Patents by Inventor Kees Faber

Kees Faber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10073184
    Abstract: Microseismic mapping using buried arrays with the integration of passive and active seismic surveys provides enhanced microseismic mapping results. The system is initially set up by recording seismic data with the buried array installation while shooting a significant portion of the 3D surface seismic survey. The 3D surface seismic survey provides the following data: shallow 3D VSP data from the buried arrays; P-wave and converted wave data for the area covered by the buried array that benefits from the planned data integration processing effort; and microseismic data and associated analysis.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: September 11, 2018
    Assignee: ION Geophysical Corporation
    Inventors: Kees Faber, Rick Laroo
  • Patent number: 10061046
    Abstract: Microseismic mapping using buried arrays with the integration of passive and active seismic surveys provides enhanced microseismic mapping results. The system is initially set up by recording seismic data with the buried array installation while shooting a significant portion of the 3D surface seismic survey. The 3D surface seismic survey provides the following data: shallow 3D VSP data from the buried arrays; P-wave and converted wave data for the area covered by the buried array that benefits from the planned data integration processing effort; and microseismic data and associated analysis.
    Type: Grant
    Filed: February 5, 2013
    Date of Patent: August 28, 2018
    Assignee: ION Geophysical Corporation
    Inventors: Gregg S. Hofland, Jacques P. Leveille, Daniel S. Kahn, Kees Faber, Rick Laroo, Jerry L. Lawson, William A. Balla, Michael J. Saur
  • Publication number: 20170123088
    Abstract: A seismic sensor comprises a central mass having three principal axes and disposed within a frame. A plurality of transducers is mechanically coupled between the frame and the central mass. The transducers are arranged in pairs, with the transducers in each pair being coupled to opposing sides of the central mass, as defined along each of the three principal axes. Electronics can be provided to combine signals of the transducers in each pair to generate output characterizing acceleration and rotation of the frame.
    Type: Application
    Filed: October 31, 2016
    Publication date: May 4, 2017
    Inventor: Kees Faber
  • Publication number: 20170123091
    Abstract: A seismic sensor system includes a seismic sensor suspended in an acoustic medium, which is disposed between first and second sensor housings. The acoustic medium can be selected to preferentially transmit pressure wave energy, based on the acoustic impedance of the surrounding water column or other seismic medium. The acoustic medium can also be selected to preferentially dissipate or otherwise reduce the transmitted shear wave energy. The second housing can similarly be configured to dissipate shear wave energy, while transmitting pressure wave energy in the form of acoustic waves that propagate through the acoustic medium to the seismic sensor.
    Type: Application
    Filed: October 31, 2016
    Publication date: May 4, 2017
    Inventors: Peter Graham Stewart, Kees Faber
  • Patent number: 9448313
    Abstract: Microseismic mapping using buried arrays with the integration of passive and active seismic surveys provides enhanced microseismic mapping results. The system is initially set up by recording seismic data with the buried array installation while shooting a significant portion of the 3D surface seismic survey. The 3D surface seismic survey provides the following data: shallow 3D VSP data from the buried arrays; P-wave and converted wave data for the area covered by the buried array that benefits from the planned data integration processing effort; and microseismic data and associated analysis.
    Type: Grant
    Filed: February 5, 2013
    Date of Patent: September 20, 2016
    Assignee: ION Geophysical Corporation
    Inventors: Gregg S. Hofland, Jacques P. Leveille, Daniel S. Kahn, Kees Faber, Rick Laroo, Jerry L. Lawson, William A. Balla, Michael J. Saur
  • Publication number: 20130265851
    Abstract: Microseismic mapping using buried arrays with the integration of passive and active seismic surveys provides enhanced microseismic mapping results. The system is initially set up by recording seismic data with the buried array installation while shooting a significant portion of the 3D surface seismic survey. The 3D surface seismic survey provides the following data: shallow 3D VSP data from the buried arrays; P-wave and converted wave data for the area covered by the buried array that benefits from the planned data integration processing effort; and microseismic data and associated analysis.
    Type: Application
    Filed: March 12, 2013
    Publication date: October 10, 2013
    Inventors: Kees Faber, Rick Laroo
  • Publication number: 20130215716
    Abstract: Microseismic mapping using buried arrays with the integration of passive and active seismic surveys provides enhanced microseismic mapping results. The system is initially set up by recording seismic data with the buried array installation while shooting a significant portion of the 3D surface seismic survey. The 3D surface seismic survey provides the following data: shallow 3D VSP data from the buried arrays; P-wave and converted wave data for the area covered by the buried array that benefits from the planned data integration processing effort; and microseismic data and associated analysis.
    Type: Application
    Filed: February 5, 2013
    Publication date: August 22, 2013
    Inventors: Gregg S. Hofland, Jacques P. Leveille, Daniel S. Kahn, Kees Faber, Rick Laroo, Jerry L. Lawson, William A. Balla, Michael J. Saur
  • Publication number: 20130215717
    Abstract: Microseismic mapping using buried arrays with the integration of passive and active seismic surveys provides enhanced microseismic mapping results. The system is initially set up by recording seismic data with the buried array installation while shooting a significant portion of the 3D surface seismic survey. The 3D surface seismic survey provides the following data: shallow 3D VSP data from the buried arrays; P-wave and converted wave data for the area covered by the buried array that benefits from the planned data integration processing effort; and microseismic data and associated analysis.
    Type: Application
    Filed: February 5, 2013
    Publication date: August 22, 2013
    Inventors: Gregg S. Hofland, Jacques P. Leveille, Daniel S. Kahn, Kees Faber, Rick Laroo, Jerry L. Lawson, William A. Balla, Michael J. Saur
  • Patent number: 7152473
    Abstract: A sensor apparatus (104) includes a plural different spatial direction axis of sensitivity positioned sensor package containing sensor module (305) supported by a planar surface (345) within a cavity (340) of a housing (205) coupled to a first end cap (210) by a PC-board connection (355). Housing (205) is further coupled to first end cap (210) by a first coupling member (315) and a second coupling member (320) and is also coupled to an opposite second end cap (215) by a third coupling member (320) and a fourth coupling member (325). Interface sealing members (330a, 330b, 330c, 330d) seal between housing (205) and first end cap (210). Interface sealing members (335a, 335b, 335c, 335d) seal between housing (205) and second end cap (215).
    Type: Grant
    Filed: March 17, 2000
    Date of Patent: December 26, 2006
    Assignee: Input/Output, Inc.
    Inventors: Larry Rushefsky, Axel Sigmar, Howard D. Goldberg, W. Marc Stalnaker, Ray Rinne, Demetrios Balderes, Guido Lemke, Matthew Ip, Lawrence P. Behn, Klaus Domagalski, Lianzhong Yu, Arjun Selvakumar, Duli Yu, James L. Marsh, Peter Maxwell, David Morgan, Thomas Buie, Kees Faber, Sjoerd Altman, Richard Laroo