Abstract: An electrostatic separator separates conductive particles from raw materials includes: a container with a raw material layer; a gas dispersion plate at the bottom of the raw material layer; at least one vibrating body in the raw material layer flush with the gas dispersion plate or above it; a fluidization gas supplier introduced from the container bottom into the raw material layer flows upward through the gas dispersion plate; an upper electrode above the raw material layer; a lower electrode in the raw material layer, the lower electrode being flush with the gas dispersion plate or above it; a power supply applies a voltage between the upper and lower electrode wherein one becomes a negative electrode, the other becomes a positive electrode, and an electric field is generated between them; and a capturer captures conductive particles that have flown out of the raw material layer surface toward the upper electrode.

Abstract: An electrode structure includes: a plurality of pixel electrodes arranged separately from each other; and a plurality of dielectric layers laminated in a first direction with respect to the plurality of pixel electrodes, in which the plurality of dielectric layers includes: a first dielectric layer that spreads over the plurality of pixel electrodes in a direction intersecting with the first direction; and a second dielectric layer that includes dielectric material having a refractive index higher than that of the first dielectric layer, sandwiches the first dielectric layer together with the plurality of pixel electrodes, and has a slit at a position overlapping space between pixel electrodes adjacent when viewed from the first direction.

Abstract: An electrostatic separation method includes: applying voltage between a lower electrode at a bottom portion of or in the raw material layer and an upper electrode above the raw material layer, generating an electric field between electrodes; fluidizing the raw material layer and bringing conductive particles and the lower electrode into contact in the raw material layer charging only the conductive particles wherein their polarity becomes the same as the lower electrode; generating polarity, the same as the upper electrode, by dielectric polarization on a conveyor belt downward-facing conveyance surface passing through a capture region above the raw material layer and under the upper electrode, the conveyance surface including a nonconductor; separates charged conductive particles from the raw material layer surface by electrostatic force and adhering conductive particles to the conveyor belt conveyance surface; and separating and collecting the particles from the conveyance surface that moved outside the ele

Abstract: A device testing apparatus including a connection terminal to which an electronic device under test is detachably attached, a pusher for pushing the electronic device in the direction of the connection terminal so as to connect the electronic device to the connection terminal, and a cooling unit for cooling the electronic device. As the cooling unit, an element cooling the device using electricity is for example used. The cooling unit includes a cooling medium blower for blowing a cooling medium around the electronic device and heat exchange projections or depressions for raising the cooling efficiency by blowing a cooling medium. In the device testing apparatus, even if the electronic device generates heat on its own during testing, the electronic device is cooled through the pusher, connection terminals, or socket, so the effect of the heat generated by the electronic device is canceled out and the electronic device can be tested at the predetermined temperature as prescribed in the specification.

Abstract: A device testing apparatus including a connection terminal to which an electronic device under test is detachably attached, a pusher for pushing the electronic device in the direction of the connection terminal so as to connect the electronic device to the connection terminal, and a cooling unit for cooling the electronic device. As the cooling unit, an element cooling the device using electricity is for example used. The cooling unit includes a cooling medium blower for blowing a cooling medium around the electronic device and heat exchange projections or depressions for raising the cooling efficiency by blowing a cooling medium. In the device testing apparatus, even if the electronic device generates heat on its own during testing, the electronic device is cooled through the pusher, connection terminals, or socket, so the effect of the heat generated by the electronic device is canceled out and the electronic device can be tested at the predetermined temperature as prescribed in the specification.

Abstract: A device testing apparatus including a connection terminal to which an electronic device under test is detachably attached, a pusher for pushing the electronic device in the direction of the connection terminal so as to connect the electronic device to the connection terminal, and a cooling unit for cooling the electronic device. As the cooling unit, an element cooling the device using electricity is for example used. The cooling unit includes a cooling medium blower for blowing a cooling medium around the electronic device and heat exchange projections or depressions for raising the cooling efficiency by blowing a cooling medium. In the device testing apparatus, even if the electronic device generates heat on its own during testing, the electronic device is cooled through the pusher, connection terminals, or socket, so the effect of the heat generated by the electronic device is canceled out and the electronic device can be tested at the predetermined temperature as prescribed in the specification.

Abstract: A device testing apparatus including a connection terminal to which an electronic device under test is detachably attached, a pusher for pushing the electronic device in the direction of the connection terminal so as to connect the electronic device to the connection terminal, and a cooling unit for cooling the electronic device. As the cooling unit, an element cooling the device using electricity is for example used. The cooling unit includes a cooling medium blower for blowing a cooling medium around the electronic device and heat exchange projections or depressions for raising the cooling efficiency by blowing a cooling medium. In the device testing apparatus, even if the electronic device generates heat on its own during testing, the electronic device is cooled through the pusher, connection terminals, or socket, so the effect of the heat generated by the electronic device is canceled out and the electronic device can be tested at the predetermined temperature as prescribed in the specification.

Abstract: A device testing apparatus including a connection terminal to which an electronic device under test is detachably attached, a pusher for pushing the electronic device in the direction of the connection terminal so as to connect the electronic device to the connection terminal, and a cooling unit for cooling the electronic device. As the cooling unit, an element cooling the device using electricity is for example used. The cooling unit includes a cooling medium blower for blowing a cooling medium around the electronic device and heat exchange projections or depressions for raising the cooling efficiency by blowing a cooling medium. In the device testing apparatus, even if the electronic device generates heat on its own during testing, the electronic device is cooled through the pusher, connection terminals, or socket, so the effect of the heat generated by the electronic device is canceled out and the electronic device can be tested at the predetermined temperature as prescribed in the specification.

Abstract: A device testing apparatus including a connection terminal to which an electronic device under test is detachably attached, a pusher for pushing the electronic device in the direction of the connection terminal so as to connect the electronic device to the connection terminal, and a cooling unit for cooling the electronic device. As the cooling unit, an element cooling the device using electricity is for example used. The cooling unit includes a cooling medium blower for blowing a cooling medium around the electronic device and heat exchange projections or depressions for raising the cooling efficiency by blowing a cooling medium. In the device testing apparatus, even if the electronic device generates heat on its own during testing, the electronic device is cooled through the pusher, connection terminals, or socket, so the effect of the heat generated by the electronic device is canceled out and the electronic device can be tested at the predetermined temperature as prescribed in the specification.

Abstract: A constant temperature chamber to be disposed in a handler for use with an IC tester is provided which is capable of preheating semiconductor devices to be measured to a preset temperature uniformly and in a short time. A rotary stage adapted to rotate with semiconductor devices to be measured loaded thereon is disposed in the bottom of the constant temperature chamber enclosed by thermal insulation walls. A heater is disposed in the upper portion of the constant temperature chamber. An axial-flow fan is positioned between the heater and the rotary stage. Further, a tubular flow-rectifying member is disposed surrounding and in proximity to the outer periphery of the axial-flow fan.

Abstract: A device handler prevents a dropping of a device chuck mounted to a rotary arm owing to a breaking of a coil spring and a stoppage of the device chuck at an elevation in the mid way of vertical movements owing to a defect or failure of a linear guide, preventing the device chuck and/or an exit stage from being damaged or broken. A first guide rail is provided along a downwardly inclined camming surface of a cam member extending from the vicinity above a soak stage to a vicinity above a measuring section, and a second guide rail is provided along an upwardly inclined camming surface of the cam member extending from the vicinity above the measuring section to the vicinity above the exit stage. In addition, on the opposite side of a cam holder about the rotary shaft of the rotary arm unit is placed an arcuate dropping preventive plate mounted to the props depending from the ceiling insulation wall of the constant temperature chamber like the cam holder.

Abstract: A test section for use in an IC handler capable of testing even high speed operating IC devices with precision is provided. A mounting fixture 62 for connecting a test head 32 of an IC tester with the constant temperature chamber 20 of the IC handler is configured to be detachable with respect to the base 10a of the body of the IC handler, and a socket guide 70 having IC sockets mounted therein is also configured to be detachable with respect to the mounting fixture 62. With this construction, it is possible to minimize the length of the electric path between the performance board 35 and the terminals of the IC sockets. In addition, the IC sockets may be mounted even directly on the performance board 35. It is thus possible to carry out the testing utilizing all types of test heads by preparing various mounting fixtures matching with the test heads used.

Abstract: An improved structure for a spacing frame for interfacing a test head of an IC tester and an IC handler wherein the spacing frame can be changed in a short period of time without moving the test head of the IC tester or the IC handler. The spacing frame and the temperature chamber provide a unique structure which is capable of inserting and replacing the spacing frame within a vertical space in the chamber and locking the spacing frame in the predetermined position in the chamber.

Abstract: transport mechanism for integrated circuit (IC) handlers with four transport stations spaced 90.degree. apart on one circumference are supported by a cross-shaped contact arm, and below the circumference, contact-in, contact or test and contact-out stages are provided at intervals of 90.degree.. Each transport station has a vertically movable air chuck unit and an air chuck driving mechanism for driving the air chuck unit vertically and holding by suction and releasing devices under test. The transport station that has reached a predetermined position above the contact-in stage presses the air chuck unit down with the air chuck driving mechanism and suck and lifts the devices to be tested off the contact-in stage.