Patents by Inventor Kedar V. Bhatawadekar
Kedar V. Bhatawadekar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10895609Abstract: A circuit protection device including a primary fuse, and a positive temperature coefficient (PTC) device and a secondary fuse electrically connected in series with one another and in parallel with the primary fuse, the secondary fuse formed of a quantity of solder disposed on a dielectric surface, wherein the dielectric surface exhibits a de-wetting characteristic relative to the solder such that, when the solder is melted, the solder draws away from the dielectric surface to create a galvanic opening.Type: GrantFiled: May 9, 2019Date of Patent: January 19, 2021Assignee: Littelfuse, Inc.Inventors: Yuriy Borisovich Matus, Martin Pineda, Kedar V. Bhatawadekar
-
Publication number: 20200355736Abstract: A circuit protection device including a primary fuse, and a positive temperature coefficient (PTC) device and a secondary fuse electrically connected in series with one another and in parallel with the primary fuse, the secondary fuse formed of a quantity of solder disposed on a dielectric surface, wherein the dielectric surface exhibits a de-wetting characteristic relative to the solder such that, when the solder is melted, the solder draws away from the dielectric surface to create a galvanic opening.Type: ApplicationFiled: May 9, 2019Publication date: November 12, 2020Applicant: Littelfuse, Inc.Inventors: Yuriy Borisovich Matus, Martin Pineda, Kedar V. Bhatawadekar
-
Patent number: 10074944Abstract: A circuit includes a connector having first and second mateable portions. Each portion includes at least two terminals configured to mechanically engage at least two terminals of the other portion. The two terminals within the first and second portions are arranged so that as the first and second portions are mated, a first terminal of the first portion and a first terminal of the second portions come into contact before respective second terminals of the first and second portions. The circuit also includes a polymeric positive temperature coefficient (PPTC) device with a first terminal in electrical communication with the first terminal of the first portion and a second terminal in electrical communication with the second terminal of the first portion. A power terminal is in electrical communication with the second terminal of the first portion and is configured to be connected to a power source.Type: GrantFiled: March 21, 2016Date of Patent: September 11, 2018Assignee: Littelfuse, Inc.Inventors: Kedar V. Bhatawadekar, Mario G. Sepulveda, Jason Larson
-
Publication number: 20170271824Abstract: A circuit includes a connector having first and second mateable portions. Each portion includes at least two terminals configured to mechanically engage at least two terminals of the other portion. The two terminals within the first and second portions are arranged so that as the first and second portions are mated, a first terminal of the first portion and a first terminal of the second portions come into contact before respective second terminals of the first and second portions. The circuit also includes a polymeric positive temperature coefficient (PPTC) device with a first terminal in electrical communication with the first terminal of the first portion and a second terminal in electrical communication with the second terminal of the first portion. A power terminal is in electrical communication with the second terminal of the first portion and is configured to be connected to a power source.Type: ApplicationFiled: March 21, 2016Publication date: September 21, 2017Applicant: Littelfuse, Inc.Inventors: Kedar V. Bhatawadekar, Mario G. Sepulveda, Jason Larson
-
Patent number: 9659690Abstract: A method of manufacturing a surface mount device includes providing at least one core device and at least one lead frame. The core device is attached to the lead frame. The core device and the lead frame are encapsulated within an encapsulant. The encapsulant comprises a liquid epoxy that when cured has an oxygen permeability of less than approximately 0.4 cm3·mm/m2·atm·day.Type: GrantFiled: October 14, 2014Date of Patent: May 23, 2017Assignee: Littelfuse, Inc.Inventors: Mario G. Sepulveda, Martin G. Pineda, Anthony Vranicar, Kedar V. Bhatawadekar, Minh V. Ngo, Dov Nitzan
-
Patent number: 9646744Abstract: A method of manufacturing a surface mount device includes forming a plaque from a material, forming a plurality of conductive protrusions on a top surface and a bottom surface of the plaque, and applying a liquid encapsulant over at least a portion of the top surface and at least a portion of the bottom surface of the plaque. The liquid encapsulant is cured and when cured encapsulant has an oxygen permeability of less than about 0.4 cm3·mm/m2·atm·day. The assembly is cut to provide a plurality of components. After cutting, the top surface of each component includes at least one conductive protrusion, the bottom surface of each component includes at least one conductive protrusion, the top surface and the bottom surface of each component include the cured encapsulant, and a core of each component includes the material.Type: GrantFiled: October 14, 2014Date of Patent: May 9, 2017Assignee: LITTELFUSE, INC.Inventors: Mario G. Sepulveda, Martin G. Pineda, Anthony Vranicar, Kedar V. Bhatawadekar, Minh V. Ngo, Dov Nitzan
-
Publication number: 20160104559Abstract: A method of manufacturing a surface mount device includes forming a plaque from a material, forming a plurality of conductive protrusions on a top surface and a bottom surface of the plaque, and applying a liquid encapsulant over at least a portion of the top surface and at least a portion of the bottom surface of the plaque. The liquid encapsulant is cured and when cured encapsulant has an oxygen permeability of less than about 0.4 cm3·mm/m2·atm·day. The assembly is cut to provide a plurality of components. After cutting, the top surface of each component includes at least one conductive protrusion, the bottom surface of each component includes at least one conductive protrusion, the top surface and the bottom surface of each component include the cured encapsulant, and a core of each component includes the material.Type: ApplicationFiled: October 14, 2014Publication date: April 14, 2016Applicant: Tyco Electronics CorporationInventors: Mario G. Sepulveda, Martin G. Pineda, Anthony Vranicar, Kedar V. Bhatawadekar, Minh V. Ngo, Dov Nitzan
-
Publication number: 20160105965Abstract: A method of manufacturing a surface mount device includes providing at least one core device and at least one lead frame. The core device is attached to the lead frame. The core device and the lead frame are encapsulated within an encapsulant. The encapsulant comprises a liquid epoxy that when cured has an oxygen permeability of less than approximately 0.4 cm3•mm/m2•atm•day.Type: ApplicationFiled: October 14, 2014Publication date: April 14, 2016Applicant: Tyco Electronics CorporationInventors: Mario G. Sepulveda, Martin G. Pineda, Anthony Vranicar, Kedar V. Bhatawadekar, Minh V. Ngo, Dov Nitzan
-
Publication number: 20130286700Abstract: A controller circuit for activating and deactivating an electrical power converter that provides power to a device includes power input terminals on a primary side, and power output terminals on a secondary side, which are configured to provide power to the device. The controller circuit includes a detection circuit configured to determine whether the device is connected and, if connected, causes power to be routed to the electrical power converter to activate the electrical power converter. When the device is not detected, the electrical power converter is deactivated until the device is reconnected.Type: ApplicationFiled: April 25, 2012Publication date: October 31, 2013Applicant: Tyco Electronics CorporationInventors: Kaochi Im, Kedar V. Bhatawadekar, Jianhua Chen, Matthew P. Galla, Patrick J. Hibbs
-
Publication number: 20130286701Abstract: A controller circuit for activating and deactivating an electrical power converter that provides power to a device includes power input terminals on a primary side, and power output terminals on a secondary side, which are configured to provide power to the device. The controller circuit includes a detection circuit configured to determine whether the device is connected and, if connected, causes power to be routed to the electrical power converter to activate the electrical power converter. When the device is not detected, the electrical power converter is deactivated until the device is reconnected.Type: ApplicationFiled: April 25, 2012Publication date: October 31, 2013Applicant: Tyco Electronics CorporationInventors: Kaochi Im, Kedar V. Bhatawadekar, Jianhua Chen, Matthew P. Galla, Patrick J. Hibbs