Patents by Inventor Keiichi IBATA

Keiichi IBATA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD
    Publication number: 20240118619
    Abstract: A resist composition including a silicon-containing resin and an acid generator component that generates acid upon exposure. The acid generator component includes an onium salt containing an anion moiety having an iodine atom and a cation moiety.
    Type: Application
    Filed: September 1, 2023
    Publication date: April 11, 2024
    Inventors: Keiichi Ibata, Tomotaka Yamada
  • Hard mask-forming composition and method for manufacturing electronic component
    Patent number: 11921425
    Abstract: A hard mask-forming composition which forms a hard mask used in lithography, including: a resin containing an aromatic ring and a polar group; and a compound containing at least one of an oxazine ring fused to an aromatic ring, and a fluorene ring.
    Type: Grant
    Filed: February 27, 2023
    Date of Patent: March 5, 2024
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Junichi Tsuchiya, Keiichi Ibata
  • NEGATIVE-TONE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN
    Publication number: 20230314945
    Abstract: A negative-tone resist composition containing a silicon-containing resin, an acid generator component that generates acid upon exposure, and a crosslinking agent component. The silicon-containing resin (A) contains a silicon-containing polymer having a phenolic hydroxyl group, and the acid generator component contains a sulfonium salt having a fluorine atom in a cation moiety.
    Type: Application
    Filed: March 27, 2023
    Publication date: October 5, 2023
    Inventors: Keiichi IBATA, Masaru TAKESHITA, Tomotaka YAMADA
  • Hard-mask forming composition, method for manufacturing electronic component, and resin
    Patent number: 11746189
    Abstract: A hard-mask forming composition including a resin (P1) having a repeating structure (u1) represented by General Formula (u1-0), wherein Ar01 and Ar02 are aromatic hydrocarbon groups which may have a substituent, Ar02 has at least one nitrogen atom or oxygen atom, L01 and L02 are each independently a single-bonded or divalent linking group, and X is NH4 and the like
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: September 5, 2023
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventor: Keiichi Ibata
  • HARD MASK-FORMING COMPOSITION AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
    Publication number: 20230221643
    Abstract: A hard mask-forming composition which forms a hard mask used in lithography, including: a resin containing an aromatic ring and a polar group; and a compound containing at least one of an oxazine ring fused to an aromatic ring, and a fluorene ring.
    Type: Application
    Filed: February 27, 2023
    Publication date: July 13, 2023
    Inventors: Junichi TSUCHIYA, Keiichi IBATA
  • Hard mask-forming composition and method for manufacturing electronic component
    Patent number: 11650503
    Abstract: A hard mask-forming composition which forms a hard mask used in lithography, including: a resin containing an aromatic ring and a polar group; and a compound containing at least one of an oxazine ring fused to an aromatic ring, and a fluorene ring.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: May 16, 2023
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Junichi Tsuchiya, Keiichi Ibata
  • Hard-mask forming composition and method for manufacturing electronic component
    Patent number: 11248086
    Abstract: A hard-mask forming composition, which is used for forming a hard mask used in lithography, including a first resin and a second resin, in which an amount of carbon contained in the first resin is 85% by mass or more with respect to the total mass of all elements constituting the first resin, and the amount of carbon contained in the second resin is 70% by mass or more with respect to the total mass of all elements constituting the second resin and less than the amount of carbon contained in the first resin.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: February 15, 2022
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Keiichi Ibata, Ryoji Watanabe
  • HARD-MASK FORMING COMPOSITION AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
    Publication number: 20210382392
    Abstract: A hard-mask forming composition including a resin containing a structural unit represented by General Formula (u1-1) or a structural unit represented by General Formula (u1-2) and a compound represented by General Formula (c-1), in which R11 and R12 are aromatic hydrocarbon groups which may have a substituent, Y is an organic group, R01 is a hydrocarbon group, R02 is an alkyl group, n1 is an integer of 0 to 3, n2 is an integer of 1 to 4, n3 is an integer of 1 to 3, n4 is an integer of 3 or more, and the number of —CH2OR02 is 6 or more
    Type: Application
    Filed: May 27, 2021
    Publication date: December 9, 2021
    Inventors: Junichi TSUCHIYA, Keiichi IBATA
  • HARD-MASK FORMING COMPOSITION, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND RESIN
    Publication number: 20210261731
    Abstract: A hard-mask forming composition including a resin (P1) having a repeating structure (u1) represented by General Formula (u1-0), wherein Ar01 and Ar02 are aromatic hydrocarbon groups which may have a substituent, Ar02 has at least one nitrogen atom or oxygen atom, L01 and L02 are each independently a single-bonded or divalent linking group, and X is NH4 and the like
    Type: Application
    Filed: February 12, 2021
    Publication date: August 26, 2021
    Inventor: Keiichi IBATA
  • HARD-MASK FORMING COMPOSITION, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND COMPOUND AND RESIN
    Publication number: 20210155825
    Abstract: A hard-mask forming composition that forms a hard mask that is used in lithography, the hard-mask forming composition including at least one of a compound represented by General Formula (sc-1) and a resin having a partial structure represented by General Formula (sc-p1).
    Type: Application
    Filed: November 17, 2020
    Publication date: May 27, 2021
    Inventor: Keiichi IBATA
  • HARD-MASK FORMING COMPOSITION AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
    Publication number: 20210132498
    Abstract: A hard-mask forming composition including a resin (P1) containing a structural unit (u11) represented by General Formula (u11-1), and a resin (P2) containing an aromatic ring and a polar group, provided that the resin (P1) is excluded from the resin (P2), wherein R11 represents an aromatic hydrocarbon group which may have a substituent, Rp11 is an aldehyde group, a group represented by Formula (u-r-1), a group represented by Formula (u-r-2), or a group represented by Formula (u-r-3)
    Type: Application
    Filed: October 2, 2020
    Publication date: May 6, 2021
    Inventors: Junichi Tsuchiya, Keiichi Ibata
  • HARD MASK-FORMING COMPOSITION AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
    Publication number: 20200041904
    Abstract: A hard mask-forming composition which forms a hard mask used in lithography, including: a resin containing an aromatic ring and a polar group; and a compound containing at least one of an oxazine ring fused to an aromatic ring, and a fluorene ring.
    Type: Application
    Filed: July 18, 2019
    Publication date: February 6, 2020
    Inventors: Junichi TSUCHIYA, Keiichi IBATA
  • HARD-MASK FORMING COMPOSITION AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
    Publication number: 20190341253
    Abstract: A hard-mask forming composition, which is used for forming a hard mask used in lithography, including a first resin and a second resin, in which an amount of carbon contained in the first resin is 85% by mass or more with respect to the total mass of all elements constituting the first resin, and the amount of carbon contained in the second resin is 70% by mass or more with respect to the total mass of all elements constituting the second resin and less than the amount of carbon contained in the first resin.
    Type: Application
    Filed: April 17, 2019
    Publication date: November 7, 2019
    Inventors: Keiichi IBATA, Ryoji WATANABE