Abstract: The purpose of the present invention is to allow a clean airflow around a substrate to reliably move downward of the substrate in an examination device in which clean air is supplied to an inspection chamber. This examination device is provided with a rectifying plate (see FIG. 4A) which covers a part of the upper surface of a stage for mounting a substrate, and is disposed between a gas supply unit and the stage to block an airflow toward the substrate.

Abstract: The present invention provides a highly reliable multilayered glass panel and an encapsulating material for achieving the highly reliable multilayered glass panel. The encapsulating material includes lead-free low melting glass particles containing vanadium oxide and tellurium oxide, low thermal expansion filler particles, and glass beads as a solid content. A volume fraction of the glass beads in the solid content is not less than 10% to not more than 35%, and a volume fraction of the lead-free low melting glass particles in the solid content is larger than a volume fraction of the low thermal expansion filler in the solid content.

Abstract: The present invention provides a highly reliable multilayered glass panel and an encapsulating material for achieving the highly reliable multilayered glass panel. The encapsulating material includes lead-free low melting glass particles containing vanadium oxide and tellurium oxide, low thermal expansion filler particles, and glass beads as a solid content. A volume fraction of the glass beads in the solid content is not less than 10% to not more than 35%, and a volume fraction of the lead-free low melting glass particles in the solid content is larger than a volume fraction of the low thermal expansion filler in the solid content.

Abstract: It is an objective of the invention to provide a conductive joint article exhibiting electrical joinability comparable to that of solder joining of easy-to-solder joinable metals even when a joined member of the conductive joint article is made of a hard-to-solder joinable metal. There is provided a conductive joint article with conductive joined members electrically joined via a joining layer, at least one of the joined members being made of a hard-to-solder joinable metal. The joining layer comprises an oxide glass phase and a conductive metal phase. The oxide glass phase includes vanadium as a major constituent and at least one of phosphorus, barium and tungsten as an accessory constituent, and has a glass transition point of 390° C. or less. And, connection resistance between the joined members exhibits less than 1×10?5 ?/mm2.

Abstract: There is disclosed a heat-insulating member including a pair of substrates and an airtight sealing part, in which the airtight sealing part is formed in an outer peripheral part between the pair of substrates to form a space between the pair of substrates, the space being in a vacuum or reduced pressure state, a sealing material that forms the airtight sealing part includes a low-melting glass, and the low-melting glass contains a vanadium oxide, barium oxide, phosphorus oxide, and tungsten oxide, in which the following two relational expressions are satisfied in terms of oxide contents: V2O5+BaO+P2O5+WO3?90 and V2O5>BaO>P2O5>WO3 (wherein unit: mol %). Thereby, influence on environmental impact can be reduced and maintenance of airtightness and an improvement in acid resistance can be achieved.

Abstract: There is provided a bonding article comprising: an electrical insulating substrate; a first adhesion layer laminated on one surface of the electrical insulating substrate; and a second adhesion layer laminated on the other surface of the electrical insulating substrate. Both the first adhesion layer and the second adhesion layer include a low-melting-point lead-free glass containing vanadium oxide and tellurium oxide as chemical constituents and having a softening point of 360° C. or lower. And, when contours of the first adhesion layer, the electrical insulating substrate, and the second adhesion layer are projected parallel to one another along the lamination direction, the contour of the first adhesion layer is located inside the contour of the second adhesion layer.

Abstract: An object of the present invention is to provide a multi-layer glass with high degree of vacuum and high mass productivity. In order to achieve the object, the multi-layer glass according to the present invention includes a first glass substrate, a second glass substrate disposed facing the first glass substrate with a space therebetween, a sealing portion, which contains a glass composition and is disposed in a peripheral edge portion of the space between the first glass substrate and the second glass substrate, and column members disposed between the first glass substrate and the second glass substrate, wherein the column member is made of a metal or alloy, and a melting point of the metal or alloy is higher than a softening point of the glass composition and is lower than or equal to a temperature 20° C. higher than a flow point of the glass composition.

Abstract: An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing low melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.

Abstract: It is an objective of the invention to provide a conductive joint article exhibiting electrical joinability comparable to that of solder joining of easy-to-solder joinable metals even when a joined member of the conductive joint article is made of a hard-to-solder joinable metal. There is provided a conductive joint article with conductive joined members electrically joined via a joining layer, at least one of the joined members being made of a hard-to-solder joinable metal. The joining layer comprises an oxide glass phase and a conductive metal phase. The oxide glass phase includes vanadium as a major constituent and at least one of phosphorus, barium and tungsten as an accessory constituent, and has a glass transition point of 390° C. or less. And, connection resistance between the joined members exhibits less than 1×10?5 ?/mm2.

Abstract: An Ag2O—V2O5—TeO2 lead-free low-melting glass composition that is prevented or restrained from crystallization by heating so as to soften and flow more satisfactorily at a low temperature contains a principal component which includes a vanadium oxide, a tellurium oxide and a silver oxide; a secondary component which includes at least one selected from the group consisting of BaO, WO3 and P2O5; and an additional component which includes at least one selected from the group consisting of oxides of elements in Group 13 of periodic table. A total component of the principal component is 85 mole percent or more in terms of V2O5, TeO2 and Ag2O. Contents of TeO2 and Ag2O each is 1 to 2 times as much as a content of V2O5. A content of the secondary component is 0 to 13 mole percent. A content of the additional component is 0.1 to 3.0 mole percent.

Abstract: Provided are a vacuum heat insulating member which includes: a first substrate; a second substrate; and a sealing part disposed between the first substrate and the second substrate, in which an internal space is formed by surrounding by the first substrate, the second substrate and the sealing part, and in which the sealing part includes a glass phase and a metal phase, the metal phase being disposed on a side of the internal space of the glass phase. Thus, in the vacuum heat insulating member, an amount of a gas released from the glass phase to the internal space can be decreased and a high heat insulating property can be kept.

Abstract: An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing low melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.

Abstract: The conductive paste contains the following dispersed in a binder resin dissolved in a solvent: a plurality of particles comprising aluminum and/or an aluminum-containing alloy; and an oxide-comprising powder. The oxide contains vanadium with a valence no greater than 4 and a glass phase. In the method for manufacturing an electronic component, the conductive paste is applied to a substrate and fired, forming electrode wiring. The electronic component is provided with electrode wiring that has: a plurality of particles comprising aluminum and/or an aluminum-containing alloy; and an oxide affixing the particles to a substrate. The oxide contains vanadium with a valence no greater than 4. A compound layer containing vanadium and aluminum is formed on the surfaces of the particles, and the vanadium in the compound layer includes vanadium with a valence no greater than 4. This results in an electrode wiring with high reliability and water resistance.

Abstract: An Ag2O—V2O5—TeO2 lead-free low-melting glass composition that is prevented or restrained from crystallization by heating so as to soften and flow more satisfactorily at a low temperature contains a principal component which includes a vanadium oxide, a tellurium oxide and a silver oxide; a secondary component which includes at least one selected from the group consisting of BaO, WO3 and P2O5; and an additional component which includes at least one selected from the group consisting of oxides of elements in Group 13 of periodic table. A total component of the principal component is 85 mole percent or more in terms of V2O5, TeO2 and Ag2O. Contents of TeO2 and Ag2O each is 1 to 2 times as much as a content of V2O5. A content of the secondary component is 0 to 13 mole percent. A content of the additional component is 0.1 to 3.0 mole percent.

Abstract: An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing to melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.

Abstract: An object of the present invention is to provide a multi-layer glass with high degree of vacuum and high mass productivity. In order to achieve the object, the multi-layer glass according to the present invention includes a first glass substrate, a second glass substrate disposed facing the first glass substrate with a space therebetween, a sealing portion, which contains a glass composition and is disposed in a peripheral edge portion of the space between the first glass substrate and the second glass substrate, and column members disposed between the first glass substrate and the second glass substrate, wherein the column member is made of a metal or alloy, and a melting point of the metal or alloy is higher than a softening point of the glass composition and is lower than or equal to a temperature 20° C. higher than a flow point of the glass composition.

Abstract: An Ag2O—V2O5—TeO2 lead-free low-melting glass composition that is prevented or restrained from crystallization by heating so as to soften and flow more satisfactorily at a low temperature contains a principal component which includes a vanadium oxide, a tellurium oxide and a silver oxide; a secondary component which includes at least one selected from the group consisting of BaO, WO3 and P2O5; and an additional component which includes at least one selected from the group consisting of oxides of elements in Group 13 of periodic table. A total component of the principal component is 85 mole percent or more in terms of V2O5, TeO2 and Ag2O. Contents of TeO2 and Ag2O each is 1 to 2 times as much as a content of V2O5. A content of the secondary component is 0 to 13 mole percent. A content of the additional component is 0.1 to 3.0 mole percent.

Abstract: In an electronic component including two substrates at least one of which is transparent, an organic member arranged between these substrates, and a bonding portion located onto respective outer circumferential portions of the two substrates, this bonding portion includes a low-melting glass and filler particles. The low-melting glass includes vanadium oxide. The filler particles include a low thermally-expandable material, and an oxide containing a bivalent transition metal as a constituent element. The oxide is dispersed in the low thermally-expandable material, and the low thermally-expandable material has a thermal expansion coefficient of 5×10?7/° C. or less in a temperature range from 30 to 250° C. This invention makes it possible to heat the filler particles by irradiation with a laser to give the electronic component which is a component having a highly reliable bonding portion.

Abstract: Disclosed is an Ag2O—V2O5—TeO2 lead-free low-melting glass composition that is prevented or restrained from crystallization so as to soften and flow more satisfactorily at a low temperature. This lead-free low-melting glass composition contains a principal component; and an additional component. The principal component includes a vanadium oxide, a tellurium oxide and a silver oxide. The additional component includes at least one selected from the group consisting of yttrium oxide and lanthanoid oxides. A content of the additional component is 0.1 to 3.0 mole percent in terms of oxide. The additional component preferably contains at least one selected from Y2O3, La2O3, CeO2, Er2O3, and Yb2O3 in a content of 0.1 to 2.0 mole percent in terms of oxide. The additional component particularly effectively contains at least one of Y2O3 and La2O3 in a total content of 0.1 to 1.0 mole percent.

Abstract: There is disclosed a heat-insulating member including a pair of substrates and an airtight sealing part, in which the airtight sealing part is formed in an outer peripheral part between the pair of substrates to form a space between the pair of substrates, the space being in a vacuum or reduced pressure state, a sealing material that forms the airtight sealing part includes a low-melting glass, and the low-melting glass contains a vanadium oxide, barium oxide, phosphorus oxide, and tungsten oxide, in which the following two relational expressions are satisfied in terms of oxide contents: V2O5+BaO+P2O5+WO3?90 and V2O5>BaO>P2O5>WO3 (wherein unit: mol %). Thereby, influence on environmental impact can be reduced and maintenance of airtightness and an improvement in acid resistance can be achieved.