Abstract: Provided is a forming system that expands and deforms a metal material to perform forming, the forming system including: a forming device that performs the forming; and at least one transport device that transports the metal material, in which the transport device transports the metal material to the forming device in a held state, in a case where a pretreatment device that performs pretreatment for the forming is present, the transport device transports the metal material to the pretreatment device in a held state, and during a period from a transport process in which the metal material is transported to any of devices by the transport device to a treatment process performed by any of the devices, at least one of the transport device and any of the devices continues holding the metal material.

Abstract: One aspect of the present disclosure is a manufacturing method for a support piece used in the formation of a dolmen structure in a semiconductor device, including processes of: (A) preparing a laminate film including a base material film, an adhesive layer, and a support piece formation film, for example, including a thermosetting resin layer, in this order; and (B) forming support pieces on a surface of the adhesive layer by singulating the support piece formation film, in which the process (B) includes a process of forming a cut in the support piece formation film partway in a thickness direction, and a process of singulating the support piece formation film in a cooled state by expansion, in this order.

Abstract: Disclosed is a film-shaped adhesive. An embodiment of the film-shaped adhesive contains metal particles and has a shear viscosity at 110° C. of 30000 Pa·s or less. Another embodiment of the film-shaped adhesive contains metal particles and has a loss modulus at 110° C. of 200 kPa or less. Another embodiment of the film-shaped adhesive contains metal particles, a thermosetting resin, a curing agent, and an elastomer, in which a content of the metal particles based on the total amount of the metal particles, thermosetting resin, curing agent, and elastomer is 70.0% by mass or more, and a total content of the thermosetting resin and the curing agent is 13.0% by mass or more.

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor chip; a support member having the semiconductor chip mounted thereon; and a bonding adhesive member provided between the semiconductor chip and the support member and adhering the semiconductor chip and the support member. The bonding adhesive member includes a sintered body of silver particles.

Abstract: A semiconductor device includes: a substrate; an adhesive member arranged on a surface of the substrate; a first chip stacked on the adhesive member with a first adhesive piece interposed therebetween; and a second chip stacked on the first chip with a second adhesive piece interposed therebetween. The adhesive member has a multilayer structure including a pair of surface layers formed of a cured product of a thermosetting resin composition and an intermediate layer arranged between the pair of surface layers.

Abstract: A collet for compressing an adhesive-attached chip, the collet including a main body having a first pressing surface to which a pressing force from a compressing device is directly transmitted, and a projecting portion projecting from the main body and having a second pressing surface provided along an outer circumference of the first pressing surface, the first pressing surface and the second pressing surface forming a holding surface for holding the adhesive-attached chip.

Abstract: One aspect of the present disclosure is a manufacturing method for a support piece used in the formation of a dolmen structure in a semiconductor device, including processes of: (A) preparing a laminate film including a base material film, an adhesive layer, and a support piece formation film, for example, including a thermosetting resin layer, in this order; and (B) forming support pieces on a surface of the adhesive layer by singulating the support piece formation film, in which the process (B) includes a process of forming a cut in the support piece formation film partway in a thickness direction, and a process of singulating the support piece formation film in a cooled state by expansion, in this order.

Abstract: A support piece formation laminate film according to the present disclosure includes a base material film, a pressure-sensitive adhesive layer, and a support piece formation film, in this order, in which the support piece formation film has a multi-layer structure including at least a metal layer. The support piece formation laminate film is applied to a manufacturing process of a semiconductor device having a dolmen structure including a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed around the first chip, on the substrate, and a second chip disposed to be supported by the plurality of support pieces and to cover the first chip.