, Chih-Han Lin, Chen-Ping Chen, Ke-Chia Tseng, Ming-Ching Chang
  • Patent number: 7367849
    Abstract: An electrical connector is provided with a circuit board with interconnecting conductors respectively extending between spring contact termination locations and other termination locations. Sets of spring contact conductors are provided terminating at respective spring contact termination locations. Each of the spring contact conductors of the set of spring contact conductors has a plug contact zone and defines a spring contact conductive path from an associated plug contact zone to a respective spring contact termination location. The sets of spring contact conductors provide different conductive path lengths from an associated plug contact zone to a respective spring contact termination location.
    Type: Grant
    Filed: March 7, 2006
    Date of Patent: May 6, 2008
    Assignee: Surtec Industries, Inc.
    Inventors: Hung-Lin Wang, Chou-Hsing Chen, Yung-Cheng Yang, Ke-Ping Huang
  • Publication number: 20070212945
    Abstract: An electrical connector is provided with a circuit board with interconnecting conductors respectively extending between spring contact termination locations and other termination locations. Sets of spring contact conductors are provided terminating at respective spring contact termination locations. Each of the spring contact conductors of the set of spring contact conductors has a plug contact zone and defines a spring contact conductive path from an associated plug contact zone to a respective spring contact termination location. The sets of spring contact conductors provide different conductive path lengths from an associated plug contact zone to a respective spring contact termination location.
    Type: Application
    Filed: March 7, 2006
    Publication date: September 13, 2007
    Inventors: Hung-Lin Wang, Chou-Hsing Chen, Yung-Cheng Yang, Ke-Ping Huang
  • Publication number: 20070197102
    Abstract: An electrical connector is provided with a circuit board with interconnecting conductors respectively extending between spring contact termination locations and other termination locations. A set of spring contact conductors are provided terminating at respective spring contact termination locations. Each of said spring contact conductors of the set of spring contact conductors has a plug contact zone and defines a spring contact conductive path from an associated plug contact zone to a respective said spring contact termination location that is 6.7 mm or less.
    Type: Application
    Filed: February 23, 2006
    Publication date: August 23, 2007
    Inventors: Hung-Lin Wang, Chou-Hsing Chen, Yung-Cheng Yang, Ke-Ping Huang