Patents by Inventor Keh-Chang Cheng

Keh-Chang Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10128620
    Abstract: A conductive module of a high speed vertical connector includes an insulating core and a plurality of conductive terminals fixed on the insulating core. Each conductive terminal includes an embedded segment embedded in the insulating core, a fixing segment and a curved segment respectively extending from two opposite ends of the embedded segment, and a contacting segment extending from the curved segment. The embedded segment has a width within a range of 0.28˜0.42 mm. The fixing segment has a width within a range of 0.25˜0.28 mm. The curved segment has a width within a range of 0.35˜0.42 mm. The contacting segment has a width within a range of 0.25˜0.28 mm. The conductive terminals include a plurality pairs of differential signal terminals and a plurality of grounding terminals each arranged between two adjacent pairs of the differential signal terminals. Any two grounding terminals are not connected to any conductive bar.
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: November 13, 2018
    Assignee: GREENCONN CORP.
    Inventors: Kun-Shen Wu, Keh-Chang Cheng
  • Patent number: 9979136
    Abstract: A transmission module of a high speed connector includes an insulating core, two shielding members, two first differential signal terminals, two first grounding terminals, two second differential signal terminals, and two second grounding terminals, the latter four of which are fixed on the insulating core. The two shielding members respectively include a first metallic coating layer connected to the two first grounding terminals and a second metallic coating layer connected to the two second grounding terminals. The first metallic coating layer and the second metallic coating layer are respectively arranged at an upper side and a lower side of the first and second differential signal terminals, so that the first and second metallic coating layers can shield the first and second differential signal terminals in a height direction.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: May 22, 2018
    Assignee: GREENCONN CORPORATION
    Inventors: Kun-Shen Wu, Keh-Chang Cheng
  • Patent number: 9893446
    Abstract: A high speed connector includes a housing, an insulating core inserted into the housing, a plurality of first conductive terminals and a plurality of second conductive terminals fixed on the insulating core, and a shielding member. The first conductive terminals arranged in one row parallel to a width direction includes two differential signal terminals and two grounding terminals respectively arranged at two opposite outer sides of the differential signal terminals. The shielding member includes a base portion detachably assembled to the housing and a metallic coating layer coated on the base portion. The metallic coating layer contacts the two grounding terminals to establish an electrical connection between the two grounding terminals. The metallic coating layer is arranged at the two opposite outer sides of the differential signal terminals, and the metallic coating layer is configured to shield the differential signal terminals in the width direction.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: February 13, 2018
    Assignee: GREENCONN CORP.
    Inventors: Kun-Shen Wu, Keh-Chang Cheng
  • Patent number: 9577370
    Abstract: A high-speed electrical connector includes an insulating case, several signal terminals, several grounding terminals, an electrical bridge, and several resilient conductive buffers mounted in the insulating case. Each of the signal and grounding terminals has a fixing segment and a swing segment swingable with respect to the fixing segment. The electrical bridge corresponds to two of the grounding terminals. The conductive buffers are disposed on the electrical bridge and are respectively arranged in the swing paths of the swing segments. Each conductive buffer is configured to transform from an initial state to a deformation state by pressing. Each swing segment can swing to press the corresponding conductive buffer, causing the corresponding conductive buffer to be in the deformation state, thereby establishing an electrical connection path between the electrical bridge and the corresponding grounding terminals. In one example, the buffer can be formed of elastomer mixed with conductive particles.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: February 21, 2017
    Assignee: GREENCONN CORP.
    Inventors: Han-Nien Lin, Tung-Chi Hsieh, Keh-Chang Cheng
  • Publication number: 20160344134
    Abstract: A high-speed electrical connector includes an insulating case, several signal terminals, several grounding terminals, at least one electrical bridge, and several resilient conductive buffers, which are mounted in the insulating case. Each one of the signal and grounding terminals has a fixing segment and a swing segment swingable with respect to the fixing segment. The electrical bridge corresponds to at least two of the grounding terminals. The conductive buffers are disposed on the electrical bridge and are respectively arranged in the swing paths of the swing segments of the grounding terminals. Each conductive buffer is configured to transform from an initial state to a deformation state by pressing. Each swing segment can swing to press the corresponding conductive buffer, causing the corresponding conductive buffer to be in the deformation state, thereby establishing an electrical connection path between the electrical bridge and the corresponding grounding terminals.
    Type: Application
    Filed: October 16, 2015
    Publication date: November 24, 2016
    Inventors: HAN-NIEN LIN, TUNG-CHI HSIEH, KEH-CHANG CHENG
  • Patent number: 8393918
    Abstract: Improved miniaturized interconnect connector apparatus and methods for their manufacture. These miniaturized interconnect connectors minimize overall size, while at the same time offering acceptable and even improved electrical performance over prior art interconnect connector designs. In one exemplary embodiment, the interconnect connector comprises a plug and corresponding receptacle manufactured from a laser direct structuring (LDS) polymer material. In another embodiment, the interconnect connector comprises a composite structure which takes advantages of the properties of multiple selected materials. In yet another embodiment of the invention, precisely plated polymers such as the aforementioned LDS polymer are utilized in conjunction with known technologies such as flexible printed circuits (FPC) to produce miniaturized interconnect connectors.
    Type: Grant
    Filed: June 10, 2009
    Date of Patent: March 12, 2013
    Assignee: Pulse Electronics, Inc.
    Inventors: Keh-Chang Cheng, Pen-Yuan Tsai, Cheng-Jung Tsou
  • Publication number: 20110014800
    Abstract: Improved miniaturized interconnect connector apparatus and methods for their manufacture. These miniaturized interconnect connectors minimize overall size, while at the same time offering acceptable and even improved electrical performance over prior art interconnect connector designs. In one exemplary embodiment, the interconnect connector comprises a plug and corresponding receptacle manufactured from a laser direct structuring (LDS) polymer material. In another embodiment, the interconnect connector comprises a composite structure which takes advantages of the properties of multiple selected materials. In yet another embodiment of the invention, precisely plated polymers such as the aforementioned LDS polymer are utilized in conjunction with known technologies such as flexible printed circuits (FPC) to produce miniaturized interconnect connectors.
    Type: Application
    Filed: June 10, 2009
    Publication date: January 20, 2011
    Inventors: Keh-Chang Cheng, Pen-Yuan Tsai, Cheng-Jung Tsou
  • Patent number: 7466289
    Abstract: An integrated module of antenna and connector has an insulative housing receiving a plurality of conductive terminals therein, a metal shell shielding the insulative housing, and a coupling device assembled on the metal shell. The metal shell is grounded and defines a slot with a particular shape. A feed-in terminal is provided on a side of the slot and includes a soldering portion and a contact portion. The soldering portion of the feed-in terminal connects with a circuit board. The coupling device contacts the contact portion of the feed-in terminal, feeding in high-frequency voltage which forms voltage difference relative to a plane of the slot. A resonant electromagnetic field is produced in the slot for working as an antenna for electromagnetic wave radiation. Thus, functions of an antenna and a connector are combined, reducing the occupied space and decreasing the cost.
    Type: Grant
    Filed: April 10, 2007
    Date of Patent: December 16, 2008
    Assignee: P-Two Industries Inc.
    Inventors: Han-Ni Lin, Keh-Chang Cheng
  • Patent number: 7466275
    Abstract: An antenna module of mobile phone has an antenna, a feed-in terminal and a grounding terminal. The antenna includes an antenna body for receiving and radiating electromagnetic waves, a feed-in portion and a grounding portion. The feed-in portion forms a first bump array with adhesive on a surface thereon. The grounding portion forms a second bump array with adhesive on a surface thereon. The first bump array and adhesive of the feed-in portion connect with the feed-in terminal, and the second bump array and adhesive of the grounding portion connect with the grounding terminal. The first bump array and the second bump array respectively pierce oxidation coatings on surfaces of the feed-in terminal and the grounding terminal, producing contact positive pressure, electrically connecting the feed-in portion and the grounding portion with the feed-in terminal and the grounding terminal.
    Type: Grant
    Filed: April 10, 2007
    Date of Patent: December 16, 2008
    Assignee: P-Two Industries Inc.
    Inventor: Keh-Chang Cheng
  • Publication number: 20080230252
    Abstract: A printed micro coaxial cable has a first metal shield layer, a first insulative layer formed on the first metal shield layer, and a conductive layer printed on the first insulative layer. The conductive layer includes a plurality of conductive transmitters spaced from each other. Two conductive transmitters are defined as a transmission pair. A second insulative layer is formed on the conductive layer. A second metal shield layer is formed on the second insulative layer. The printed micro coaxial cable of the present invention is manufactured by means of printing, simplifying manufacture process and reducing cost.
    Type: Application
    Filed: June 15, 2007
    Publication date: September 25, 2008
    Inventor: Keh-Chang Cheng
  • Publication number: 20080158079
    Abstract: An integrated module of antenna and connector has an insulative housing receiving a plurality of conductive terminals therein, a metal shell shielding the insulative housing, and a coupling device assembled on the metal shell. The metal shell is grounded and defines a slot with a particular shape. A feed-in terminal is provided on a side of the slot and includes a soldering portion and a contact portion. The soldering portion of the feed-in terminal connects with a circuit board. The coupling device contacts the contact portion of the feed-in terminal, feeding in high-frequency voltage which forms voltage difference relative to a plane of the slot. A resonant electromagnetic field is produced in the slot for working as an antenna for electromagnetic wave radiation. Thus, functions of an antenna and a connector are combined, reducing the occupied space and decreasing the cost.
    Type: Application
    Filed: April 10, 2007
    Publication date: July 3, 2008
    Inventors: Han-Ni Lin, Keh-Chang Cheng
  • Publication number: 20080081658
    Abstract: An antenna module of mobile phone has an antenna, a feed-in terminal and a grounding terminal. The antenna includes an antenna body for receiving and radiating electromagnetic waves, a feed-in portion and a grounding portion. The feed-in portion forms a first bump array with adhesive on a surface thereon. The grounding portion forms a second bump array with adhesive on a surface thereon. The first bump array and adhesive of the feed-in portion connect with the feed-in terminal, and the second bump array and adhesive of the grounding portion connect with the grounding terminal. The first bump array and the second bump array respectively pierce oxidation coatings on surfaces of the feed-in terminal and the grounding terminal, producing contact positive pressure, electrically connecting the feed-in portion and the grounding portion with the feed-in terminal and the grounding terminal.
    Type: Application
    Filed: April 10, 2007
    Publication date: April 3, 2008
    Inventor: Keh-Chang Cheng