Patents by Inventor Keiichi Fujita
Keiichi Fujita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240110186Abstract: A method produces a hairpin single-stranded RNA molecule capable of inhibiting expression of a target gene, including the step of reacting a first single-stranded oligo-RNA molecule represented by formula (I) with a second single-stranded oligo-RNA molecule represented by formula (II) in a mixed solvent including a buffer solution and a hydrophilic organic solvent in the presence of a dehydration condensation agent: 5?-Xc-Lx1 . . . (I) and Lx2-X—Y-Ly-Yc-3? . . . (II), wherein the dehydration condensation agent is selected from the group consisting of a triazine-based dehydration condensation agent, a uronium-based dehydration condensation agent including an N-hydroxy nitrogen-containing aromatic ring structure, a carbodiimide-based dehydration condensation agent, a 2-halopyridinium-based dehydration condensation agent, and a formamidinium-based dehydration condensation agent.Type: ApplicationFiled: September 1, 2023Publication date: April 4, 2024Inventors: Kyohei Koshimoto, Katsuhiko Iseki, Hideaki Inada, Tatsuya Fujita, Keiichi Okimura, Munetaka Kunishima, Tadaaki Ohgi, Eriko Aoki
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Publication number: 20240035965Abstract: An optical sensor includes: a metal base formed into a cylindrical shape; an optical fiber member inserted into the base; and a sensor head that is bonded to the base and is optically connected to the optical fiber member, the sensor head including a head portion formed from monocrystalline alumina, in which the base includes a fitting portion into which the sensor head is inserted, and the sensor head is bonded to the fitting portion via a bonding member.Type: ApplicationFiled: December 15, 2021Publication date: February 1, 2024Inventors: Ayumu Sakamoto, Keiichi Fujita, Tsutomu Yamate
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Patent number: 11795546Abstract: A substrate processing apparatus includes a substrate holder configured to horizontally hold and rotate a substrate which has a recess and a base metal layer exposed from a bottom surface of the recess; and a pre-cleaning liquid supply configured to supply a pre-cleaning liquid such as dicarboxylic acid or tricarboxylic acid onto the substrate being held and rotated by the substrate holder, to thereby pre-clean the base metal layer. A temperature of the pre-cleaning liquid on the substrate is equal to or higher than 40° C.Type: GrantFiled: November 22, 2018Date of Patent: October 24, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Takashi Tanaka, Keiichi Fujita, Yuichiro Inatomi
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Publication number: 20220357185Abstract: An optical sensor includes a tube-shaped base formed from a metal, an optical fiber member received inside the base, and a sensor head formed from monocrystalline alumina and bonded to the base to be optically connected with the optical fiber member. The sensor head is provided with a first cavity including a first reflection surface configured to reflect a part of light introduced through the optical fiber member and a second reflection surface provided facing the first reflection surface and configured to reflect a part of the light reflected by the first reflection surface. A first interference light produced by an interference between the light reflected by the first reflection surface and the light reflected by the second reflection surface is output from the first cavity.Type: ApplicationFiled: June 24, 2020Publication date: November 10, 2022Inventors: Ayumu Sakamoto, Keiichi Fujita, Tsutomu Yamate, Ken Ogawa
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Patent number: 10903081Abstract: A substrate processing method is provided for performing a plating processing on a substrate having, on a surface thereof, an impurity-doped polysilicon film containing a high concentration of impurities. The substrate processing method includes forming a catalyst layer by supplying, onto the substrate, an alkaline catalyst solution containing a complex of a palladium ion and a monocyclic 5- or 6-membered heterocyclic compound having one or two nitrogen atoms as a heteroatom; and forming a plating layer through electroless plating by supplying a plating liquid onto the substrate after the forming of the catalyst layer.Type: GrantFiled: December 29, 2017Date of Patent: January 26, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Tomohisa Hoshino, Keiichi Fujita, Masato Hamada
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Publication number: 20210002770Abstract: A substrate processing apparatus includes a substrate holder configured to horizontally hold and rotate a substrate which has a recess and a base metal layer exposed from a bottom surface of the recess; and a pre-cleaning liquid supply configured to supply a pre-cleaning liquid such as dicarboxylic acid or tricarboxylic acid onto the substrate being held and rotated by the substrate holder, to thereby pre-clean the base metal layer. A temperature of the pre-cleaning liquid on the substrate is equal to or higher than 40° C.Type: ApplicationFiled: November 22, 2018Publication date: January 7, 2021Inventors: Takashi Tanaka, Keiichi Fujita, Yuichiro Inatomi
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Patent number: 10755973Abstract: A metal wiring layer can be formed within a recess of a substrate and an unnecessary plating layer is not left on a surface of the substrate. A metal wiring layer forming method includes forming a first plating layer 7 as a protection layer at least on a tungsten or tungsten alloy 4 formed on a bottom surface 3a of a recess 3 of a substrate 2; removing an unnecessary plating layer 7a formed on a surface 2a of the substrate 2; and forming a second plating layer 8 on the first plating layer 7 within the recess 3.Type: GrantFiled: August 29, 2017Date of Patent: August 25, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Keiichi Fujita, Kazutoshi Iwai, Nobutaka Mizutani
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Publication number: 20190229016Abstract: A metal wiring layer can be formed within a recess of a substrate and an unnecessary plating layer is not left on a surface of the substrate. A metal wiring layer forming method includes forming a first plating layer 7 as a protection layer at least on a tungsten or tungsten alloy 4 formed on a bottom surface 3a of a recess 3 of a substrate 2; removing an unnecessary plating layer 7a formed on a surface 2a of the substrate 2; and forming a second plating layer 8 on the first plating layer 7 within the recess 3.Type: ApplicationFiled: August 29, 2017Publication date: July 25, 2019Inventors: Keiichi Fujita, Kazutoshi Iwai, Nobutaka Mizutani
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Publication number: 20180122641Abstract: A substrate processing method is provided for performing a plating processing on a substrate having, on a surface thereof, an impurity-doped polysilicon film containing a high concentration of impurities. The substrate processing method includes forming a catalyst layer by supplying, onto the substrate, an alkaline catalyst solution containing a complex of a palladium ion and a monocyclic 5- or 6-membered heterocyclic compound having one or two nitrogen atoms as a heteroatom; and forming a plating layer through electroless plating by supplying a plating liquid onto the substrate after the forming of the catalyst layer.Type: ApplicationFiled: December 29, 2017Publication date: May 3, 2018Inventors: Tomohisa Hoshino, Keiichi Fujita, Masato Hamada
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Publication number: 20170167029Abstract: A substrate processing apparatus can allow palladium atoms to be coupled to a surface of a substrate without performing a silane coupling processing with a silane coupling agent on the substrate. In a substrate processing apparatus 1, a plating unit 4 includes a catalyst solution supply unit 43a and a plating liquid supply unit 45. The catalyst solution supply unit 43a forms a catalyst layer 91 on a surface of a substrate W1 by supplying, onto the substrate W1, a catalyst solution L1 containing a complex of a palladium ion and a monocyclic 5- or 6-membered aromatic or aliphatic heterocyclic compound having one or two nitrogen atoms as a heteroatom. After the catalyst solution L1 is supplied, the plating liquid supply unit 45 forms an electroless plating layer 92 on the catalyst layer 91 formed on a substrate W2 by supplying a plating liquid M1 onto the substrate W2.Type: ApplicationFiled: December 8, 2016Publication date: June 15, 2017Inventors: Tomohisa Hoshino, Keiichi Fujita, Masato Hamada
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Publication number: 20170170021Abstract: In a substrate processing apparatus 1, a plating unit 4 includes a catalyst solution supply unit 43a and a plating liquid supply unit 45. By supplying, from the catalyst solution supply unit 43a onto a substrate W1 having an impurity-doped polysilicon film 90 containing a high concentration of impurities on a surface thereof, an alkaline catalyst solution L1 containing a complex of a palladium ion and a monocyclic 5- or 6-membered aromatic or aliphatic heterocyclic compound having one or two nitrogen atoms as a heteroatom, a catalyst layer 91 is formed on a surface of the impurity-doped polysilicon film 90 of the substrate W1. After the catalyst solution L1 is supplied, an electroless plating layer 92 is formed on the catalyst layer 91 formed on a substrate W2 by supplying a plating liquid M1 from the plating liquid supply unit 45 onto the substrate W2.Type: ApplicationFiled: December 9, 2016Publication date: June 15, 2017Inventors: Tomohisa Hoshino, Keiichi Fujita, Masato Hamada
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Patent number: 7988124Abstract: Provided is a needle valve in which a gap between a valve casing and a needle is reliably sealed and an origin of the needle can be readily obtained with high precision. A needle (6) is screwed into a cylindrical rotor (44) of a stepping motor (7) so as to be retractable, and a rotation regulating member (47) prevents the needle (6) from rotating together with the rotor (44). Accordingly, in a case of driving the motor (7) to rotate the rotor (44), the needle (6) vertically moves without rotating. A lower limit sensor (61) and an upper limit sensor (60) detects a detection target piece (49) provided to the rotation regulating member (47), so a lower limit position and an upper limit position of the needle (6) are obtained. The motor (7) is controlled such that, after the motor (7) is driven until the lower limit sensor (61) detects the detection target piece (49), an origin sensor (71) monitors an origin detection plate (62) so as to stop at a predetermined rotation stop position.Type: GrantFiled: September 11, 2007Date of Patent: August 2, 2011Assignee: Miura Co., Ltd.Inventors: Shigehiro Watanabe, Tomohisa Takeda, Keiichi Fujita
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Publication number: 20090194721Abstract: Provided is a needle valve in which a gap between a valve casing and a needle is reliably sealed and an origin of the needle can be readily obtained with high precision. A needle (6) is screwed into a cylindrical rotor (44) of a stepping motor (7) so as to be retractable, and a rotation regulating member (47) prevents the needle (6) from rotating together with the rotor (44). Accordingly, in a case of driving the motor (7) to rotate the rotor (44), the needle (6) vertically moves without rotating. A lower limit sensor (61) and an upper limit sensor (60) detects a detection target piece (49) provided to the rotation regulating member (47), so a lower limit position and an upper limit position of the needle (6) are obtained. The motor (7) is controlled such that, after the motor (7) is driven until the lower limit sensor (61) detects the detection target piece (49), an origin sensor (71) monitors an origin detection plate (62) so as to stop at a predetermined rotation stop position.Type: ApplicationFiled: September 11, 2007Publication date: August 6, 2009Inventors: Shigehiro Watanabe, Tomohisa Takeda, Keiichi Fujita
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Patent number: 5291699Abstract: A roof includes a plurality of rafters each having at its upper end a connection and having at its lower end a fixing section, and a rod for retaining the rafters at predetermined intervals. The roof further includes a reinforcement material provided between the rafters, and an eaves trough extending along the periphery of the lower edge of the sheathing surface laid on the rafters. Accordingly, the labor hours required for, e.g., the positional change of the ridgepole or rafters when remodeling the conventional roof, are reduced, thereby enabling occupancy within the house under remodeling, as well as restraining the remodeling cost.Type: GrantFiled: December 15, 1992Date of Patent: March 8, 1994Inventor: Keiichi Fujita
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Patent number: 4585486Abstract: A process for placing a cement composition having high strength is provided. The process comprises the steps of adding a viscosity increasing agent, vacuum de-bubbling under reduced pressure and allowing the de-bubbled cement composition to be hardened. At the vacuum de-bubbling step, relatively large foams present in the cement composition are removed and only fine bubbles are left in the composition. The strength of the cement composition is remarkably improved by the removal of large bubbles.Type: GrantFiled: July 10, 1984Date of Patent: April 29, 1986Assignee: Hazama-Gumi, Ltd.Inventors: Keiichi Fujita, Hiroshi Nakauchi, Tatsuo Kita, Yoshiki Nakagawa, Terunobu Maeda