Patents by Inventor Kei Takatsu

Kei Takatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6805973
    Abstract: A method for producing an aluminum nitride/aluminum base composite material comprising the steps of; (A) charging aluminum nitride powder into a container provided in a molten metal pressure apparatus, (B) applying pressure to the aluminum nitride powder in the container, (C) pouring a molten aluminum base material into the container, and, (D) applying pressure to the molten aluminum base material in the container to fill the aluminum base material in space between the aluminum nitride powder particles.
    Type: Grant
    Filed: September 3, 2003
    Date of Patent: October 19, 2004
    Assignee: Sony Corporation
    Inventors: Shingo Kadomura, Kei Takatsu, Shinsuke Hirano, Nobuyuki Suzuki
  • Publication number: 20040040687
    Abstract: A method for producing an aluminum nitride/aluminum base composite material comprising the steps of; (A) charging aluminum nitride powder into a container provided in a molten metal pressure apparatus, (B) applying pressure to the aluminum nitride powder in the container, (C) pouring a molten aluminum base material into the container, and, (D) applying pressure to the molten aluminum base material in the container to fill the aluminum base material in space between the aluminum nitride powder particles.
    Type: Application
    Filed: September 3, 2003
    Publication date: March 4, 2004
    Inventors: Shingo Kadomura, Kei Takatsu, Shinsuke Hirano, Nobuyuki Suzuki
  • Patent number: 6668905
    Abstract: A method for producing an aluminum nitride/aluminum base composite material comprising the steps of; (A) charging aluminum nitride powder into a container provided in a molten metal pressure apparatus, (B) applying pressure to the aluminum nitride powder in the container, (C) pouring a molten aluminum base material into the container, and, (D) applying pressure to the molten aluminum base material in the container to fill the aluminum base material in space between the aluminum nitride powder particles.
    Type: Grant
    Filed: November 6, 1998
    Date of Patent: December 30, 2003
    Assignee: Sony Corporation
    Inventors: Shingo Kadomura, Kei Takatsu, Shinsuke Hirano, Nobuyuki Suzuki
  • Publication number: 20020081445
    Abstract: The invention provides a substrate processing apparatus using a composite material which permits avoidance of occurrence of damages caused by the difference in thermal expansion between different materials and can be with stand the use at high temperatures. The substrate processing apparatus for processing a substrate is partially (for example, a substrate mounting stage) composed of a composite material 11 consisting of a matrix 12 comprising a ceramics member made of, for example, cordierite ceramics, aluminum nitride and/or a texture filled with an aluminum-based material (for example, aluminum or aluminum and silicon), and a ceramics layer (comprising, for example, Al2O3 and/or AlN) provided on the surface of the matrix 12.
    Type: Application
    Filed: September 7, 2001
    Publication date: June 27, 2002
    Inventors: Shingo Kadomura, Kei Takatsu, Shinsuke Hirano
  • Patent number: 6391437
    Abstract: The invention provides a substrate processing apparatus using a composite material which permits avoidance of occurrence of damages caused by the difference in thermal expansion between different materials and can be with stand the use at high temperatures. The substrate processing apparatus for processing a substrate is partially (for example, a substrate mounting stage) composed of a composite material 11 consisting of a matrix 12 comprising a ceramics member made of, for example, cordierite ceramics, aluminum nitride and/or a texture filled with an aluminum-based material (for example, aluminum or aluminum and silicon), and a ceramics layer (comprising, for example, Al2O3 and/or AlN) provided on the surface of the matrix 12.
    Type: Grant
    Filed: January 29, 1998
    Date of Patent: May 21, 2002
    Assignee: Sony Corporation
    Inventors: Shingo Kadomura, Kei Takatsu, Shinsuke Hirano
  • Patent number: 6120661
    Abstract: A glass substrate processing apparatus, part of which comprises a composite material, the composite material being formed of a matrix and a ceramic layer formed on a surface of the matrix by a thermal spraying method, the matrix being formed of a ceramic member and an aluminum-containing material filled in a texture of the ceramic member.
    Type: Grant
    Filed: June 7, 1999
    Date of Patent: September 19, 2000
    Assignee: Sony Corporation
    Inventors: Shinsuke Hirano, Kei Takatsu, Shingo Kadomura
  • Patent number: 4407627
    Abstract: An automatic wafer orienting apparatus comprising a first orienting device for driving and rotating a wafer thereby orienting the wafer while utilizing a peripheral edge and an orientation cut thereof as the guide, a device for disengaging the thus oriented wafer from the first wafer orienting device, and a second wafer orienting device for re-orienting the wafer by pressing a lateral edge and an orientation cut thereof against orienting members provided on a wafer chuck.
    Type: Grant
    Filed: April 21, 1981
    Date of Patent: October 4, 1983
    Assignee: Canon Kabushiki Kaisha
    Inventors: Hiroshi Sato, Kei Takatsu, Junji Isohata