Abstract: A three-dimensional memory device includes vertical layer stacks that are laterally spaced apart by backside trenches that laterally extend along a first horizontal direction, where each of the vertical layer stacks includes a respective alternating stack of insulating layers and electrically conductive layers, memory openings vertically extending through the alternating stacks, memory opening fill structures located in the memory openings and including a respective vertical stack of memory elements and a respective vertical semiconductor channel, and backside trench fill structures located within a respective one of the backside trenches. Each of the backside trench fill structures includes a plurality of dielectric bridge structures laterally spaced apart along the first horizontal direction and dielectric fin portions located at levels of a plurality of the electrically conductive layers.

Abstract: A multi-tier three-dimensional memory array includes multiple alternating stacks of insulating layers and electrically conductive layers that are vertically stacked. Memory stack structures including memory films and semiconductor channels extend through the alternating stacks. The alternating stacks are formed as alternating stacks of insulating layers and sacrificial material layers, and are subsequently modified by replacing the sacrificial material layers with electrically conductive layers. Structural support during replacement of the sacrificial material layers with the electrically conductive layers is provided by the memory stack structures and dielectric support pillar structures. The dielectric support pillar structures may be formed only for a first-tier structure including a first-tier alternating stack of first insulating layers and first spacer material layers, or may vertically extend over multiple tiers.

Abstract: A multi-tier three-dimensional memory array includes multiple alternating stacks of insulating layers and electrically conductive layers that are vertically stacked. Memory stack structures including memory films and semiconductor channels extend through the alternating stacks. The alternating stacks are formed as alternating stacks of insulating layers and sacrificial material layers, and are subsequently modified by replacing the sacrificial material layers with electrically conductive layers. Structural support during replacement of the sacrificial material layers with the electrically conductive layers is provided by the memory stack structures and dielectric support pillar structures. The dielectric support pillar structures may be formed only for a first-tier structure including a first-tier alternating stack of first insulating layers and first spacer material layers, or may vertically extend over multiple tiers.

Abstract: An alternating layer stack of insulating layers and sacrificial material layers is formed over a semiconductor substrate, and memory stack structures are formed through the vertically-alternating layer stack. A pair of unconnected barrier trenches or a moat trench is formed through the alternating stack concurrently with formation of backside trenches. Backside recesses are formed by isotropically etching the sacrificial material layers selective to the insulating layers while a dielectric liner covers the barrier trenches or the moat trench. A vertically alternating sequence of the insulating plates and the dielectric spacer plates is provided between the pair of barrier trenches or inside the moat trench. Electrically conductive layers are formed in the backside recesses. A first conductive via structure is formed through the vertically alternating sequence concurrently with formation of a second conductive via structure through a dielectric material portion adjacent to the alternating stack.

Abstract: An alternating layer stack of insulating layers and sacrificial material layers is formed over a semiconductor substrate, and memory stack structures are formed through the vertically-alternating layer stack. A pair of unconnected barrier trenches or a moat trench is formed through the alternating stack concurrently with formation of backside trenches. Backside recesses are formed by isotropically etching the sacrificial material layers selective to the insulating layers while a dielectric liner covers the barrier trenches or the moat trench. A vertically alternating sequence of the insulating plates and the dielectric spacer plates is provided between the pair of barrier trenches or inside the moat trench. Electrically conductive layers are formed in the backside recesses. A first conductive via structure is formed through the vertically alternating sequence concurrently with formation of a second conductive via structure through a dielectric material portion adjacent to the alternating stack.

Abstract: An alternating layer stack of insulating layers and sacrificial material layers is formed over a semiconductor substrate, and memory stack structures are formed through the vertically-alternating layer stack. A pair of unconnected barrier trenches or a moat trench is formed through the alternating stack concurrently with formation of backside trenches. Backside recesses are formed by isotropically etching the sacrificial material layers selective to the insulating layers while a dielectric liner covers the barrier trenches or the moat trench. A vertically alternating sequence of the insulating plates and the dielectric spacer plates is provided between the pair of barrier trenches or inside the moat trench. Electrically conductive layers are formed in the backside recesses. A first conductive via structure is formed through the vertically alternating sequence concurrently with formation of a second conductive via structure through a dielectric material portion adjacent to the alternating stack.

Abstract: An alternating layer stack of insulating layers and sacrificial material layers is formed over a semiconductor substrate, and memory stack structures are formed through the vertically-alternating layer stack. A pair of unconnected barrier trenches or a moat trench is formed through the alternating stack concurrently with formation of backside trenches. Backside recesses are formed by isotropically etching the sacrificial material layers selective to the insulating layers while a dielectric liner covers the barrier trenches or the moat trench. A vertically alternating sequence of the insulating plates and the dielectric spacer plates is provided between the pair of barrier trenches or inside the moat trench. Electrically conductive layers are formed in the backside recesses. A first conductive via structure is formed through the vertically alternating sequence concurrently with formation of a second conductive via structure through a dielectric material portion adjacent to the alternating stack.

Abstract: A multi-tier three-dimensional memory array includes multiple alternating stacks of insulating layers and electrically conductive layers that are vertically stacked. Memory stack structures including memory films and semiconductor channels extend through the alternating stacks. The alternating stacks are formed as alternating stacks of insulating layers and sacrificial material layers, and are subsequently modified by replacing the sacrificial material layers with electrically conductive layers. Structural support during replacement of the sacrificial material layers with the electrically conductive layers is provided by the memory stack structures and dielectric support pillar structures. The dielectric support pillar structures may be formed only for a first-tier structure including a first-tier alternating stack of first insulating layers and first spacer material layers, or may vertically extend over multiple tiers.

Abstract: A multi-tier three-dimensional memory array includes multiple alternating stacks of insulating layers and electrically conductive layers that are vertically stacked. Memory stack structures including memory films and semiconductor channels extend through the alternating stacks. The alternating stacks are formed as alternating stacks of insulating layers and sacrificial material layers, and are subsequently modified by replacing the sacrificial material layers with electrically conductive layers. Structural support during replacement of the sacrificial material layers with the electrically conductive layers is provided by the memory stack structures and dielectric support pillar structures. The dielectric support pillar structures may be formed only for a first-tier structure including a first-tier alternating stack of first insulating layers and first spacer material layers, or may vertically extend over multiple tiers.

Abstract: A stack is formed over a substrate, which comprises an alternating plurality of first material layers including a first material and second material layers including a second material. A patterned hard mask is formed, which includes multiple laterally spaced apart strips. A trimming material layer is formed over the hard mask layer. At least one cycle of process steps is subsequent performed, which include etching the first material employing the second material and the trimming material layer as an etch mask, trimming the trimming material layer to expose a strip of the hard mask layer, etching the second material and the exposed strip of the hard mask layer employing the trimming material layer as an etch mask, and trimming the trimming material layer to expose an edge of a next strip of the hard mask layer. Stepped surfaces suitable for formation of contact via array can thus be formed.

Abstract: A stack is formed over a substrate, which comprises an alternating plurality of first material layers including a first material and second material layers including a second material. A patterned hard mask is formed, which includes multiple laterally spaced apart strips. A trimming material layer is formed over the hard mask layer. At least one cycle of process steps is subsequent performed, which include etching the first material employing the second material and the trimming material layer as an etch mask, trimming the trimming material layer to expose a strip of the hard mask layer, etching the second material and the exposed strip of the hard mask layer employing the trimming material layer as an etch mask, and trimming the trimming material layer to expose an edge of a next strip of the hard mask layer. Stepped surfaces suitable for formation of contact via array can thus be formed.