Patents by Inventor Keiichi NARUMI

Keiichi NARUMI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11909144
    Abstract: A socket for electrically connecting an upper first part and a lower second part, the socket includes: a pin that contacts the first part and the second part; a main body made of a non-conductive material; a holder that penetrates the main body vertically and holds the pin; and a conductive layer provided on an inner circumferential surface of the holder to surround the pin.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: February 20, 2024
    Assignee: Enplas Corporation
    Inventors: Keiichi Narumi, Kazutaka Koshiishi
  • Patent number: 11495901
    Abstract: An electric connection socket for relaying electric signals between a circuit substrate and an electric component includes: a metal housing which has a through hole enabling communication between the top surface and the bottom surface thereof, and on the top surface of which the electric component is mounted and on the bottom surface of which the circuit substrate is mounted; and a signal pin inserted into the through hole to configure a coaxial line between the inner wall surfaces of the through hole, and which is electrically connected at one end to a signal path first pad electrode of the circuit substrate and is electrically connected at the other end to a signal path terminal of the electric component. On the bottom surface, the metal housing has a ground connection unit which contacts a second pad electrode for grounding formed on the circuit substrate and which grounds the metal housing.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: November 8, 2022
    Assignee: Enplas Corporation
    Inventor: Keiichi Narumi
  • Publication number: 20220294162
    Abstract: A socket for electrically connecting an upper first part and a lower second part, the socket includes: a pin that contacts the first part and the second part; a main body made of a non-conductive material; a holder that penetrates the main body vertically and holds the pin; and a conductive layer provided on an inner circumferential surface of the holder to surround the pin.
    Type: Application
    Filed: October 29, 2021
    Publication date: September 15, 2022
    Inventors: Keiichi NARUMI, Kazutaka KOSHIISHI
  • Patent number: 11329411
    Abstract: This electrical connection socket for relaying exchange of electrical signals between a first electrical component and a second electrical component, is provided with: a signal pin which is inserted in a communication hole of a metallic casing so as to form a coaxial line path between the inner wall surface of the communication hole and the outer circumferential surface of the signal pin so that one end of the signal pin is electrically connected to a terminal of the first electrical component while the other end is electrically connected to a terminal of the second electrical component; and a holding member which holds the signal pin in the communication hole such that the outer circumferential surface of the signal pin is separated from the inner wall surface of the communication hole, wherein the characteristic impedance of a signal path formed by the signal pin in a first region where the signal pin is held by the holding member is smaller than a predetermined characteristic impedance which is a reference
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: May 10, 2022
    Assignee: ENPLAS CORPORATION
    Inventors: Kazutaka Koshiishi, Keiichi Narumi
  • Publication number: 20210408736
    Abstract: An electric connection socket for relaying electric signals between a circuit substrate and an electric component includes: a metal housing which has a through hole enabling communication between the top surface and the bottom surface thereof, and on the top surface of which the electric component is mounted and on the bottom surface of which the circuit substrate is mounted; and a signal pin inserted into the through hole to configure a coaxial line between the inner wall surfaces of the through hole, and which is electrically connected at one end to a signal path first pad electrode of the circuit substrate and is electrically connected at the other end to a signal path terminal of the electric component. On the bottom surface, the metal housing has a ground connection unit which contacts a second pad electrode for grounding formed on the circuit substrate and which grounds the metal housing.
    Type: Application
    Filed: June 29, 2018
    Publication date: December 30, 2021
    Applicant: Enplas Corporation
    Inventor: Keiichi NARUMI
  • Patent number: 11189945
    Abstract: This electrical connection socket for relaying exchange of electrical signals between a first electrical component and a second electrical component, is provided with: a metallic casing which has a communication hole for communication between the upper surface and lower surface of the metallic casing, to the lower surface side of which the first electrical component is attached, and to the upper surface of which the second electrical component is attached; a signal pin which is disposed in the communication hole so as to be separated from the inner wall surface of the communication hole, one end of which is electrically connected to a terminal of the first electrical component, and the other end of which is electrically connected to a terminal of the second electrical component; an annular first holding member which is, in the upper region of the communication hole, press-fitted in the communication hole; and an annular second holding member which is, in the lower region of the communication hole, press-fitte
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: November 30, 2021
    Assignee: ENPLAS CORPORATION
    Inventors: Kazutaka Koshiishi, Keiichi Narumi
  • Patent number: 11171434
    Abstract: An electric connection socket for relaying electric signals between a circuit substrate and an electric component includes: a metal housing which has a through hole enabling communication between the top surface and the bottom surface thereof, and on the top surface of which the electric component is mounted and on the bottom surface of which the circuit substrate is mounted; and a signal pin inserted into the through hole to configure a coaxial line between the inner wall surfaces of the through hole, and which is electrically connected at one end to a signal path pad electrode of the circuit substrate and is electrically connected at the other end to a signal path terminal of the electric component. The metal housing is arranged on the circuit substrate such that an air gap is formed between the bottom surface of the metal housing and the top surface of the circuit substrate.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: November 9, 2021
    Assignee: Enplas Corporation
    Inventor: Keiichi Narumi
  • Publication number: 20210190820
    Abstract: This electrical connection socket for relaying exchange of electrical signals between a first electrical component and a second electrical component, is provided with: a signal pin which is inserted in a communication hole of a metallic casing so as to form a coaxial line path between the inner wall surface of the communication hole and the outer circumferential surface of the signal pin so that one end of the signal pin is electrically connected to a terminal of the first electrical component while the other end is electrically connected to a terminal of the second electrical component; and a holding member which holds the signal pin in the communication hole such that the outer circumferential surface of the signal pin is separated from the inner wall surface of the communication hole, wherein the characteristic impedance of a signal path formed by the signal pin in a first region where the signal pin is held by the holding member is smaller than a predetermined characteristic impedance which is a reference
    Type: Application
    Filed: June 29, 2018
    Publication date: June 24, 2021
    Inventors: Kazutaka KOSHIISHI, Keiichi NARUMI
  • Publication number: 20200366018
    Abstract: This electrical connection socket for relaying exchange of electrical signals between a first electrical component and a second electrical component, is provided with: a metallic casing which has a communication hole for communication between the upper surface and lower surface of the metallic casing, to the lower surface side of which the first electrical component is attached, and to the upper surface of which the second electrical component is attached; a signal pin which is disposed in the communication hole so as to be separated from the inner wall surface of the communication hole, one end of which is electrically connected to a terminal of the first electrical component, and the other end of which is electrically connected to a terminal of the second electrical component; an annular first holding member which is, in the upper region of the communication hole, press-fitted in the communication hole; and an annular second holding member which is, in the lower region of the communication hole, press-fitte
    Type: Application
    Filed: June 29, 2018
    Publication date: November 19, 2020
    Inventors: Kazutaka KOSHIISHI, Keiichi NARUMI
  • Publication number: 20200350716
    Abstract: An electric connection socket for relaying electric signals between a circuit substrate and an electric component includes: a metal housing which has a through hole enabling communication between the top surface and the bottom surface thereof, and on the top surface of which the electric component is mounted and on the bottom surface of which the circuit substrate is mounted; and a signal pin inserted into the through hole to configure a coaxial line between the inner wall surfaces of the through hole, and which is electrically connected at one end to a signal path pad electrode of the circuit substrate and is electrically connected at the other end to a signal path terminal of the electric component. The metal housing is arranged on the circuit substrate such that an air gap is formed between the bottom surface of the metal housing and the top surface of the circuit substrate.
    Type: Application
    Filed: June 29, 2018
    Publication date: November 5, 2020
    Applicant: Enplas Corporation
    Inventor: Keiichi NARUMI
  • Patent number: 9853380
    Abstract: An IC socket includes: a socket main body having an accommodating part for accommodating an IC package; a socket cover having a one-side end portion pivotally supported by the socket main body, and the other-side end portion which is located opposite to the one-side end portion and lockable to the socket main body; and a heat dissipating member mounted on the socket cover and caused to press the IC package. The socket cover includes a metal plate extending from the one-side end portion to the other-side end portion so that the thickness direction of the metal plate is parallel to the direction in which the socket cover faces the accommodating part when the other-side end portion is locked to the socket main body. The metal plate has a depression formed by bending the metal plate.
    Type: Grant
    Filed: December 24, 2014
    Date of Patent: December 26, 2017
    Assignee: ENPLAS CORPORATION
    Inventor: Keiichi Narumi
  • Publication number: 20160308293
    Abstract: An IC socket includes: a socket main body having an accommodating part for accommodating an IC package; a socket cover having a one-side end portion pivotally supported by the socket main body, and the other-side end portion which is located opposite to the one-side end portion and lockable to the socket main body; and a heat dissipating member mounted on the socket cover and caused to press the IC package. The socket cover includes a metal plate extending from the one-side end portion to the other-side end portion so that the thickness direction of the metal plate is parallel to the direction in which the socket cover faces the accommodating part when the other-side end portion is locked to the socket main body. The metal plate has a depression formed by bending the metal plate.
    Type: Application
    Filed: December 24, 2014
    Publication date: October 20, 2016
    Inventor: Keiichi NARUMI