Abstract: Provided is a silicon nanocomposite structure powder for a negative electrode material, where a SiOx layer is formed on the surface of ultrafine silicon powder by a low-temperature oxidation reaction, and then the silicon powder is milled with graphite powder having excellent conductivity to form a nanocomposite structure, thus achieving improved discharge capacity, efficiency, and cycle characteristics. A method for manufacturing a silicon nanocomposite structure powder for a negative electrode material includes: mechanically milling micro-sized micro silicon powder into nano-sized nano silicon powder; forming an SiOx (1<x<2) layer on the surface of the nano-silicon powder by surface-oxidizing the nano-silicon powder at a low temperature; and dispersing the silicon powder, with the SiOx (1<x<2) layer formed on the surface thereof, in a graphite matrix by mixing and milling the silicon powder, with the SiOx (1<x<2) layer formed on the surface thereof, with graphite powder.

Abstract: Method for fabricating a semiconductor device, is disclosed, in which a grain size is made coarse for forming a thin film with a low resistance, including the steps of (1) depositing an insulating film on a substrate, (2) depositing a silicon layer on the insulating film, (3) depositing an amorphous metal nitride film on the silicon layer, and (4) heat treating the amorphous metal nitride film to alter into a crystalline pure metal film.