Patents by Inventor Keiichi Den

Keiichi Den has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220182702
    Abstract: Systems and methods are provided for controlling a set-top box via a smart speaker. One example method includes receiving, at the smart speaker, an input related to the set-top box. A request based on the input is transmitted to a server. At the server and based on the request, program listing data is retrieved. A command for controlling the set-top box is identified based on the program listing data. At least one of the program listing data and the identified command is transmitted from the server to the smart speaker. The identified command is transmitted from the smart speaker to the set-top box.
    Type: Application
    Filed: October 4, 2021
    Publication date: June 9, 2022
    Inventor: Keiichi Den
  • Patent number: 11166063
    Abstract: Systems and methods are provided for controlling a set-top box via a smart speaker. One example method includes receiving, at the smart speaker, an input related to the set-top box. A request based on the input is transmitted to a server. At the server and based on the request, program listing data is retrieved. A command for controlling the set-top box is identified based on the program listing data. At least one of the program listing data and the identified command is transmitted from the server to the smart speaker. The identified command is transmitted from the smart speaker to the set-top box.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: November 2, 2021
    Assignee: Rovi Guides, Inc.
    Inventor: Keiichi Den
  • Patent number: 6720662
    Abstract: A semiconductor device of chip-on-chip structure is provided which includes a first semiconductor chip and a second semiconductor chip bonded onto the first semiconductor chip in stacked relation. In one embodiment, a noise shield film is provided between the first semiconductor chip and the second semiconductor chip for shielding against a radiation noise from the second semiconductor chip. In another embodiment, a metal film is provided between the first semiconductor chip and the second semiconductor chip to provide a heat release path for releasing heat generated by the second semiconductor chip.
    Type: Grant
    Filed: November 1, 2000
    Date of Patent: April 13, 2004
    Assignee: Rohm Co., Ltd.
    Inventor: Keiichi Den