Abstract: One slot arranged between two slots containing a first armature winding contains a second armature winding for a phase different from a phase of the first armature winding; one slot arranged between the two slots containing the first armature winding contains a third armature winding for a phase equal to the phase of the second armature winding; and, one of the second armature winding and the third armature winding is arranged in a coil end portion in an outer peripheral side of the first armature winding, and the other is arranged in an inner peripheral side of the armature winding. With this, the projected height of the coil end portion of the stator can be reduced.

Abstract: Amulti-phase alternating-current rotational electric machine wherein semiconductor switching devices are electrically insulated from heat sinks, and the heat sinks are grounded to the housing and thermally separated in each phase.

Abstract: A semiconductor apparatus includes positive and negative side conductors for bridge-connecting semiconductor switches, constituted to a wide conductor, and laminated by sandwiching an insulator between them. A semiconductor apparatus includes positive and negative side conductors extended from its case, and an electrolytic capacitor connected to the extension portion of the positive and negative side conductors. A power converter uses the semiconductor apparatus.

Abstract: The present invention provides a semiconductor device which reduces an inductance of wiring for bridge-connecting semiconductor switches and realizes a reduction in size. Within the semiconductor device formed are two controllable bridge-connected semiconductor switches 13a and 13b, an output terminal, positive/negative polarity DC terminals 2 and 3, and an insulating substrate 15a in which conductor layers 12, 17 and 19 having a conductor section and in an inner layer for bridge-connecting the semiconductor switches to the DC terminals on a surface thereof and insulating layers 16 and 18 are alternately laminated. The surface and inner-layer conductor layers 12 and 17 which interpose the insulating layer 16 therebetween are electrically connected by a conductor 20 passing through the insulating layer 16 interposed between the conductor layers 12 and 17.

Abstract: One method of achieving the above subjects is by connecting a block member 14, which is connected to the side opposite to that of a semiconductor chip 11 having insulating substrates 12 and 13 connected to the top and bottom of the semiconductor chip 11, to a block member 15 across an laminated structure constituted by the semiconductor chip 11 and the insulating substrates 12 and 13.

Abstract: One method of achieving the above subjects is by connecting one of electroconductive members 12, which are pre-connected to the top and bottom of a semiconductor chip 11 and have thermal conductivity, to an electroconductive member 13, which is used with the semiconductor chip 11 to constitute a laminated structure, in electrically insulated form on the same surface as the installation surface of the electroconductive member 13 so as to straddle the laminated structure constituted by the semiconductor chip 11 and the electroconductive member 13.

Abstract: The present invention provides a vehicle driving apparatus capable of being mounted easily even in a narrow space such as under-floor of the vehicle. The vehicle driving apparatus comprises a first and a second generators driven by an engine for driving front wheels, and a motor driven by receiving a power supply from the second generator to drive rear wheels, the first and second generators being installed in the vicinity of an engine within an engine room, the motor being arranged in the vicinity of a differential gear with which a reduction mechanism is integrated and is positioned substantially in a central part of the rear wheels.

Abstract: The invention intends to reduce the inductance of wirings for connecting an electrolytic capacitor for use in a low-voltage electric device, and realizes to suppress the surge voltage and improve the frequency response. For a low-voltage electrolytic capacitor, the anode and cathode electrode terminals are placed to come close, and broad parallel plates are used for the wirings connecting to the electric device, so that the to-and-fro currents overlap in an area of the power wirings near the electrolytic capacitor, thereby reducing the inductance of the wiring parts to a large extent.

Abstract: A power source apparatus includes a first switching element for controlling the power feed in the direction from a high-voltage battery to an inverter, and a second switching element for the power feed in the direction from the inverter to a low-voltage battery, and the voltage at the direct current side is controlled to be higher than that of the high-voltage battery when a battery controller for controlling the first and second switching elements breaks down.

Abstract: In an electric power conversion/inversion apparatus, including, such as an inverter therein, for obtaining reduction in circuit inductance and wiring resistance therein by bringing small as a whole, having good installability and high reliability and efficiency of electric power conversion, as well, semiconductor chips 1 are disposed, being put between a positive input bus bar 14p and a negative input bus bar 14n and plural output bus bars 18 at crossing positions thereof, and are connected electrically and thermally, to the positive input bus bar 14p in a pole direction consistent therewith while to the negative input bus bar 14n in a pole direction consistent therewith, and further to the common output bus bars 18 in pole directions being different from side by side.

Abstract: A semiconductor power conversion device includes two bridge-connected semiconductor switches, an output terminal, and first and second pairs of positive and negative direct current terminals. First conductors connect the negative direct current terminals of the first and second pairs with the output terminal through one of the two bridge-connected semiconductor switches, while second conductors connect the positive direct current terminals of the first and second pairs with the other of the two bridge-connected semiconductor switches. A housing is provided, which includes the two bridge-connected semiconductor switches, and at least a portion of the first conductor and of the second conductor as a multilayer structure formed by sandwiching an insulator between the first and second conductors inside the housing. The first and second pairs of direct current terminals are arranged on one side of one plane of the housing.

Abstract: A semiconductor apparatus includes positive and negative side conductors for bridge-connecting semiconductor switches, constituted to a wide conductor, and laminated by sandwiching an insulator between them. A semiconductor apparatus includes positive and negative side conductors extended from its case, and an electrolytic capacitor connected to the extension portion of the positive and negative side conductors. A power converter uses the semiconductor apparatus.

Abstract: A positive side conductor and a negative side conductor of an input terminal electrically connected to semiconductor elements, are electrically insulated from each other, and are laminated with each other, and the input terminal having such a laminated structure, an output terminal and substrates mounted thereon the semiconductor elements are arranged in a checkered pattern in a container. Further, the semiconductor elements mounted on the substrates, the input terminal and the output terminal are electrically connected to one another so as to obtain a loop-like electric path on a conductive member, thereby it is possible to aim at miniaturizing the power conversion apparatus and lowering the inductance thereof.

Abstract: A semiconductor apparatus includes positive and negative side conductors for bridge-connecting semiconductor switches, constituted to a wide conductor, and laminated by sandwiching an insulator between them. A semiconductor apparatus includes positive and negative side conductors extended from its case, and an electrolytic capacitor connected to the extension portion of the positive and negative side conductors. A power converter uses the semiconductor apparatus.

Abstract: A semiconductor device including a positive polarity wiring plate, negative wiring plate, more than one output wiring plate, semiconductor switch element and conductive buffer or “cushion” member is disclosed. The semiconductor switch element and cushion member are compressively interposed between the output wiring plate and positive wiring plate and also between the output wiring plate and negative wiring plate to thereby constitute bridge circuitry. The positive wiring plate, negative wiring plate or output wiring plate is for use as one support body of a pressurization structure. With such an arrangement, it is possible to improve the heat releasability of semiconductor elements while at the same time reducing the inductance of direct current (DC) circuitry to thereby suppress heat generation of the semiconductor elements, thus increasing the reliability relative to temperature cycles.

Abstract: The present invention provides a vehicle driving apparatus capable of being mounted easily even in a narrow space such as under-floor of the vehicle. The vehicle driving apparatus comprises a first and a second generators driven by an engine for driving front wheels, and a motor driven by receiving a power supply from the second generator to drive rear wheels, the first and second generators being installed in the vicinity of an engine within an engine room, the motor being arranged in the vicinity of a differential gear with which a reduction mechanism is integrated and is positioned substantially in a central part of the rear wheels.

Abstract: When a MOS transistor is turned off, a forward current flows into a diode connected to the MOS transistor. When the MOS transistor is conducted, a reverse bias is applied to the diode. When the MOS transistor is turned on during the reverse recovery time of the diode, a short-circuit current flows into the MOS transistor, the diode, and a battery connected in series with the diode and the MOS transistor. In this case, an overcurrent flows through the wiring of the battery momentarily, and electromagnetic wave generates from the wiring. Accordingly, noise caused by the electromagnetic wave is generated in an antenna to a radio receiver. The drain current of the MOS transistor is gradually increased by a delay circuit, and the MOS transistor is shifted from a completely turned-off state to a completely turned-on state with a time period longer than a reverse recovery time of the diode. Consequently, no reverse current flows through the diode.

Abstract: One slot arranged between two slots containing a first armature winding contains a second armature winding for a phase different from a phase of the first armature winding, and one slot arranged between the two of slots containing the first armature winding contains a third armature winding for a phase equal to the phase of the second armature winding, and one of the second armature winding and the third armature winding is arranged in a coil end portion in an outer peripheral side of the first armature winding, and the other is arranged in an inner peripheral side of the first armature winding. With this, the projected height of the coil end portion of the stator can be reduced.

Abstract: In an electric power conversion/inversion apparatus, including, such as an inverter therein, for obtaining reduction in circuit inductance and wiring resistance therein by bringing small as a whole, having good installability and high reliability and efficiency of electric power conversion, as well, semiconductor chips 1 are disposed, being put between a positive input bus bar 14p and a negative input bus bar 14n and plural output bus bars 18 at crossing positions thereof, and are connected electrically and thermally, to the positive input bus bar 14p in a pole direction consistent therewith while to the negative input bus bar 14n in a pole direction consistent therewith, and further to the common output bus bars 18 in pole directions being different from side by side.

Abstract: A semiconductor apparatus includes positive and negative side conductors for bridge-connecting semiconductor switches, constituted to a wide conductor, and laminated by sandwiching an insulator between them. A semiconductor apparatus includes positive and negative side conductors extended from its case, and an electrolytic capacitor connected to the extension portion of the positive and negative side conductors. A power converter uses the semiconductor apparatus.