Patents by Inventor Keal Doo MOON

Keal Doo MOON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11874955
    Abstract: One embodiment discloses an electronic device including a first acquisition unit which outputs first motion information about a detection target in a first detection region, a second acquisition unit which outputs second motion information about the detection target in a second detection region, and a control unit which executes an instruction according to the first motion information and the second motion information, wherein the first detection region and the second detection overlap at least partially.
    Type: Grant
    Filed: July 3, 2020
    Date of Patent: January 16, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Min Seok Kang, Ellen Park, Eun Yeob Kang, Keal Doo Moon
  • Publication number: 20220276695
    Abstract: One embodiment discloses an electronic device including a first acquisition unit which outputs first motion information about a detection target in a first detection region, a second acquisition unit which outputs second motion information about the detection target in a second detection region, and a control unit which executes an instruction according to the first motion information and the second motion information, wherein the first detection region and the second detection overlap at least partially.
    Type: Application
    Filed: July 3, 2020
    Publication date: September 1, 2022
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Min Seok KANG, Ellen PARK, Eun Yeob KANG, Keal Doo MOON
  • Patent number: 10693049
    Abstract: One embodiment relates to a light emitting device package having improved luminous flux, and a light emitting device package, according to one embodiment of the present invention, comprises: a light emitting device having an electrode pad arranged at a lower surface thereof; a wavelength conversion layer for covering four lateral surfaces of the light emitting device; a first reflective pattern for covering an upper surface of the light emitting device and three lateral surfaces of the light emitting device so as to expose the wavelength conversion layer of the one remaining lateral surface, which is a light emitting surface of the light emitting device; and a second reflective pattern arranged between the first reflective pattern and the upper surface of the light emitting device.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: June 23, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Keal Doo Moon, Dong Yong Lee, Sang Jun Lee
  • Patent number: 10374135
    Abstract: An embodiment provides a light emitting device package comprising: a package body; a first lead frame and a second lead frame, of which at least a part of each is inserted into the package body; and a light emitting device electrically flip bonded to the first lead frame and to the second lead frame, wherein the package body forms an electrode separation line between the first lead frame and the second lead frame, and the electrode separation line has at least two curved portions.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: August 6, 2019
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Keal Doo Moon, Sung Joo Oh
  • Publication number: 20190157531
    Abstract: An embodiment provides a light emitting device package comprising: a package body; a first lead frame and a second lead frame, of which at least a part of each is inserted into the package body; and a light emitting device electrically flip bonded to the first lead frame and to the second lead frame, wherein the package body forms an electrode separation line between the first lead frame and the second lead frame, and the electrode separation line has at least two curved portions.
    Type: Application
    Filed: November 4, 2015
    Publication date: May 23, 2019
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Keal Doo MOON, Sung Joo OH
  • Publication number: 20180358520
    Abstract: One embodiment relates to a light emitting device package having improved luminous flux, and a light emitting device package, according to one embodiment of the present invention, comprises: a light emitting device having an electrode pad arranged at a lower surface thereof; a wavelength conversion layer for covering four lateral surfaces of the light emitting device; a first reflective pattern for covering an upper surface of the light emitting device and three lateral surfaces of the light emitting device so as to expose the wavelength conversion layer of the one remaining lateral surface, which is a light emitting surface of the light emitting device; and a second reflective pattern arranged between the first reflective pattern and the upper surface of the light emitting device.
    Type: Application
    Filed: October 26, 2016
    Publication date: December 13, 2018
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Keal Doo MOON, Dong Yong LEE, Sang Jun LEE
  • Patent number: 9620691
    Abstract: Embodiments provide a light emitting device package including a first lead frame including a first contact area and a first exposed area, a second lead frame spaced apart from the first lead frame, the second lead frame including a second contact area and a second exposed area, a bottom portion located between the first contact area and the first exposed area, between the second contact area and the second exposed area, and between the first contact area and the second contact area, a light emitting device electrically connected to the first and second contact areas, and a package body having a cavity configured to expose the first and second contact areas, the first and second exposed areas, and the bottom portion, wherein the bottom portion has a thermal expansion coefficient greater than a thermal expansion coefficient of the first and second lead frames.
    Type: Grant
    Filed: August 24, 2015
    Date of Patent: April 11, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sung Joo Oh, Keal Doo Moon, Gyu Hyeong Bak
  • Patent number: 9559278
    Abstract: Embodiments provide light emitting device package including a package body, a first lead frame and a second lead frame disposed on the package body, and a light emitting device electrically connected to the first lead frame and the second lead frame via respective conductive adhesives. At least one of the conductive adhesives has the smallest width at a central region thereof.
    Type: Grant
    Filed: May 28, 2015
    Date of Patent: January 31, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sung Joo Oh, Keal Doo Moon, Dong Yong Lee
  • Publication number: 20160056356
    Abstract: Embodiments provide a light emitting device package including a first lead frame including a first contact area and a first exposed area, a second lead frame spaced apart from the first lead frame, the second lead frame including a second contact area and a second exposed area, a bottom portion located between the first contact area and the first exposed area, between the second contact area and the second exposed area, and between the first contact area and the second contact area, a light emitting device electrically connected to the first and second contact areas, and a package body having a cavity configured to expose the first and second contact areas, the first and second exposed areas, and the bottom portion, wherein the bottom portion has a thermal expansion coefficient greater than a thermal expansion coefficient of the first and second lead frames.
    Type: Application
    Filed: August 24, 2015
    Publication date: February 25, 2016
    Inventors: Sung Joo OH, Keal Doo MOON, Gyu Hyeong BAK
  • Publication number: 20150349225
    Abstract: Embodiments provide light emitting device package including a package body, a first lead frame and a second lead frame disposed on the package body, and a light emitting device electrically connected to the first lead frame and the second lead frame via respective conductive adhesives. At least one of the conductive adhesives has the smallest width at a central region thereof.
    Type: Application
    Filed: May 28, 2015
    Publication date: December 3, 2015
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Sung Joo OH, Keal Doo MOON, Dong Yong LEE