Abstract: A rectifier and a vehicle AC generator that can suppress the cost, the rectification loss, and the leakage current from increasing are provided. A rectifier is configured in such a way that in each of n sets, one of a positive electrode side semiconductor device and a negative electrode side semiconductor device is a MOSFET, in such a way that in at least one of the n sets, the other one of the positive electrode side semiconductor device and the negative electrode side semiconductor device is a specific diode, and in such a way that the specific diode is a Schottky barrier diode or a MOS diode, which is a MOSFET whose drain terminal and gate terminal are short-circuited.

Abstract: An exhaust gas purification device including: a spray nozzle provided in an exhaust pipe of an engine; a mixer provided downstream of the spray nozzle in a flow direction of exhaust gas; and a catalyst reactor provided downstream of the mixer. The exhaust gas purification device is configured to spray a reducing agent from the urea water spray nozzle to the exhaust gas from the engine, to mix the reducing agent with the exhaust gas in the mixer, and to reduce nitrogen oxides in the exhaust gas using the catalyst reactor. The mixer includes a cylindrical body and a plurality of fins arranged in the cylindrical body radially outward with respect to the axis of the cylindrical body. The upstream portion of each fin is shaped to provide a cutoff portion.

Abstract: An object of the present invention is to provide a combustion chamber shape of a direct injection type diesel engine in which a black smoke generation amount can be suppressed during no-load operation while suppressing NOx and fuel consumption. The combustion chamber 5 is formed in a recessed shape in a piston top wall 3 and injecting fuel at a predetermined nozzle hole angle ? into the combustion chamber 5 from a nozzle hole 20 of a fuel injection valve having a nozzle hole center O1 substantially on a cylinder center line.

Abstract: An object of the present invention is to provide a combustion chamber shape of a direct injection type diesel engine in which a black smoke generation amount can be suppressed during no-load operation while suppressing NOx and fuel consumption. The combustion chamber 5 is formed in a recessed shape in a piston top wall 3 and injecting fuel at a predetermined nozzle hole angle ? into the combustion chamber 5 from a nozzle hole 20 of a fuel injection valve having a nozzle hole center O1 substantially on a cylinder center line.

Abstract: The present invention relates to an exhaust manifold for a supercharger-equipped internal combustion engine having multiple cylinders capable of preventing an increase in the fuel consumption and of reducing load application time. The engine satisfies at least one of the following expressions, where D is the diameter of a main tube of the exhaust manifold, d is the diameter of a branch tube, D1 is the diameter of a passage of a connection connecting the branch tube to the main tube, R is the radius in the outer peripheral side of the connection smoothly connecting the branch tube to the main tube of the exhaust manifold, and r is the radius in the inner circumference side. 1.2?(D/d)2 ?2.5, 0.8?(d/de)2?1.2, 0.7?(D/D1)2?1.4, 1.7?R/r?2.1.

Abstract: A diesel engine including a shallow-dish type combustion chamber on the top face of a piston. A fuel injection valve projects toward the combustion chamber, where a plurality of first nozzle holes are arranged in the same circumference of the fuel injection valve. A plurality of second nozzle holes having a diameter smaller than that of the first nozzle holes are provided in a circular side wall of the fuel injection valve, the circular side wall locating opposite to the tip part of the valve with respect to the first nozzle holes. The first nozzle holes and the second nozzle holes are staggered so that the sprays of the fuel ejected from the first nozzle holes and the second nozzle holes do no cross one another.

Abstract: A lead frame having a body with oppositely facing, substantially planar, first and second surfaces respectively facing in first and second directions and residing in first and second substantially parallel reference planes. The body defines a support for a semiconductor chip and a plurality of leads. The support has a third surface facing in the first direction to which a semiconductor chip can be mounted, and a fourth surface facing in the second direction. At least a part of the fourth surface is spaced from the second reference plane towards the first reference plane.

Abstract: The present invention provides sensitivity determining method for maintenance of an optical sensor system and sensitivity determining filter used therefor. An attenuation filter is disposed in a projected light area between a light projection unit and a light receiving unit of an optical sensor system, and in the case where the light receiving unit receiving a quantity reduced light transmitted through the attenuation filter outputs a signal indicative of light reception, a decision is made such that sensitivity of the optical sensor system is sufficiently high. On the other hand, in the case where the light receiving unit outputs signal indicative of insufficient light reception, a decision is made such that sensitivity of the optical sensor system is poor.

Abstract: A lead frame having a body with oppositely facing, substantially planar, first and second surfaces respectively facing in first and second directions and residing in first and second substantially parallel reference planes. The body defines a support for a semiconductor chip and a plurality of leads. The support has a third surface facing in the first direction to which a semiconductor chip can be mounted, and a fourth surface facing in the second direction. At least a part of the fourth surface is spaced from the second reference plane towards the first reference plane.

Abstract: A method is disclosed for constructing a dual-sided chip package onto a leadframe having a die pad and a set of lead fingers corresponding to the die pad. Integrated circuit dies are disposed onto each side of the die pad while the leadframe is supported with support blocks having cavities that accept the integrated circuit dies and that support each lead finger and that provide clearance for stitch bonds of the previously formed wire bonds. Thereafter, a one step plastic mold is formed around each assembly comprising the dual integrated circuit dies, the die pads, and the wire bonds.

Abstract: A method is disclosed for constructing a dual-sided chip package onto a leadframe having a die pad and a set of lead fingers corresponding to the die pad. Integrated circuit dies are disposed onto each side of the die pad while the leadframe is supported with support blocks having cavities that accept the integrated circuit dies and that support each lead finger and that provide clearance for stitch bonds of the previously formed wire bonds. Thereafter, a one step plastic mold is formed around each assembly comprising the dual integrated circuit dies, the die pads, and the wire bonds.