Abstract: A surface mountable heat sink apparatus for use with surface mount electronic components comprises a heat dissipating body and a plurality of solderable feet complying with Surface Mounting Technology (SMT). The heat dissipating body and the solderable feet are made of different materials and of unitary construction. The solderable feet project partially beyond one edge of the heat dissipating body. The surface mount heat sink apparatus and surface mount electronic component are touchlessly sandwiched and simultaneously soldered onto the solder drain pads on the printed circuit board. Heat dissipated from the surface mount electronic component is conductively transferred to the heat sink body through the solder drain pad, printed circuit board and solderable feet, and finally rejected to surroundings thereafter. Like all the SMT electronic components, the surface mount heat sink apparatus can be placed onto the printed circuit board manually or automatically by a pick-&-place automation equipment.

Abstract: An integral spring clip for use with a heat dissipator or heat sink apparatus comprises a securing portion and an attaching portion. The securing portion is configured to flex about a pivot axis to effect an engaged relation to substantially fixedly maintain the electronic component in abutting relation to the heat absorbing surface of a heat dissipater or a heat sink apparatus and secure it in a predefined position. The attaching portion comprises a plurality of solderable elements and is configured to attach a heat dissipator assembly in either vertical or horizontal orientation firmly onto a printed circuit or wiring board in a pre-defined place via soldering techniques. The ramified integral spring clip with a cam bar added on will further facilitate the assembly and disassembly operations. The integral spring clip is a simple unitary design and made of a single length spring wire with whole or selective solder coating.

Abstract: A pumpless liquid cooling system for removing heat from heat-generating components or systems comprises a heat absorbing portion or cold plate, a heat dissipating portion or heat exchanger and at least one driving device. The heat absorbing portion and the heat dissipating portion are of unitary construction as a sealed container with working fluid inside. The driving device and the heat dissipating portion is co-axially aligned and attached or fastened together. The heat absorbing portion is configured to have at least one thermal contact surface and a plurality of liquid passage within. The heat dissipating portion is configured to have a heat-dissipating body with plurality of external fins and an internal cylindrical liquid passage communicating with those of the heat absorbing portion and having a running fitting impeller driven by the driving device via magnetic forces to circulate the liquid in the heat transfer loop.