Patents by Inventor Kei TADACHI

Kei TADACHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11681212
    Abstract: An optical element according to the present disclosure includes a main body part including an optical part having an optical surface, and a support part which is provided to the optical part, and which is to be supported by a support body, and a functional layer which is provided as a film to the main body part, wherein the functional layer is disposed so as to cover the optical surface of the optical part, and so as not to cover at least a part of the support part.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: June 20, 2023
    Assignee: Seiko Epson Corportation
    Inventor: Kei Tadachi
  • Publication number: 20210373425
    Abstract: An optical element according to the present disclosure includes a main body part including an optical part having an optical surface, and a support part which is provided to the optical part, and which is to be supported by a support body, and a functional layer which is provided as a film to the main body part, wherein the functional layer is disposed so as to cover the optical surface of the optical part, and so as not to cover at least a part of the support part.
    Type: Application
    Filed: May 27, 2021
    Publication date: December 2, 2021
    Inventor: Kei TADACHI
  • Patent number: 10725367
    Abstract: A wavelength conversion element according to the invention includes a wavelength conversion layer having a plurality of air holes, and excited by light in a first wavelength band to thereby generate light in a second wavelength band different from the first wavelength band, a transparent member adapted to seal a recessed section occurring on a first surface of the wavelength conversion layer due to the air hole, a reflecting layer disposed so as to be opposed to the first surface of the wavelength conversion layer, and a base member disposed so as to be opposed to the reflecting layer, and the transparent member is disposed in some of the plurality of air holes.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: July 28, 2020
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Tomohiro Yokoo, Kei Tadachi
  • Patent number: 10525719
    Abstract: A valve unit includes a flow path member having an opening surface that has a flow path opening of a liquid flow path, a valve having a sealing surface configured to seal the flow path opening, and a sealing member disposed on one of a peripheral portion of the flow path opening in the opening surface and a portion of the sealing surface facing the peripheral portion. The sealing surface is configured to be moved forward and backward relative to the opening surface to open and close the flow path opening. The sealing member is configured to be in contact with the peripheral portion of the flow path opening and the sealing surface when the valve is closed. The sealing member includes a fluorinated polyether.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: January 7, 2020
    Assignee: Seiko Epson Corporation
    Inventors: Kei Tadachi, Satoshi Nagatoya, Hiroyuki Tsuchiya
  • Publication number: 20190294033
    Abstract: A wavelength conversion element according to the invention includes a wavelength conversion layer having a plurality of air holes, and excited by light in a first wavelength band to thereby generate light in a second wavelength band different from the first wavelength band, a transparent member adapted to seal a recessed section occurring on a first surface of the wavelength conversion layer due to the air hole, a reflecting layer disposed so as to be opposed to the first surface of the wavelength conversion layer, and a base member disposed so as to be opposed to the reflecting layer, and the transparent member is disposed in some of the plurality of air holes.
    Type: Application
    Filed: March 19, 2019
    Publication date: September 26, 2019
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Tomohiro YOKOO, Kei TADACHI
  • Patent number: 10377135
    Abstract: An electronic device includes a joined-structure assembly in which a plurality of structures are joined together. At least one of the plurality of structures includes a movable region, a part of an adhesive agent applied between the structures faces a space communicating with the movable region, and the adhesive agent includes an organo-siloxane compound with three or more reaction points.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: August 13, 2019
    Assignee: Seiko Epson Corporation
    Inventors: Yasuhide Matsuo, Kenji Otsuka, Hiroyuki Tsuchiya, Kei Tadachi, Wataru Takahashi
  • Patent number: 10189259
    Abstract: A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: January 29, 2019
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Hiroyuki Tsuchiya, Yasuhide Matsuo, Kenji Otsuka, Minehiro Imamura, Tomohiro Hayashi, Kei Tadachi
  • Publication number: 20190001681
    Abstract: An electronic device includes a joined-structure assembly in which a plurality of structures are joined together. At least one of the plurality of structures includes a movable region, a part of an adhesive agent applied between the structures faces a space communicating with the movable region, and the adhesive agent includes an organo-siloxane compound with three or more reaction points.
    Type: Application
    Filed: July 1, 2016
    Publication date: January 3, 2019
    Inventors: Yasuhide Matsuo, Kenji Otsuka, Hiroyuki Tsuchiya, Kei Tadachi, Wataru Takahashi
  • Publication number: 20180272736
    Abstract: A valve unit includes a flow path member having an opening surface that has a flow path opening of a liquid flow path, a valve having a sealing surface configured to seal the flow path opening, and a sealing member disposed on one of a peripheral portion of the flow path opening in the opening surface and a portion of the sealing surface facing the peripheral portion. The sealing surface is configured to be moved forward and backward relative to the opening surface to open and close the flow path opening. The sealing member is configured to be in contact with the peripheral portion of the flow path opening and the sealing surface when the valve is closed. The sealing member includes a fluorinated polyether.
    Type: Application
    Filed: March 15, 2018
    Publication date: September 27, 2018
    Inventors: Kei TADACHI, Satoshi NAGATOYA, Hiroyuki TSUCHIYA
  • Publication number: 20170334207
    Abstract: A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.
    Type: Application
    Filed: August 7, 2017
    Publication date: November 23, 2017
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Hiroyuki TSUCHIYA, Yasuhide MATSUO, Kenji OTSUKA, Minehiro IMAMURA, Tomohiro HAYASHI, Kei TADACHI
  • Patent number: 9789691
    Abstract: A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: October 17, 2017
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Hiroyuki Tsuchiya, Yasuhide Matsuo, Kenji Otsuka, Minehiro Imamura, Tomohiro Hayashi, Kei Tadachi
  • Patent number: 9302481
    Abstract: A silicon nozzle plate has excellent liquid resistance on an inner surface of a nozzle opening and a discharge surface. A plurality of the nozzle openings are disposed in a silicon substrate of the nozzle plate. A tantalum oxide film formed by atomic layer deposition is disposed on both surfaces of the silicon substrate and the inner surface of the nozzle opening.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: April 5, 2016
    Assignee: Seiko Epson Corporation
    Inventors: Kei Tadachi, Katsuhiro Takahashi
  • Publication number: 20150239223
    Abstract: A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.
    Type: Application
    Filed: February 26, 2015
    Publication date: August 27, 2015
    Inventors: Hiroyuki TSUCHIYA, Yasuhide MATSUO, Kenji OTSUKA, Minehiro IMAMURA, Tomohiro HAYASHI, Kei TADACHI
  • Publication number: 20140184698
    Abstract: A silicon nozzle plate has excellent liquid resistance on an inner surface of a nozzle opening and a discharge surface. A plurality of the nozzle openings are disposed in a silicon substrate of the nozzle plate. A tantalum oxide film formed by atomic layer deposition is disposed on both surfaces of the silicon substrate and the inner surface of the nozzle opening.
    Type: Application
    Filed: December 26, 2013
    Publication date: July 3, 2014
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Kei TADACHI, Katsuhiro TAKAHASHI