Patents by Inventor Keiichi Naitoh

Keiichi Naitoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing flexible wiring board
    Patent number: 7098132
    Abstract: In the present invention, a reference conductive layer and a first surface conductive layer are respectively provided on a surface and a back face of a first base film. The first base film includes a first via hole penetrating the first surface conductive layer. After a first electroless plating layer and a first conductive material are sequentially grown on a surface of the first base film, a first coating conductive layer composed of the first electroless plating layer, the first conductive material and the first surface conductive layer, is etched to have a reduced thickness. Then, the first coating conductive layer is patterned to form a first wiring layer. In this manner, a desired pattern width can be obtained even in the case where the first coating conductive layer is patterned by isotropic etching such as wet etching.
    Type: Grant
    Filed: March 23, 2005
    Date of Patent: August 29, 2006
    Assignees: Sony Chemicals Corp., Sony Corporation
    Inventors: Keiichi Naitoh, Toshihiro Shinohara, Masahiro Watanabe
  • Method of manufacturing flexible wiring board
    Publication number: 20050164492
    Abstract: In the present invention, a reference conductive layer and a first surface conductive layer are respectively provided on a surface and a back face of a first base film. The first base film includes a first via hole penetrating the first surface conductive layer. After a first electroless plating layer and a first conductive material are sequentially grown on a surface of the first base film, a first coating conductive layer composed of the first electroless plating layer, the first conductive material and the first surface conductive layer, is etched to have a reduced thickness. Then, the first coating conductive layer is patterned to form a first wiring layer. In this manner, a desired pattern width can be obtained even in the case where the first coating conductive layer is patterned by isotropic etching such as wet etching.
    Type: Application
    Filed: March 23, 2005
    Publication date: July 28, 2005
    Applicant: Sony Chemicals Corp.
    Inventors: Keiichi Naitoh, Toshihiro Shinohara, Masahiro Watanabe
  • Method of manufacturing flexible wiring board
    Patent number: 6912779
    Abstract: In the present invention, a reference conductive layer and a first surface conductive layer are respectively provided on a surface and a back face of a first base film. The first base film includes a first via hole penetrating the first surface conductive layer. After a first electroless plating layer and a first conductive material are sequentially grown on a surface of the first base film, a first coating conductive layer composed of the first electroless plating layer, the first conductive material and the first surface conductive layer, is etched to have a reduced thickness. Then, the first coating conductive layer is patterned to form a first wiring layer. In this manner, a desired pattern width can be obtained even in the case where the first coating conductive layer is patterned by isotropic etching such as wet etching.
    Type: Grant
    Filed: August 22, 2003
    Date of Patent: July 5, 2005
    Assignee: Sony Chemicals Corp.
    Inventors: Keiichi Naitoh, Toshihiro Shinohara, Masahiro Watanabe
  • Method of manufacturing flexible wiring board
    Publication number: 20040078970
    Abstract: In the present invention, a reference conductive layer and a first surface conductive layer are respectively provided on a surface and a back face of a first base film. The first base film includes a first via hole penetrating the first surface conductive layer. After a first electroless plating layer and a first conductive material are sequentially grown on a surface of the first base film, a first coating conductive layer composed of the first electroless plating layer, the first conductive material and the first surface conductive layer, is etched to have a reduced thickness. Then, the first coating conductive layer is patterned to form a first wiring layer. In this manner, a desired pattern width can be obtained even in the case where the first coating conductive layer is patterned by isotropic etching such as wet etching.
    Type: Application
    Filed: August 22, 2003
    Publication date: April 29, 2004
    Inventors: Keiichi Naitoh, Toshihiro Shinohara, Masahiro Watanabe