Abstract: A fluid control system for a substrate processing system includes (M + N) inlets configured to fluidly connect to (M) solenoid valves and (N) standby solenoid valves, respectively, where (M) and (N) are integers greater than zero. (M) outputs are configured to be fluidly connected to (M) pneumatic valves. A valve switching system is configured to selectively block (1) to (N) of the M inlets corresponding to (1) to (N) failed ones of (M) solenoid valves, respectively, and supply fluid from (1) to (N) of the (N) standby solenoid valves to (1) to (N) of the (M) outputs corresponding to the (1) to (N) failed ones of (M) solenoid valves, respectively.

Abstract: Provided are adaptive heat transfer methods and systems for uniform heat transfer to and from various types of workpieces, such as workpieces employed during fabrication of semiconductor devices, displays, light emitting diodes, and photovoltaic panels. This adaptive approach allows for reducing heat transfer variations caused by deformations of workpieces. Deformation may vary in workpieces depending on types of workpieces, processing conditions, and other variables. Such deformations are hard to anticipate and may be random. Provided systems may change their configurations to account for the conformation of each new workpiece processed. Further, adjustments may be performed continuously of discretely during heat transfer. This flexibility can be employed to improve heat transfer uniformity, achieve uniform temperature profile, reduce deformation, and for various other purposes.

Abstract: Provided are adaptive heat transfer methods and systems for uniform heat transfer to and from various types of workpieces, such as workpieces employed during fabrication of semiconductor devices, displays, light emitting diodes, and photovoltaic panels. This adaptive approach allows for reducing heat transfer variations caused by deformations of workpieces. Deformation may vary in workpieces depending on types of workpieces, processing conditions, and other variables. Such deformations are hard to anticipate and may be random. Provided systems may change their configurations to account for the conformation of each new workpiece processed. Further, adjustments may be performed continuously of discretely during heat transfer. This flexibility can be employed to improve heat transfer uniformity, achieve uniform temperature profile, reduce deformation, and for various other purposes.